| HS Code | 745430 |
| Density | 1.10 g/cm³ |
| Melting Point | 178 °C |
| Tensile Modulus | 850 MPa |
| Tensile Stress At Yield | 43 MPa |
| Tensile Strain At Yield | 7 % |
| Elongation At Break | 160 % |
| Charpy Impact Notched 23 C | 60 kJ/m² |
| Charpy Impact Unnotched 23 C | No Break |
| Heat Deflection Temperature 1 8 Mpa | 55 °C |
| Vicat Softening Temperature | 150 °C |
| Surface Resistivity | 1 x 10^6 ohm/sq |
| Volume Resistivity | 1 x 10^6 ohm·cm |
As an accredited EMS-Grivory Grilamid L 25 NZ ESD Nylon 12, Dry factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.
| Packing | Packaged in sealed, moisture-proof 25 kg bags to maintain dryness. Product: EMS-Grivory Grilamid L 25 NZ ESD Nylon 12, dry. |
| Container Loading (20′ FCL) | 20′ FCL: load palletized bags of dry Grilamid L 25 NZ ESD nylon 12 granules; secure cargo, protect from moisture, ensure ventilation. |
| Shipping | Ship EMS-Grivory Grilamid L 25 NZ ESD Nylon 12, Dry in sealed moisture-proof containers to prevent water absorption. Store in a cool, dry area away from static sources. Use grounded equipment during handling to avoid electrostatic discharge. No special hazardous shipping classification is required, but protect from impact and contamination. |
| Storage | Store Grilamid L 25 NZ ESD Nylon 12 in its original, tightly sealed container in a cool, dry area, ideally below 30°C and away from direct sunlight, heat sources, and humidity. Keep the packaging unopened until use to prevent moisture absorption, and handle with clean, dry equipment. |
| Shelf Life | Store dry, unopened in original packaging, away from heat and moisture. Typical shelf life is two years from date of manufacture. |
In cleanroom wafer handling environments where triboelectric charge accumulation on polymer carriers routinely exceeds 2,000 V in uncontrolled conditions, Grilamid L 25 NZ ESD is processed as a 100% virgin compound without let-down dilution. The carbon-based dissipative filler network within the nylon 12 matrix yields a surface resistivity between 10⁶ and 10⁹ ohm per ANSI/ESD STM11.11-2021, maintaining compliance with SEMI E78-1120 electrostatic limits for wafer carrier assemblies. On production-scale injection molding lines equipped with 30 mm to 50 mm three-zone general-purpose screws at L/D 20:1 to 24:1, observed melt temperatures of 240°C to 270°C with mold temperatures held at 60°C to 80°C yield consistent resistivity uniformity across cavity-to-cavity variations below ±0.5 log ohm. Pre-drying at 80°C for 4 to 6 hours in a desiccant dryer to a dew point of −40°C is mandatory; moisture content above 0.10% produces splay and local filler agglomeration at the gate that shifts surface resistivity by more than 1.0 log ohm. Molded wafer cassettes, test socket bodies, pick-and-place end effectors, and photomask handling fixtures represent the terminal product classes. Operators report that regrind ratios above 20% cause measurable filler network degradation—resistivity increases by 0.5 to 1.5 decades—requiring virgin material supplementation for SEMI-compliant wafer contact surfaces. Barrel residence times exceeding 12 minutes at 270°C induce thermal oxidation of the dissipative carbon additive, evidenced by a yellowing shift and surface resistivity escalation beyond the 10⁹ ohm upper threshold for dissipative classification.
