| HS Code | 999655 |
| Density | 1.08 g/cm³ |
| Tensile Modulus | 1700 MPa |
| Tensile Strength At Break | 38 MPa |
| Elongation At Break | 100% |
| Notched Charpy Impact Strength 23 C | 10 kJ/m² |
| Melting Point | 178 °C |
| Heat Deflection Temperature 1 80 Mpa | 45 °C |
| Heat Deflection Temperature 0 45 Mpa | 145 °C |
| Surface Resistance | 1 × 10⁶ Ω |
| Volume Resistivity | 1 × 10⁷ Ω·cm |
| Water Absorption | 1.5% |
| Flammability Rating Ul94 | HB |
As an accredited EMS-Grivory Grilamid L 25 NZ ESD Nylon 12, Conditioned factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.
| Packing | Packaged in sealed, moisture-resistant 25 kg bags, conditioned for optimal handling and electrostatic dissipative performance. |
| Container Loading (20′ FCL) | 20′ FCL container loading of conditioned EMS-Grivory Grilamid L 25 NZ ESD Nylon 12, packed in sealed bags on pallets for safe transport. |
| Shipping | Ship as conditioned nylon 12 granules in sealed moisture-barrier bags or approved containers. Protect from dampness, heat, and mechanical damage. No dangerous goods classification for routine transport. Keep upright and avoid static ignition sources; store in a cool, dry area until use. |
| Storage | Store in original sealed container in a cool, dry area away from direct sunlight and heat sources. Maintain low humidity, as Nylon 12 can absorb moisture, altering conditioned properties. Avoid electrostatic accumulation by using grounded handling procedures. Keep containers tightly closed when not in use. Ensure proper ventilation and protect from physical damage. |
| Shelf Life | Store in original, sealed packaging in a cool, dry place. Shelf life is two years from production date when properly conditioned. |
In semiconductor back-end wafer transport, EMS-Grivory Grilamid L 25 NZ ESD is processed as a permanently static-dissipative polyamide 12 compound for wafer carriers, reticle storage trays and end-effector contact pads. The application requires surface resistivity between 1×106 Ω and 1×109 Ω as measured by IEC 61340-2-3, with compliance to SEMI E78, ANSI/ESD S20.20-2021 and IEC 61340-5-1:2016 for protected-area grounding and equipment electrostatic compatibility. Addition ratio is 100 wt% neat pellet feed; the compound is not a masterbatch and no external antistat coating is applied. Regrind from sprues and runners is limited to 10–15 wt% in ESD-critical lots because weld lines formed at regrind-rich melt fronts produce localized surface resistivity above 1×109 Ω. Pre-drying is performed at 80 °C in a dehumidifying dryer to a residual moisture content below 0.10 wt%; processing at moisture above 0.15 wt% causes splay and hydrolysis-induced molecular weight loss. Melt temperature is held at 240–270 °C, mold temperature at 40–80 °C, back pressure at 60–100 bar, and injection speed at 100–200 mm/s on a conventional three-zone screw with L/D 18–22. Gate design uses direct or tab gates of at least 1.0 mm wall thickness because point gates smaller than 0.8 mm induce excessive shear heating and carbon-rich skin delamination. Terminal products include 150 mm, 200 mm and 300 mm wafer shippers, process cassettes, reticle storage trays and end-effector contact pads used in semiconductor front-end automation.
External antistat coatings fail on printed circuit board assembly fixtures because aqueous wash cycles remove the surface-active monolayer and cause surface resistivity to recover above 1×1012 Ω within 10–20 wash cycles. Grilamid L 25 NZ ESD, in contrast, uses a bulk carbon-based dissipative network that remains after machining and washing. Compliance for PCB handling fixtures follows ANSI/ESD S20.20-2021 and ANSI/ESD STM11.11-2021; resistance-to-ground values from the fixture to the workstation bus must stay between 1×106 Ω and 1×109 Ω. Addition ratio is 100 wt% neat resin; if a color concentrate is required, the let-down is capped at 2 wt% and post-molding surface resistance mapping is mandatory because colorant dilution displaces conductive pathways. Because the dissipative mechanism is carbon-based, the compound is supplied only in black; light-color ESD requirements must use an inherently dissipative polymer, not a colorant-lightened formulation. Processing uses injection molding with direct edge gates or fan gates; wall thickness below 1.0 mm is avoided in load-bearing PCB frames because shear-induced filler alignment parallel to flow lowers through-plane conductivity. Pre-drying at 80 °C to below 0.10 wt% moisture, melt temperature 240–270 °C, and mold temperature 40–60 °C are typical. Terminal products include SMT feeder lanes, ESD worktable locators, PCB loading frames, test sockets and burn-in board carriers. The material is not specified for direct contact with molten solder or wave pallet fixtures because the heat deflection temperature of unstiffened PA12 is below 60 °C under 1.82 MPa per ISO 75-2; such applications require a high-temperature ESD polymer instead.
