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DSM Somos 7120 Epoxy Photopolymer, UV & Thermal Postcure

    • Product Name: DSM Somos 7120 Epoxy Photopolymer, UV & Thermal Postcure
    • Factroy Site: Yudu County, Ganzhou, Jiangxi, China
    • Price Inquiry: admin@ascent-chem.com
    • Manufacturer: Ascent Petrochem Holdings Co., Limited
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    Specifications
    HS Code 343004
    Color Opaque off-white
    Tensile Strength 58 MPa
    Tensile Modulus 2800 MPa
    Elongation At Break 4%
    Flexural Strength 85 MPa
    Flexural Modulus 2700 MPa
    Izod Impact Notched 25 J/m
    Hardness 85 Shore D
    Heat Deflection Temperature 120 °C
    Glass Transition Temperature 140 °C
    Coefficient Of Thermal Expansion 60 µm/m/°C
    Water Absorption 0.3%
    Density 1.13 g/cm³
    Viscosity 400 cps at 30 °C
    Critical Exposure 12 mJ/cm²
    Penetration Depth 0.13 mm
    Dielectric Constant 3.5 at 1 MHz
    Dielectric Strength 15 kV/mm

    As an accredited DSM Somos 7120 Epoxy Photopolymer, UV & Thermal Postcure factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.

    Packing & Storage
    Packing DSM Somos 7120 Epoxy Photopolymer, UV & Thermal Postcure is supplied in 1 kg opaque plastic bottles with screw caps.
    Container Loading (20′ FCL) 20′ FCL loading for DSM Somos 7120 Epoxy Photopolymer (UV/Thermal Postcure): palletized drums, braced, labeled, temperature-controlled for safe transport.
    Shipping DSM Somos 7120 Epoxy Photopolymer, UV & Thermal Postcure is typically shipped as a non-regulated, light-sensitive liquid resin in sealed, opaque containers. Transport at ambient temperature, protected from UV light and heat. Follow the manufacturer’s SDS; no special DOT/IATA/IMDG hazard classification applies unless local regulations specify otherwise.
    Storage Store DSM Somos 7120 Epoxy Photopolymer in its original, tightly sealed, opaque container in a cool, dry, well-ventilated area. Keep away from direct sunlight, UV light, heat, sparks, and open flames. Maintain recommended temperature, typically 15–25°C, and protect from freezing and moisture. Separate from oxidizers and incompatible chemicals. Use within shelf life; follow SDS and supplier guidance.
    Shelf Life Shelf life: 12 months from manufacture when stored unopened in original container at 18–25°C, away from sunlight, heat, and moisture.
    Application of DSM Somos 7120 Epoxy Photopolymer, UV & Thermal Postcure

    Investment Casting Patterns in Nickel-Base Superalloy Shell Processes

    In investment casting foundries producing cobalt-chrome and nickel-base superalloy components for aero-engine hot-section parts, DSM Somos 7120 Epoxy Photopolymer functions as a consumable stereolithography pattern material within the lost-wax shell process. The resin is processed at 100% as-supplied single-component content without reactive diluent, filler, or accelerator addition; any introduction of talc or silica to the formulation is expressly avoided because post-burnout ash residue above 0.05 g per 100 g resin shifts shell inclusion probability beyond aerospace acceptance thresholds. Supplier liquid-state specifications for viscosity—typically in the range of 260–500 mPa·s at 30 °C—allow layer formation at 50–100 µm on 355 nm SLA systems without the addition of viscosity reducers. Compliance in this application is anchored to AS 9100D clause 8.5.1 for production control and to ASTM D638-14 tensile modulus data generated on green and postcured coupons, while final cast metal inspection is conducted under ISO 9001:2015 first-article requirements. The downstream production sequence begins with layer-wise photopolymerization at 50–100 µm slice thickness, followed by alcohol rinse, support removal, UV postcure in a 320–400 nm chamber at 60–120 kJ/m² cumulative exposure, and forced-air thermal postcure at 70–80 °C for 2–4 h to elevate monomer conversion and stabilize dimensions before ceramic shelling. Pattern geometry is hollowed with 1.5–3.0 mm wall thickness and internal lattice spacing to manage thermal expansion during autoclave or flash-fire dewax; heating ramp rates above 2–3 °C/min during burnout at 650–900 °C create internal pressure peaks that crack thin silica/zircon shells, particularly where wall thickness falls below 1.5 mm. Terminal finished products include equiaxed nickel-base superalloy turbine vanes, small structural brackets, and first-article castings produced from the lost pattern, with the 7120 pattern consumed in each casting tree.