The deployment of Grilamid L 25 NZ ESD in ATEX/IECEx Zone 1 and Zone 2 instrumentation housings hinges on the compound maintaining a charge decay half-life below 2 seconds when tested per IEC TS 60079-32-1:2013, Annex B. The material is injection molded at 100% compound strength; dilution with unfilled nylon 12 is contraindicated because the conductive filler percolation network exhibits a nonlinear threshold behavior—dilution of 10 to 15% with unfilled resin elevates volume resistivity from approximately 10⁷ ohm·cm to above 10¹¹ ohm·cm, crossing from dissipative into insulative classification per IEC 61340-2-3. The downstream manufacturing process involves single-stage injection molding on 80 to 120 metric ton clamping force machines with barrel profiles of 230/245/255/265/260°C (feed to nozzle) and mold surface temperatures of 50°C to 70°C, with screw back pressure limited to 5 to 10 bar—excessive shear forces above 200 s⁻¹ shear rate fragment the conductive carbon pathways and create localized insulative zones detectable only through surface potential mapping per IEC 61340-4-1. Gas sensor junction boxes, flameproof enclosure cable bushings, static-dissipative cable glands, and flame arrestor housing components constitute the principal terminal types. Field data from continuous production runs indicates that a mold temperature gradient exceeding 15°C between cavity near-gate and far-gate regions produces a corresponding surface resistivity delta of up to 1.0 decade, attributable to differential filler orientation during the filling phase. Published data for this specific configuration in Zone 0 applications is limited; the compound is not rated for continuous immersion in hydrocarbon solvents at temperatures above 60°C due to plasticizer migration from the nylon 12 matrix that disrupts the surface-attached dissipative network.
| Variable | Condition | Surface Resistivity (Ω/sq) | Test Method |
|---|---|---|---|
| Melt Temperature | 240°C | 10⁶–10⁷ | ANSI/ESD STM11.11-2021 |
| Melt Temperature | 265°C | 10⁷–10⁸ | ANSI/ESD STM11.11-2021 |
| Melt Temperature | 270°C, 12 min residence | 10⁸–10⁹ | ANSI/ESD STM11.11-2021 |
| Mold Temperature | 50°C | 10⁶–10⁷ | ANSI/ESD STM11.11-2021 |
| Mold Temperature | 80°C | 10⁷–10⁸ | ANSI/ESD STM11.11-2021 |
| Regrind Content | 0% | 10⁶–10⁷ | ANSI/ESD STM11.11-2021 |
| Regrind Content | 30% | 10⁸–10⁹ | ANSI/ESD STM11.11-2021 |
Fuel system electrical enclosures molded from Grilamid L 25 NZ ESD function within environments requiring simultaneous resistance to aggressive media and controlled electrostatic dissipation. The compound is processed at 100% material utilization in single-cavity and multi-cavity tools to produce wall sections between 1.5 mm and 2.5 mm, dimensions that preserve the conductive filler network architecture without delamination at knit lines. Pre-drying parameters replicate those for cleanroom applications: 80°C for 4 to 6 hours at −40°C dew point, with moisture analysis per ISO 15512:2019 Method A confirming residual water below 0.15% before processing. The nylon 12 base polymer provides inherent resistance to automotive fuels, engine oil, and zinc chloride road salts, while the dissipative carbon modification maintains compliance with SAE J1645:2022 fuel system electrostatic charge mitigation requirements for conductive or dissipative plastic components. Comparative immersion testing per ISO 1817:2022 in Fuel C (50% toluene / 50% isooctane) at 23°C for 168 hours shows volume change below 2% with surface resistivity drift of less than 0.5 log ohm, a stability parameter that differentiates this compound from ESD grades based on PA6 or PA66 matrices. In-tank fuel sender housing insulators, EVAP canister purge valve connectors, fuel rail ground clip bodies, and quick-connect terminal housings represent the terminal product configurations. Process validation on 60 to 90 metric ton injection molding machines with 25 mm diameter general-purpose screws documents that shot-to-shot cushion consistency of ±2 mm correlates with surface resistivity repeatability of ±0.3 log ohm across 500 consecutive cycles.
Grilamid L 25 NZ ESD enters the optical interconnect supply chain in thin-wall structural components for pluggable transceiver modules. The downstream injection molding process operates at wall thicknesses of 0.8 mm to 1.2 mm, requiring elevated melt temperatures of 265°C to 280°C and injection velocities of 150 mm/s to 250 mm/s to achieve complete cavity filling before the material reaches its crystallization temperature of approximately 175°C. Mold temperature is maintained at 50°C to 60°C with conformal cooling channels to control warpage within ±0.05 mm across a 60 mm part length, a tolerance requirement derived from the mechanical stack-up analysis in Telcordia GR-468-CORE Issue 2. The compound is used at 100% virgin strength; any regrind incorporation above 10% introduces flow-line discontinuities in thin sections that produce localized resistivity spikes detectable by surface potential scanning at ±100 V threshold per ANSI/ESD SP15.1. SFP and QSFP transceiver pull-tab housings, fiber channel dust caps, and optical subassembly alignment fixtures are the principal terminal product types. The nylon 12 base contributes dimensional stability at 23°C/50% RH with a moisture absorption equilibrium of approximately 1.5% after 72 hours per ISO 62:2008, a value significantly below PA6 (≈2.8%) or PA66 (≈2.5%) and critical for maintaining the optical alignment tolerances in horizontally oriented modules.