Because bulk powder transfer operations in gas and dust atmospheres generate surface charge densities above 20 μC/m² on nonconductive polymer components, carbon-filled PA12 is specified for rotary valve liners, filter plates, venturi bodies and fluidized bed wear strips. The compliance framework for this scenario is ATEX 2014/34/EU for equipment used in potentially explosive atmospheres, IEC 60079-0:2017 for general requirements, and IEC TS 60079-32-1:2013 for electrostatic hazards. The relevant measured property is surface resistance below 1×109 Ω on conditioned specimens tested at 23 °C and 50 % RH per IEC 61340-2-3; this avoids propagating brush discharges from insulating surfaces. Addition ratio remains 100 wt% neat compound; no additional conductive carbon black, carbon nanotubes or antistatic additive is compounded on site because uncontrolled filler addition can drive surface resistance below 1×105 Ω, converting the part from static-dissipative to conductive classification and altering the equipment grounding design. For flame-exposed or pressure-loaded parts, regrind is limited to 10 wt% and only from lots with certified surface resistance. Downstream production comprises injection molding or extrusion of thick plate and rod stock, followed by CNC machining to final rotary valve geometry. Machined surfaces must be re-dried before electrical verification because coolant absorbed into the machined ESD layer shifts surface resistivity readings for up to 48 h after exposure. Drying at 80 °C to 0.05–0.10 wt% moisture is mandatory; processing at melt temperature 230–260 °C and mold temperature 50–80 °C preserves dimensional stability after conditioning. Terminal products include rotary valve housings and liners, filter cage plates, powder transfer elbows and fluidized bed cleanout covers.
Automotive fuel vapor management and liquid fuel quick connectors require polyamide 12 because equilibrium moisture absorption at 23 °C and 50 % RH is below 1.0 wt%, resistance to zinc chloride road salt is retained under 60 °C stress testing, and dimensional stability in underhood thermal cycling is sufficient for snap-fit retention. For conductive ESD variants, the relevant specifications include SAE J2044 for quick-connect coupling performance and SAE J1645 for fuel system electrostatic charge mitigation; OEM-specific surface resistivity limits are typically between 1×104 Ω and 1×106 Ω, depending on the fuel line architecture. Addition ratio: the component is molded from 100 wt% conditioned, moisture-stabilized granules; regrind from connector bodies is limited to 15 wt% after sorting and drying, and is not permitted in snap-fit latching zones because regrind-induced viscosity shifts alter latch deflection and sealing force. The downstream manufacturing process is multi-cavity hot-runner injection molding with valve-gated hot drops of 0.8–1.2 mm, melt temperature 250–280 °C, mold temperature 60–80 °C, and cooling time of 8–15 s depending on wall thickness. Post-molding conditioning per ISO 291 at 23 °C and 50 % RH is necessary before electrical verification because surface resistivity can shift from dry-as-molded values. Terminal products include quick-connect couplings, evaporative emission canister valve bodies, fuel tank sender flanges and vapor line clips. Continuous fluid contact above 80 °C in alcohol-rich fuel blends containing more than 20 vol% ethanol requires validation against the specific fuel blend, because published data for this exact conductive grade in high-ethanol fuel is limited.