    Where aerodynamic test campaigns require high-fidelity contoured surfaces, the resin is employed for wind-tunnel model fabrication because its unfilled epoxy backbone yields a machinable surface after postcure without the high-temperature distortion associated with thermoplastic build materials. In this configuration, the formulation addition ratio remains 100 phr of DSM Somos 7120; no glass microsphere or milled carbon fiber is introduced into the aero-surface regions, because filler addition creates surface roughness signatures that corrupt boundary-layer transition measurements. Mechanical property qualification follows ASTM D638-14 for tensile modulus and ISO 527-2:2012 for strain at break, while dimensional conformity of contour sections is checked against ASME Y14.5-2018 feature control frames with local profile tolerance of ±0.15 mm. The production sequence begins with layer-wise photopolymerization at 50 µm slice thickness on a 355 nm SLA platform, followed by alcohol rinse, removal of supports from non-aerodynamic faces, UV postcure in a 320–400 nm chamber at 60–120 kJ/m² cumulative exposure, and thermal postcure in a forced-air oven at 70–80 °C for 2–4 h to stabilize tensile modulus and reduce residual unreacted cationic species. Sanding and filled-epoxy seam blending are constrained to non-wetted areas; surface roughness on forward surfaces is verified with ISO 4287 Ra and Rz parameters, and any localized filler repair on aero surfaces is rejected when Ra exceeds 0.8 µm. Terminal produced types include high-speed wind tunnel sting-mounted models, air data probe fairings, and static display aerodynamic test assets, each requiring post-test dimensional re-validation to detect thermal creep from tunnel heating.

    What Causes Platinum-Cure Inhibition When Silicone Molds Are Built Around Epoxy Masters?

    Platinum-catalysed room-temperature vulcanizing silicone tooling for low-volume polyurethane prototype production uses the 7120 build as the positive master because its low postcure surface porosity and dimensional stability permit direct silicone casting without grain-transfer defects. The epoxy master remains at 100% resin as supplied; no mold release agent is added to the formulation, but a thin solvent-based release film is applied between master and silicone. For the surrounding tool, addition-cure silicone is batch-mixed at a 10:1 base-to-catalyst weight ratio before vacuum degassing at −0.09 MPa absolute for 5–10 min to remove entrained air. Compliance for the tooling workflow is governed by ISO 9001:2015 clause 8.4.1 supplier control, and the final silicone mold is characterized using ASTM D2240-15 Shore A hardness and ASTM D412-16 tensile methods. Production sequence starts with the completed 7120 master postcured to full conversion; residual cationic species must be consumed or sealed because free photoacid can inhibit platinum cure at the interface, so a 60 °C postcure for 4 h followed by isopropyl wipe is standard before silicone pouring. After silicone mold cure at 25–35 °C for 16–24 h, the mold is stripped and used for polyurethane casting under vacuum. Terminal finished products include automotive interior switch bezels, gasket prototypes, and short-run consumer product housings requiring Shore A 40–60 silicone molds. Published data for inhibition thresholds in this specific epoxy/silicone pairing is limited; therefore the postcure and surface sealing protocol is treated as the primary de-risking step.