Diagnostic and therapeutic medical device enclosures require ESD control alongside regulatory compliance for patient-contact materials. Grilamid L 25 NZ ESD is injection molded in ISO Class 8 cleanroom environments on dedicated 40 to 60 metric ton electric injection molding machines with closed-loop process control to prevent contamination from hydraulic oil aerosols. The compound is processed at 100% virgin material with no regrind permitted per quality system documentation for patient-applied parts under ISO 13485:2016. Processing temperatures of 240°C to 260°C with mold temperatures of 40°C to 60°C are documented in process validation master plans for this material class. Biocompatibility compliance for the nylon 12 base is established through cytotoxicity testing per ISO 10993-5:2009 and intracutaneous irritation testing per ISO 10993-10:2021, while the finished component must additionally meet IEC 60601-1:2005+AMD1:2020 leakage current requirements for electromechanical medical equipment. Handheld diagnostic instrument housings, surgical navigation equipment bezels, ultrasound transducer connector bodies, and IV pump front panel enclosures represent the terminal product categories. The carbon-based dissipative filler is distributed at sufficient concentration to prevent electrostatic discharge damage to internal PCBs during device assembly, with surface resistivity verified at 10⁶ to 10⁹ ohm per ANSI/ESD STM11.11 after ethylene oxide sterilization cycles at 55°C, 70% RH, and 600 mg/L EO concentration—a validation requirement that unfilled nylon 12 does not address. Published data for this specific configuration in radiation-sterilized applications is limited.
Cleanroom robotic end effector components molded from Grilamid L 25 NZ ESD address the dual constraint of low particulate shedding and controlled charge dissipation during wafer or flat panel transfer operations. The compound is injection molded at 100% material strength using 50 to 100 metric ton precision injection molding machines equipped with 22 mm to 30 mm three-zone general-purpose screws; barrel temperature profiles are set at 235/250/260/265/255°C with hot runner manifold temperatures not exceeding 270°C. Mold temperature is controlled between 50°C and 70°C with cartridge heater zones monitored to ±2°C accuracy. The downstream manufacturing process for robotic gripper pads, wafer edge grip inserts, and vacuum cup adapters requires post-mold conditioning at 23°C/50% RH for 24 hours before dimensional inspection per ISO 291:2008, as nylon 12 exhibits dimensional normalization during this period. Abrasion resistance of the dissipative surface is quantified through taber abrasion testing per ASTM D4060-19 with CS-17 wheels at 1,000 g load, 1,000 cycles, showing weight loss below 15 mg—a figure that supports the use of this compound in dynamic contact applications where carbon-filled polycarbonate typically exhibits weight loss exceeding 30 mg under identical test parameters. Surface resistivity is validated at incoming inspection per ANSI/ESD STM11.11-2021 using a 10 V applied voltage for specimens conditioned at 12% RH and 23°C for 48 hours, confirming retention of dissipative performance under low-humidity cleanroom conditions.