When conveyor rollers carry populated printed circuit boards through an ionizing blower corridor, the roller body must dissipate charge without transferring voltage spikes to the board. Surface-coated elastomer rollers generate particulate contamination after 5,000–10,000 cycles, whereas a bulk-dissipative PA12 insert retains surface resistivity between 1×106 Ω and 1×109 Ω after wear. Compliance is governed by ANSI/ESD S20.20-2021 and IEC 61340-5-1:2016; periodic verification uses ANSI/ESD STM11.11-2021 at 10 V and 100 V measurement bias. Addition ratio: the roller bodies and chain guide rails are molded from 100 wt% neat PA12 ESD compound; regrind is limited to 20 wt% for noncritical guide rail sections but reduced to 10 wt% for roller contact surfaces because repeated shear history increases surface resistance variability by more than one order of magnitude. Downstream production uses injection molding with cold-runner sprue gates into stationary cores for roller bodies, followed by press-fitting of stainless steel ball bearings. Drying at 80 °C to 0.08 wt% maximum moisture, melt temperature 240–270 °C, mold temperature 50–70 °C. Terminal products include ESD conveyor rollers, chain guide rails, accumulation stops, and low-load timing gears used in PCB assembly and flat-panel display handling.
Analytical instrument enclosures that contain heated optical stages, photomultiplier detectors or mass spectrometers require controlled static decay to prevent dust attraction and signal drift. A sprayed antistatic coating on ABS or polycarbonate is often rejected because solvent adhesion and outgassing contaminate optical windows. The ESD PA12 grade is specified for the inner structural frame, plenum cover and sample tray guide because it is permanently dissipative and can be injection molded into thin ribs of 0.8 mm wall thickness without secondary coating. The relevant compliance standards are IEC 61340-5-1:2016 for ESD-protected areas, IEC 61340-2-3 for surface resistance measurement, and IEC 61010-1:2010 for laboratory equipment electrical safety. Addition ratio is 100 wt% neat resin; regrind at 15 wt% maximum is accepted for non-appearance surfaces, but not for optical baffle edges because outgassing and surface roughness increase light scatter. Injection molding is the primary downstream process; due to long flow lengths in a 450 mm housing, melt temperature is raised to 260–280 °C, mold temperature 60–80 °C, and sequential valve gating is used to prevent flow hesitation at the thin plenum wall. Post-molding conditioning at 23 °C and 50 % RH for 48–72 h stabilizes dimensions before assembly. Terminal products include benchtop analyzer structural frames, detector housings, sample tray guides and static-dissipative service panels.
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EMS-Grivory Grilamid L 25 NZ ESD, supplied as black granules under the designation black 9287, is a semi-crystalline polyamide 12 injection-moulding compound modified with a conductive carbon-based filler network. The ESD suffix refers to electrostatic-dissipative behaviour intended for components handled in electrostatically protected areas. In the conditioned state, defined for this grade as equilibrium at 23 °C and 50 % relative humidity according to ISO 291, absorbed water plasticises the polyamide matrix, reducing tensile modulus and yield stress while increasing ductility relative to the dry-as-moulded condition. The product is specified for injection-moulded wafer cassettes, printed circuit board handling trays, connector housings, and electronic equipment covers where static discharge, dust attraction, and triboelectric charging must be controlled. Conductive carbon black gives the material permanent electrostatic-dissipative behaviour rather than a migratory antistatic effect, but it also restricts natural colour, lowers notched impact strength, and makes electrical properties sensitive to melt-processing history. Polyamide 12 has a low coefficient of friction and good abrasion resistance, but moving polymer parts can generate triboelectric charge. The conductive network provides a charge-dissipation path when the part is grounded through conductive contact points or conductive flooring as specified in IEC 61340-5-1. The surface resistance of the polymer is not a replacement for grounding but a method of controlling charge mobility.