    In automotive engine test cells, underhood coolant and oil subsystem prototype housings impose conflicting demands: sufficient heat distortion resistance to survive dynamometer soak cycles and enough elongation to tolerate clamp loads at hose barbs. DSM Somos 7120 is used at 100% as-formulated single-component stock; rubber impact modifier addition is not recommended above 0.5 phr because the low crosslink density of the epoxy photopolymer already produces elongations above 10%, while dispersed rubber phases above this ratio reduce heat deflection temperature below the 55–65 °C range observed after standard ultraviolet and thermal postcure. Amine-based additive packages are also avoided in this vat-processing environment because they trigger premature dark gelation and layer-to-layer adhesion failures. The postcure cycle—UV at 320–400 nm for 60–120 kJ/m² then forced-air heating at 75 °C for 3 h—is required to raise HDT and reduce unreacted oxetane/epoxide monomer migration into circulating fluid. Immersion testing per ISO 175:2010 in reference coolant fluid at 80 °C for 168 h and tensile retention per ASTM D638-14 are used to qualify prototype housings; heat deflection is verified under ASTM D648-18 at 0.46 MPa after postcure. Downstream production involves SLA layering at 0.1 mm, support removal, postcure, thread insert installation, and dynamometer thermal cycling from −20 °C to 90 °C with no pressure loss. Terminal finished products include glycol coolant reservoir prototypes, diesel fuel filter bowl test units, and air intake duct mockups for assembly-tooling validation; field-scrapped patterns are rejected when surface whitening or microcracking exceeds 2% of wetted surface area.

    When Electroless Metallization Must Adhere to Photopolymer Subrack Enclosures

    Electromagnetic compatibility pre-compliance housings are produced from 7120 builds where the photopolymer serves as a dimensionally stable core for subsequent electroless copper/nickel metallization. Formulation addition ratio of the polymer core remains 100 parts by weight as-supplied; the metallization stack is not a resin additive but is deposited as a 3–5 µm copper layer followed by a 1–2 µm nickel cap. Surface preparation before plating uses chromic acid-free sodium hydroxide/phosphate etchant at 40–50 °C for 5 min to improve mechanical bonding. Compliance posture references RoHS Directive 2011/65/EU Annex II for restricted substances in the base resin, REACH Regulation 1907/2006 Article 33 for SVHC communication, and IEC 61000-4-3 for radiated immunity test configuration; adhesion of the metallic layer is tested per ASTM D3359-17 with a minimum classification of 3B. The downstream process is sequential: SLA build at 0.075 mm slices, alcohol rinse, UV postcure, thermal postcure at 70 °C for 2.5 h, mechanical sanding of support nibs, electroless copper and nickel plating, and final shielding effectiveness measurement using IEEE 299-2006 nested reverberation fixtures. Terminal finished types include 19-inch subrack front panels, handheld data collector housings, and shielded enclosure lids for pre-certification testing; metalized parts are limited to ambient service below 50 °C to avoid differential expansion fracture of the nickel cap.

    Evaluating Long-Term Clamp Creep in Assembly Jigs and Inspection Nests

    During multi-shift robotic welding campaigns, repeat-use assembly fixtures printed from 7120 are placed into robotic welding cells and CMM inspection stations where dimensional repeatability under moderate clamp loads outweighs prolonged wear resistance. The formulation addition ratio remains 100% resin; no talc or mineral filler is added because filler particles would reduce the precision of locating features and create anisotropic shrinkage on large flat sections. Compliance is maintained under ISO 9001:2015 clause 8.5.4 for preservation of production tooling, and mechanical benchmarking uses ASTM D638-14 tensile modulus and ASTM D648-18 HDT under 0.46 MPa after postcure. Production sequence includes SLA build at 0.1 mm slices, alcohol rinse, support removal, UV postcure at 60–120 kJ/m², thermal postcure at 75 °C for 4 h, installation of hardened steel bushings, and coordinate measurement against ASME Y14.5-2018 datums. Terminal products include drill jigs for sheet-metal prototyping, tack-welding locator nests, and CMM holding fixtures used at ambient temperatures below 40 °C; continuous clamp face stress is kept under 5 MPa to avoid creep-induced positional drift beyond ±0.1 mm during multi-shift operation.