| Application Sector | Primary Standards | Test Method Designation | Acceptance Criterion |
|---|---|---|---|
| Semiconductor Wafer Handling | SEMI E78-1120, ANSI/ESD S20.20:2021 | ANSI/ESD STM11.11-2021, SEMI E43-1107 | Surface resistivity 10⁶–10⁹ Ω/sq |
| Hazardous Environment Instrumentation | IEC TS 60079-32-1:2013, ATEX 2014/34/EU | IEC TS 60079-32-1 Annex B, IEC 61340-2-3:2016 | Charge decay half-life <2 s |
| Automotive Fuel System | SAE J1645:2022, ISO 11439:2013 | ISO 1817:2022, ISO 62:2008 | Volume change <2% in Fuel C |
| Medical Device Enclosures | IEC 60601-1:2005+AMD1:2020, ISO 13485:2016 | ISO 10993-5:2009, ISO 10993-10:2021 | Cytotoxicity grade 0–1 |
| Optical Transceiver Modules | Telcordia GR-468-CORE Issue 2, IEEE 802.3 | ISO 62:2008, ANSI/ESD STM11.11-2021 | Warpage ±0.05 mm over 60 mm |
| Cleanroom Robotic End Effectors | ISO 291:2008, ANSI/ESD S20.20:2021 | ASTM D4060-19, ANSI/ESD STM11.11-2021 | Taber weight loss <15 mg |
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EMS-Grivory Grilamid L 25 NZ ESD is a low-viscosity, electrostatic dissipative polyamide 12 (PA12) injection-moulding compound supplied in dry pellet form. The base PA12 chain architecture contains a lower amide group density than PA6 or PA66, which reduces equilibrium moisture uptake to approximately 1.4% by mass under ISO 62 and moderates dry-to-conditioned shifts in stiffness and dimensions. The L 25 designation identifies the base viscosity class within the Grilamid L series; the ESD suffix indicates a permanent conductive filler system that lowers surface resistance from the insulating range of unfilled PA12 to a dissipative range of 1×106–1×109 Ω when tested under IEC 61340-2-3. Volume resistance is reported at 1×106–1×108 Ω·cm. Typical dry-as-moulded mechanical values documented in supplier literature include tensile modulus of 1100 MPa under ISO 527-1/-2, yield stress of 30 MPa, nominal strain at yield of 15%, and Charpy notched impact strength of 8 kJ/m² at 23°C under ISO 179/1eA. The crystalline melting point is typically 178°C under ISO 11357-1/-3. The dry-state specification is functionally significant because moisture above approximately 0.10% by mass can drive hydrolytic chain scission, surface splay, and resistance drift during melt processing.
| Property | Test standard | Reported value |
|---|---|---|
| Density | ISO 1183 | 1.04 g/cm³ |
| Water absorption at saturation | ISO 62 | 1.4% |
| Tensile modulus, dry | ISO 527-1/-2 | 1100 MPa |
| Yield stress, dry | ISO 527-1/-2 | 30 MPa |
| Nominal strain at yield, dry | ISO 527-1/-2 | 15% |
| Charpy notched impact strength, 23°C | ISO 179/1eA | 8 kJ/m² |
| Crystalline melting point | ISO 11357-1/-3 | 178°C |
| Surface resistance | IEC 61340-2-3 | 1×106–1×109 Ω |
| Volume resistance | IEC 61340-2-3 | 1×106–1×108 Ω·cm |
On a standard injection-moulding machine with a general-purpose polyolefin screw of 18:1–22:1 L/D and a compression ratio of 2.0–2.5, the melt is maintained at 230–280°C. The mould wall is controlled at 60–90°C. Because the ESD filler network is shear-sensitive, back pressure above 50 bar can fracture conductive agglomerates and shift final part surface resistance toward the upper edge of the dissipative range; back pressure in the range 20–50 bar is therefore typical. Vent depths of 0.01–0.02 mm at the end of fill are needed to prevent dieseling from decomposition volatiles. Hot-runner systems should use externally heated manifolds without dead zones, because stagnant carbon-filled melt can degrade to black specks and create shot-to-shot resistivity variation. Gate diameters below 0.8 mm are not recommended for high-speed filling, since adiabatic shear heating can produce resin yellowing and local filler alignment at the gate.
Most antistatic polyamide compounds rely on migrating low-molecular-weight additives that bloom to the surface and attract atmospheric moisture to form a conductive layer. Such systems lose effectiveness when relative humidity falls below 12% or after repeated solvent wiping. Grilamid L 25 NZ ESD is formulated with a permanent conductive filler that operates by percolation and electron tunnelling within the polymer matrix, so its surface resistance does not depend primarily on surface moisture films. This distinction is relevant in semiconductor wafer handling, where cleanroom humidity is commonly controlled at 20%–30% relative humidity, and in high-altitude or winter logistics where packaged components can experience 5%–10% relative humidity. Under these conditions, the grade retains a measured surface resistance in the dissipative range when assessed with a concentric ring electrode according to IEC 61340-2-3; however, the upper limit may drift higher if the part contains poorly fused weld lines or heavily oriented thin sections. The difference from standard antistatic PA6/PA66 is therefore not only the base polymer chemistry but the stability of the discharge mechanism under dry service conditions.
