| HS Code | 951214 |
| Appearance | Clear, transparent liquid |
| Curedcolor | Clear/transparent |
| Waterresistance | Water-resistant |
| Liquiddensity | 1.12 g/cm³ at 25°C |
| Viscosity | 250 cps at 30°C |
| Criticalexposure | 11.8 mJ/cm² |
| Penetrationdepth | 0.14 mm |
| Tensilestrength | 54 MPa |
| Tensilemodulus | 2,400 MPa |
| Elongationatbreak | 15% |
| Flexuralstrength | 78 MPa |
| Flexuralmodulus | 2,300 MPa |
| Hardness | 82 Shore D |
| Heatdeflectiontemperature | 55°C at 0.45 MPa; 50°C at 1.82 MPa |
| Glasstransitiontemperature | 60°C |
| Waterabsorption | 0.35% |
| Dielectricconstant | 3.2 at 1 MHz |
| Dielectricstrength | 15 kV/mm |
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DSM Somos WaterShed XC 11122 is a liquid photopolymer formulated for vat photopolymerization stereolithography platforms operating in the 355 nm solid-state laser range. The material is supplied as a clear-to-translucent resin and is specified for applications where reduced moisture uptake and dimensional stability in humid environments are controlling requirements. Unlike general-purpose clear SLA resins selected primarily for optical prototyping, the XC 11122 grade is positioned around a water-resistant property set that includes a supplier-reported water absorption value of 0.35% under ASTM D570-98 and a tensile modulus of approximately 2280 MPa under ASTM D638-14. These values are extracted from the manufacturer’s published technical data sheet for the 11122 formulation and represent conditioned, post-cured test specimens rather than green-state or minimum specification values.
In vat photopolymerization cells using recoater blades and heated resin baths, the low viscosity of WaterShed XC 11122 supports consistent film formation at typical processing temperatures. The supplier-reported viscosity is approximately 260 mPa·s at 30 °C. On platforms such as the 3D Systems Viper Si2 or iPro 8000, vat heating to a setpoint near 30 °C reduces the risk of recoater drag and incomplete wetting between layers. If processing occurs below 25 °C, the increase in dynamic viscosity may produce surface defects on down-facing surfaces and increase build failure rates. Production settings therefore require thermal control of the resin bath rather than relying on ambient room temperature alone. Layer thicknesses between 0.10 mm and 0.15 mm are common for this resin class, but published machine-specific exposure parameters should be obtained from the current supplier process note because exact laser dose and border overcure values are not fully disclosed in the general datasheet.
The mechanical performance envelope is defined by standardized tensile, flexural, and thermal tests. Table 1 consolidates supplier-reported typical values for the XC 11122 formulation. These values should not be interpreted as guaranteed minimums because stereolithography part properties vary with build orientation, layer thickness, post-cure irradiance, and the condition of the laser spot at the vat surface.
| Property | Test Method | Typical Value |
|---|---|---|
| Tensile strength at yield | ASTM D638-14 | 46.7 MPa |
| Tensile modulus | ASTM D638-14 | 2280 MPa |
| Elongation at yield | ASTM D638-14 | 7.5% |
| Flexural strength | ASTM D790-17 | 67.3 MPa |
| Flexural modulus | ASTM D790-17 | 1960 MPa |
| Notched Izod impact | ASTM D256-10 | 20.6 J/m |
| Heat deflection temperature at 0.46 MPa | ASTM D648-18 | 46.7 °C |
| Heat deflection temperature at 1.82 MPa | ASTM D648-18 | 42.6 °C |
| Water absorption | ASTM D570-98 | 0.35% |
| Density | ISO 1183-1 | 1.12 g/cm³ |
| Viscosity at 30 °C | Rotational viscometry | 260 mPa·s |
Green-state parts are removed from the build platform and washed according to the resin supplier’s process documentation. The reported heat deflection temperature of 42.6 °C at 1.82 MPa establishes a conservative handling limit for green-state parts during solvent removal and drying. Forced-air drying above this temperature can introduce thermal distortion in thin walls because the green-state crosslink density is lower than that achieved after full UV post-cure. Drying at ambient temperature or under reduced pressure is therefore preferred before the secondary photopolymerization step. The low viscosity that improves recoating does not eliminate the need for thorough solvent removal; residual solvent can plasticize the polymer network and reduce the final flexural modulus measured under ASTM D790-17.