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    Certification & Compliance
    More Introduction

    DSM Somos 7120 Epoxy Photopolymer, UV & Thermal Postcure is a rigid epoxy-based vat photopolymerization resin formulated for 355 nm stereolithography systems. The product designation defines a two-stage property-development route: UV irradiation initiates cationic epoxy ring-opening through a photoacid generator, and thermal postcure drives additional propagation, crosslinking, and residual oxirane consumption. Manufacturer-reported viscosity at 30 °C is approximately 160 mPa·s, with a density near 1.13 g/cm³. These values support recoating at layer thicknesses between 0.050 mm and 0.100 mm on conventional blade or vacuum recoater platforms. The cured material is used for investment casting patterns, vacuum casting masters, dimensional prototypes, and moderate-temperature functional fixtures. All mechanical values cited in this document are based on ASTM or ISO methods and refer to parts tested after completion of the manufacturer-recommended UV and thermal postcure sequence.

    What postcure sequence drives oxirane conversion?

    Green parts removed from the vat are not final parts. Residual photoacid remains active, and unreacted cycloaliphatic epoxy groups retain significant ring strain. The transition from green state to cured state is governed by two process variables that cannot be interchanged: UV dose and thermal cure temperature. In production-scale postcure, UV exposure is performed in multi-lamp chambers with UVA output in the 315–400 nm band, commonly delivering 30–60 J/cm² per side depending on wall thickness and lamp intensity. Thermal postcure follows in a forced-air convection oven at a set-point between 50 °C and 80 °C for 1–3 h. The heated stage is diffusion-limited: as the network vitrifies, the glass-transition temperature rises and the propagation rate constant decreases. Ramping too quickly through the glass transition introduces bulk stress from transient temperature gradients. Insufficient thermal dwell leaves a sub-90% conversion layer that depresses heat deflection temperature and solvent resistance. Residual reaction enthalpy can be measured by differential scanning calorimetry using ISO 11357-2:2020.

    Build parameters on 355 nm solid-state laser platforms are typically derived from working curves generated on the target machine. Users should derive critical exposure and penetration depth by vat-specific windowpane testing because published working curves for this specific configuration are limited. Comparable cycloaliphatic epoxy systems commonly exhibit critical exposure values between 8 mJ/cm² and 15 mJ/cm² and penetration depths between 0.10 mm and 0.15 mm. Vat temperature is usually maintained at 28–32 °C to reduce viscosity and improve recoat uniformity. Galvanometer scan speed, hatch spacing, and laser power are adjusted to maintain overlap without excessive overcure. Overcure in downward-facing layers increases edge growth and degrades fine-feature accuracy. On production equipment such as a 3D Systems SLA Viper Pro or equivalent 355 nm platform, the resin’s low viscosity permits faster recoating than filled or tough-modified epoxy photopolymers.

    Laser patterning parameters and recoat dynamics

    Orientation-dependent anisotropy must be considered when interpreting tensile and flexural data. Tensile bars tested per ASTM D638-14 after full postcure generally report tensile strength in the 50–60 MPa range, tensile modulus near 2.4–2.7 GPa, and elongation at break between 5% and 8%. Flexural strength measured per ASTM D790-17 is typically higher because the laser-scalloped outer skin has a higher degree of crosslinking than the interior. Hardness measured by ASTM D2240-15 is usually Shore D 82–86. Heat deflection temperature under 0.46 MPa stress is typically 50–65 °C depending on thermal postcure completion; under 1.82 MPa, values can fall to 45–55 °C. These values are representative of the manufacturer’s published range and are not lot-release specifications. Users should request a certificate of analysis for acceptance testing of production lots.