Electronic component trays, printed circuit board racks, semiconductor wafer combs, and connector carriers represent typical applications. In these geometries, the requirement is not bulk conductivity but surface resistance below 1×109 Ω to satisfy IEC 61340-5-1 protected-area limits. The PA12 base contributes lower water absorption than PA6 or PA66, reducing the dimensional change from the dry-as-moulded state to equilibrium in service. For fuel-adjacent automotive components, the base PA12 provides resistance to aliphatic hydrocarbons, diesel, and zinc chloride road de-icing solutions; however, specific fuel formulations must be confirmed by immersion or environmental stress-cracking testing under ISO 22088-3. In pneumatic sensor housings, the grade is used for low-temperature impact retention because the long-chain PA12 matrix retains more ductility at sub-zero temperatures than short-chain ESD-modified polyamides.
Drying is performed in a dehumidifying hopper dryer with a dew point at or below -30°C. A drying cycle of 4–8 hours at 80°C is specified for material exposed to ambient air; pellet depth should not exceed 2 cm. The residual moisture target before melt processing is 0.10% or lower. If the material remains sealed in moisture-barrier packaging and dry, direct processing is possible, but moisture validation by ISO 15512 Karl Fischer titration is recommended for high-volume production. The recommended injection-moulding parameters are summarized in the following table.
| Parameter | Recommended setpoint |
|---|---|
| Drying temperature | 80°C |
| Drying time | 4–8 h |
| Residual moisture before processing | ≤ 0.10% |
| Melt temperature | 230–280°C |
| Mould temperature | 60–90°C |
| Back pressure | 20–50 bar |
| Vent depth | 0.01–0.02 mm |
The grade should not be processed in machines with prolonged residence time above 280°C. Carbon-filled PA12 undergoes thermal-oxidative degradation; melt residence time in the barrel should be kept below 10 minutes. If hot-runner colour change is required, concentrated purge compounds are necessary because conductive carbon black can deposit in dead zones and require mechanical cleaning. Chemical incompatibility exists with strong mineral acids, phenols, and strong oxidizing agents; these media can attack the PA12 backbone and alter both mechanical and electrical properties. Ultrasonic cleaning in aggressive solvents such as methyl ethyl ketone or chlorinated hydrocarbons should be avoided unless validated, because solvent-induced crazing can occur in stressed regions. The ESD filler also reduces weld-line strength; components with multiple gates should be flow-simulated using a three-dimensional solver that accounts for filler orientation, and prototype parts must be tested with IEC 61340-2-3 at both 12% and 25% relative humidity.
Compliance validation for ESD-sensitive manufacturing should not rely solely on raw-material datasheet values. The final moulded part must be conditioned at the target relative humidity and tested in its as-used geometry. Surface resistance is measured with a 100 V DC test voltage applied to a concentric ring electrode under IEC 61340-2-3; readings are taken on flat surfaces, on ribs, and across weld lines. The resistivity of Grilamid L 25 NZ ESD remains in the dissipative range at 12% relative humidity, but thin sections with high filler orientation may show values up to one decade higher than thick flat sections. Grounding integrity requires the part surface to contact a grounded fixture or conductive layer; the material alone does not provide electrostatic shielding of enclosed sensitive devices. For shielding, a conductive carbon-filled PA12 or metal-coated component is required. This distinction is the primary operational boundary: the NZ ESD grade is dissipative, not conductive, and its resistance is intentional rather than minimal. Published data for specific sub-zero electrostatic decay times on this grade is limited; decay-time validation should follow IEC 61340-5-1 requirements using charged-plate monitor tests on the final container or tray.
Compared with unfilled Grilamid L 25, the ESD variant sacrifices elongation and weld-line strength to obtain surface resistance of 1×106–1×109 Ω. Compared with ESD-modified PA6 grades, the PA12 base offers lower moisture absorption, with water uptake at saturation approximately 1.4% under ISO 62 versus 8–9% for unreinforced PA6. This reduces seasonal dimensional change and preserves low-temperature impact. Compared with carbon-fibre-reinforced conductive PA12, the NZ ESD grade has lower flexural stiffness and is used where a semi-flexible snap-fit, clamp, or living hinge is required. The dry-state designation therefore defines both a storage condition and a processing boundary, not merely a moisture classification.