Conditioned data reported in supplier literature show tensile modulus in the range 1400–1600 MPa when tested according to ISO 527-1/-2 at 1 mm/min. Yield stress falls to approximately 35–45 MPa while nominal strain at break remains above 50 %, reflecting the inherent ductility of the polyamide 12 backbone. Notched Charpy impact at 23 °C, measured by ISO 179-1/1eA, is typically reported above 10 kJ/m²; at −30 °C the value is lower, which places design limits on snap-fit arms and thin-wall corners exposed to impact. Density by ISO 1183-1 is approximately 1.04–1.08 g/cm³, with carbon black raising the value slightly above unfilled PA12. Moisture absorption at saturation is low compared with PA6 and PA66 because the C12 monomer contains a long methylene sequence; at 23 °C and 50 % relative humidity the moisture content is approximately 0.6–0.8 % by mass, and at full water immersion saturation it does not normally exceed 1.5 %. Electrical resistance is commonly checked by IEC 62631-3-2 and IEC 62631-3-1. Supplier-published surface resistance is below 106 Ω/sq, and volume resistivity is below 104 Ω·cm, with well-dispersed mouldings sometimes reading below 102 Ω·cm.
| Property | Test standard | Conditioned value range |
|---|---|---|
| Density | ISO 1183-1 | 1.04–1.08 g/cm³ |
| Tensile modulus | ISO 527-1/-2 | 1400–1600 MPa |
| Yield stress | ISO 527-1/-2 | 35–45 MPa |
| Nominal strain at break | ISO 527-1/-2 | >50 % |
| Charpy notched impact, 23 °C | ISO 179-1/1eA | >10 kJ/m² |
| Moisture content, 23 °C/50% RH | ISO 62 | 0.6–0.8 % |
| Surface resistance | IEC 62631-3-2 | <106 Ω/sq |
| Volume resistivity | IEC 62631-3-1 | <104 Ω·cm |
The melting point measured by differential scanning calorimetry under ISO 11357-3 is approximately 175–180 °C. The heat deflection temperature under ISO 75-2/B at 0.45 MPa is approximately 130–140 °C, while HDT/A at 1.8 MPa remains near 50–55 °C for the conditioned state. These thermal limits position the grade below PPS or PEEK ESD compounds, which are used when continuous service temperatures exceed 200 °C. Chemical resistance follows PA12 behaviour: the material resists aliphatic hydrocarbons, oils, greases, and diluted alkalis, but strong mineral acids and polar solvents can cause stress cracking or hydrolysis. In ESD applications exposed to cleaning agents, compatibility tests per ISO 22088-3 or ISO 175 should be performed because surface crazing may alter the conductive network and increase surface resistance.
At the feed throat of a dehumidifying hopper dryer, residual moisture must be reduced to ≤0.10 % before melting. The supplier-recommended drying condition is 80 °C for 4–6 h in a dry-air dryer with a dew point of ≤−30 °C; hopper residence time should not exceed 12 h because prolonged heating can oxidise the conductive carbon surface and shift surface resistance upward. A three-zone general-purpose screw with L/D between 18:1 and 22:1 and compression ratio between 2.0:1 and 2.5:1 is recommended for homogenising the filler without destructive shear. At the nozzle the melt temperature is normally set between 220 °C and 260 °C, and the mould surface temperature is maintained between 40 °C and 80 °C. Back pressure is kept in the range 3–8 MPa, and screw surface speed is limited to 0.1–0.3 m/s to minimise carbon-black network damage. When a vented barrel is used, vacuum of −0.08 MPa is typical; without a vent, correct drying is essential. Mould temperature influences crystallinity and surface appearance. At the lower end of the recommended mould-temperature range, cooling is rapid and the surface may show a lower crystalline fraction, which can increase resistivity and reduce dimensional stability after conditioning. At 80 °C, part shrinkage becomes more uniform but cycle time increases. Measured mould shrinkage for the ESD grade is usually supplied as 0.8–1.1 % in the flow direction and 0.9–1.2 % perpendicular; cavity dimensions should be adjusted accordingly. Use of more than 20 % regrind is not recommended without qualification because repeated heat history and carbon-black dispersion loss can shift resistance and reduce impact strength.