    Property Test method Typical postcure value
    Viscosity at 30 °C ASTM D2196-15 160 mPa·s
    Density ISO 1183-1:2019 1.13 g/cm³
    Tensile strength ASTM D638-14 50–60 MPa
    Tensile modulus ASTM D638-14 2.4–2.7 GPa
    Elongation at break ASTM D638-14 5–8%
    Flexural strength ASTM D790-17 80–100 MPa
    Flexural modulus ASTM D790-17 2.2–2.8 GPa
    Shore D hardness ASTM D2240-15 82–86
    Heat deflection temperature at 0.46 MPa ASTM D648-18 50–65 °C
    Water absorption, 24 h ASTM D570-98 0.4–0.6%

    Moisture sensitivity is a defined operational boundary. Epoxy photopolymers absorb water and plasticize; extended immersion at 23 °C can reduce modulus and heat deflection temperature. The material should be stored in sealed containers away from UV and heat sources, and resin in open vats should be protected from ambient humidity above 60% RH. Avoid contact with strong bases and amines because such additives can quench the photoacid and leave surface tack. Postcure chambers should be vented to control ozone and low-molar-mass photolysis byproducts. Parts intended for tolerances tighter than 0.1% linear dimension should be preconditioned in the service environment before metrology because moisture uptake can cause dimensional drift. The resin’s storage life in unopened containers is typically 12 months from date of manufacture under dark, dry conditions.

    When investment casting patterns require shell-safe burnout

    Investment casting patterns built from Somos 7120 require a staged burnout schedule to prevent ceramic shell cracking from differential thermal expansion. Unfilled epoxy photopolymers generally leave lower residual ash than filled high-temperature grades, but burnout performance depends on pattern hollowing, drain channels, and oven ramp rates. Production foundries typically program slow heat-up through 300–600 °C to allow decomposition and volatilization without excessive gas pressure. Published data for this specific configuration is limited, so foundry-specific burnout trials are required before committing to production quantities. Pattern walls should be uniform and free of thick section changes that produce trapped expansion stress. Vent holes of at least 5 mm diameter are often used to release gases from hollow sections.

    Compared with clear epoxy photopolymers such as Watershed XC 11122, Somos 7120 is not specified for optical clarity or water-white appearance; it is selected where dimensional stability and moderate thermal performance are more important than transparency. High-heat grades such as ProtoGen 18420 shift heat deflection temperature upward through a more densely crosslinked or filled network, but they often carry higher viscosity and slower recoating. Toughness-modified grades such as Somos NeXt raise elongation and Izod impact above the glassy epoxy range, whereas 7120 remains a rigid system with elongation below 10%. The lower viscosity of 7120 relative to filled or tough grades permits finer feature reproduction and faster recoat on platforms with blade or vacuum recoating systems.

    Solvent resistance is controlled by postcure conversion, not formulation alone

    After full postcure, the epoxy network resists short-term exposure to many solvents, but ketones, chlorinated solvents, and hot oils can cause swelling and stress cracking. Chemical compatibility studies should follow ASTM D543-21. Aqueous resistance is moderate; water absorption after 24 h is 0.4–0.6% per ASTM D570-98. Aggressive alkaline cleaners and high-pH baths above 60 °C should be avoided because ester or ether linkages in the polymer network may hydrolyze. Long-term aqueous exposure at elevated temperature accelerates modulus loss and should be quantified for each application.

    Vacuum casting masters produced from 7120 require a stepped postcure before silicone mold exposure. Residual uncured monomer can inhibit platinum-catalyzed addition-cure silicone rubber. A thermal postcure protocol at 60–80 °C for 2 h after UV exposure reduces the risk of cure inhibition. The master surface should be sealed or coated if used in repeated high-temperature vulcanization. The material’s glass transition limits continuous service under load to below 50–60 °C; above this range, creep and stress relaxation become significant. RoHS and REACH status must be verified against the supplier’s current safety data sheet and lot-level declarations before export or medical prototyping.

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