The primary distinction from many unfilled SLA resins lies in the specified water absorption of 0.35% under ASTM D570-98. While general-purpose clear SLA grades can show acceptable dry-state mechanical properties, their performance after water immersion is often controlled by the higher equilibrium moisture content of the photopolymer network. In WaterShed XC 11122, the reduced moisture uptake is intended to limit dimensional swelling and modulus drift in humid or intermittently wet service. The water absorption value alone does not quantify the rate of moisture transport; thin stereolithography sections with a build layer thickness of 0.10 mm or less will reach equilibrium faster than a standard 3.2 mm test plaque. Qualification for wet applications should therefore include water immersion testing on actual part geometry rather than relying solely on the typical value from ASTM D570-98.
For fluid-handling prototypes and pump housings, the selection of WaterShed XC 11122 relies on the combination of a notched Izod value of 20.6 J/m under ASTM D256-10 and a flexural modulus of 1960 MPa under ASTM D790-17. Because the material is unfilled, it machines more predictably with standard carbide end mills when thread-cutting or secondary boring is required. The absence of glass or ceramic reinforcement distinguishes this grade from high-modulus composite SLA resins, but it also limits the maximum upper-use temperature. Parts subjected to continuous mechanical load should remain below the reported heat deflection values unless the component is supported by external fixtures or the service condition includes short-duration intermittent exposure.
Post-cure uniformity depends on irradiance, chamber temperature, and part packing density. In service-bureau processing, UV post-cure chambers with rotating fixtures are used to reduce shadowed regions that would otherwise produce local under-conversion and modulus gradients. Published data for the exact post-cure irradiance and dwell time for WaterShed XC 11122 are limited; the current supplier process sheet should be consulted because overexposure can embrittle thin sections while underexposure leaves residual unreacted acrylate that may affect water resistance. The reported heat deflection values are based on post-cured specimens, which indicates that green-state parts have a lower thermal deformation threshold and should not be exposed to heated drying or hot water before the full post-cure cycle is completed.
Chemical compatibility data for this particular formulation are not exhaustively published in the general technical datasheet. For process fluids other than clean water, immersion testing under ASTM D543-20 is required to quantify mass change, dimensional change, and surface attack. Aromatic solvents, ketones, chlorinated solvents, and strong alkaline solutions may soften the crosslinked structure, but published comparative data for this specific grade are limited. Potable-water contact is not automatically certified by the low water absorption value; components intended for drinking-water service require separate regulatory review under NSF/ANSI 61 or equivalent regional standards.
The substitution is governed by a trade-off between water resistance and elevated-temperature performance. Unfilled ABS-like SLA resins often report higher notched Izod and elongation at break, which favors snap-fit and impact-loaded features. WaterShed XC 11122 reports an elongation at yield of 7.5% under ASTM D638-14, which is lower than many toughened ABS-like grades. The material should therefore not be treated as a drop-in replacement for impact-critical ABS-like resins unless the design is reviewed for local strain concentration. Conversely, where low moisture uptake and dimensional stability in humid service are the controlling parameters, the 0.35% water absorption value under ASTM D570-98 becomes the relevant selection criterion. The heat deflection temperature of 46.7 °C at 0.46 MPa further excludes this resin from continuous under-hood or autoclave applications unless the part is externally supported and the load is compressive rather than flexural.
For quality control, slab specimens should be conditioned at 23 °C and 50% relative humidity for 40 h before mechanical testing under ASTM D618-13. The water absorption value reported in the datasheet was determined on a standard test plaque; actual part saturation depends on wall thickness, post-cure uniformity, and the local crosslink density achieved during stereolithography. Parts built with thin sections and complex channels may show faster moisture equilibration than thicker plaques, so dimensionally critical features should be measured after environmental exposure representative of the intended service. Chemical immersion testing under ASTM D543-20 remains necessary for applications involving oil, coolant, or cleaning agents, and the absence of published data for a given fluid should not be interpreted as chemical compatibility.