| Process parameter | Set range | Critical limit |
|---|---|---|
| Drying temperature | 80 °C | ≤90 °C |
| Drying time | 4–6 h | ≤12 h |
| Melt temperature | 220–260 °C | ≤270 °C |
| Mould temperature | 40–80 °C | ≥30 °C |
| Back pressure | 3–8 MPa | ≤10 MPa |
| Residence time in barrel/hot runner | <10 min | — |
Melt-viscosity behaviour of the conditioned ESD product is shear-thinning, and spiral-flow length increases visibly as melt temperature moves from 220 °C to 260 °C. Because the conductive filler network does not re-knit across weld lines, pin-gated trays and multi-gate covers show higher surface resistance at weld bands than in bulk sections. In production, gate positions are selected so that weld lines fall in non-critical areas, or melt temperature is held at the upper end of the permitted range to promote molecular diffusion. Residence time in the barrel and hot runner should be kept below 10 min; dead spots in valve gates or hot-runner tips can generate resistive skins due to thermal degradation. The electrical cliff-edge is often non-linear: a contaminated regrind fraction of only 5 % of unfilled non-conductive PA12 can raise surface resistance above 109 Ω/sq, moving the part outside the ESD window. Thin walls below 1.0 mm also tend to freeze before adequate carbon-black network formation, producing local surface resistance above the nominal value.
Field monitoring of production moulding lines shows that holding pressure between 60 and 80 MPa improves flatness in tray applications without lowering volumetric conductivity, provided the gate freezes before pressure is released. In a documented failure mode, excessive screw recovery speed raised melt temperature by frictional heating, caused carbon-black degradation, and produced surface striations with local resistance above 107 Ω/sq. This condition is avoided by controlling screw speed and using a reverse profile if melt override exceeds 270 °C.
Because the conductive filler acts as a stress concentrator, Grilamid L 25 NZ ESD has lower notched impact strength than unfilled Grilamid L 25. Design of snap-fit features should maintain a minimum corner radius of 0.5 mm and avoid knit lines at the base of flexible arms. Wall thickness should be held between 1.5 mm and 3.0 mm; step transitions should not exceed 25 % of the adjacent wall thickness. Compared with ESD-modified PA66, the PA12 grade absorbs less moisture, shows greater dimensional stability, and retains more low-temperature toughness after conditioning. Compared with carbon-nanotube-filled ESD thermoplastics, the carbon-black version is generally lower in cost but more notch-sensitive and available only in black. Compared with surface-coated plastic housings, the integral ESD network eliminates paint or vacuum-metallised layers that can delaminate and become particulate contamination in ISO 14644-1 cleanrooms. Another distinction from unfilled Grilamid L 25 is dimensional response to humidity. A moulded part conditioned from dry to 23 °C/50 % RH may change linear dimension by less than 0.2 %; a PA66 equivalent may change by 0.5–0.6 %. This dimensional stability is advantageous in tight-pitch connector sockets and robotic end-effector carriers where clearance tolerances are below 0.1 mm.
Within an electrostatically protected area controlled to IEC 61340-5-1, a moulded part is usually evaluated for surface resistance at 100 V DC after conditioning at 23 °C and 50 % relative humidity for 48 h. A shielded concentric ring electrode conforming to IEC 62631-3-2 is used, and measurements are taken after 15 s electrification. The material can be specified for trays, tote boxes, and machine guards where the charge decay from 1,000 V to 100 V is required in less than 2 s; however, each part geometry must be validated because shielding, wall thickness, and weld-line placement influence the measured resistance. Incoming resin lots should be tested for melt flow rate by ISO 1133-1 or melt volume-flow rate by ISO 1133-2 at 235 °C with 2.16 kg load if supply-chain consistency is a concern. Variation in melt viscosity indicates a change in polyamide molecular weight or filler dispersion. A lot with unusually high melt flow can mould more easily but may have lower impact strength and higher surface resistance; a lot with unusually low melt flow may require higher melt temperature but risks shear-induced filler breakdown. The conductive filler content is not adjustable at the press, so process discipline is the primary method for maintaining compliance. The product is intended for indoor ESD-protected environments, not for continuous outdoor exposure or continuous hot-water service above 80 °C. It is not automatically compliant with ATEX 2014/34/EU requirements for explosive atmospheres; ignition hazard assessment per EN 60079-0 or EN 60079-11 is required before use in Zone 1 or Zone 21. REACH and RoHS status should be verified from the supplier safety data sheet and technical datasheet. Painting, hot-stamping, or adhesive bonding can create an insulating surface layer that raises surface resistance above the ESD limit; where sealing is required, the gasket or label must not cover the primary charge-transfer path.
