| HS Code | 635929 |
| Productname | Dongguan Fenglong PC/ABS FL3025G2800 |
| Manufacturer | Dongguan Fenglong Plastic Technology Co., Ltd. |
| Materialtype | PC/ABS blend |
| Gradename | FL3025G2800 |
| Polymerbase | Polycarbonate/Acrylonitrile-Butadiene-Styrene |
| Reinforcement | Glass fiber reinforced |
| Flameretardancy | Flame-retardant |
| Processingmethod | Injection molding |
| Form | Pellets |
| Color | Natural/Black |
As an accredited Dongguan Fenglong PC/ABS FL3025G2800 factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.
| Packing | Dongguan Fenglong PC/ABS FL3025G2800 is supplied in 25 kg moisture-proof bags, palletized and stretch-wrapped for industrial transport. |
| Container Loading (20′ FCL) | Container Loading (20′ FCL): Dongguan Fenglong PC/ABS FL3025G2800 securely packed and stowed inside a 20-foot FCL for safe export shipment. |
| Shipping | Dongguan Fenglong PC/ABS FL3025G2800 is typically shipped as non-hazardous thermoplastic resin pellets in sealed moisture-barrier bags, packed in cartons or woven bags on pallets. Store dry, away from sunlight and heat. Handle with standard industrial precautions; normally no dangerous goods classification applies for transport. Keep packaging closed until use. |
| Storage | Store Dongguan Fenglong PC/ABS FL3025G2800 in a cool, dry, well-ventilated warehouse away from direct sunlight, heat, moisture, and incompatible chemicals. Keep original packaging sealed and palletized; prevent contamination, dust, and physical damage. Maintain stable temperature and low humidity, follow first-in, first-out, and avoid open flames or static buildup. |
| Shelf Life | Dongguan Fenglong PC/ABS FL3025G2800: typical shelf life 12 months in dry, cool, ventilated storage, protected from moisture and sunlight. |
In automotive interior substructures, Dongguan Fenglong PC/ABS FL3025G2800 is applied as the sole polymer matrix at 100% resin fraction; if a polyolefin-based color masterbatch is required, addition is limited to 2–4 wt%, and dried hot-runner grind from the same grade may be re-entered at ≤20 wt% only when notched Charpy impact measured per ISO 179-1/1eU:2010 and melt volume-flow rate measured per ISO 1133-1:2022 are revalidated on the production lot. Published mechanical and rheological data specifically for FL3025G2800 are limited, so the processing thresholds stated below represent the industrial envelope for V-0 PC/ABS alloys with comparable melt volume-flow rate and must be confirmed on production tooling. Compliance for interior flammability is demonstrated under ISO 3795:1989, which supports FMVSS 302 reporting, and volatile emissions performance is screened by thermal desorption according to VDA 278:2011, with the constraint that VOC and FOG values remain below the applicable OEM cockpit air-quality limit. Injection molding is performed on reciprocating-screw machines having 20:1 to 24:1 L/D ratio, compression ratio of 2.0–2.5:1, and a shut-off nozzle; melt temperature is held at 250–270°C, mold temperature at 60–80°C, and back pressure at 3–7 MPa to produce flow-direction shrinkage of approximately 0.5–0.7% and cross-flow shrinkage of 0.5–0.8% after 24 h per ISO 294-4:2018. The practical processing window is bounded by two failure modes documented on production lines: below 245°C melt temperature, the ABS phase does not homogenize with the PC phase and visible flow lines appear on grained surfaces, while above 280°C the flame-retardant package begins to release decomposition volatiles, generating silver streaks and reducing Charpy impact by 10–15%. Clamp force must be sized at 3–5 tonnes/cm² of projected area because lower packing pressure produces sink marks at bosses, ribs, and snap-fit features. Terminal components include instrument panel carriers, lower console substructures, glove box frames, and knee-bolster covers.
EV charging enclosure development imposes electrical insulation and flame barrier requirements that differ from automotive interior components: the part must survive continuous load at elevated ambient temperature in an outdoor wallbox, maintain creepage distances under pollution degree 3, and resist ignition from internal relay or connector faults. In this application, FL3025G2800 is charged at 100% virgin resin; reprocessed material from sprues and runners is restricted to ≤10 wt% because higher regrind can shift comparative tracking index by more than 10 V and create local insulation weak points. Silicone-based mold release, if required, is metered at 0.3–0.8 wt%; hydrocarbon waxes are excluded due to surface contamination and paint adhesion loss. The compliance matrix for a typical AC wallbox enclosure is given in Table 1. Molding uses multi-cavity hot-runner tooling with sequential valve gates; melt temperature is deliberately kept lower than in automotive processing at 245–265°C, while mold temperature is raised to 70–90°C to reduce frozen-layer orientation and improve weld-line impact. Pre-drying at 100–110°C for 4–6 h until residual moisture is below 0.02% is mandatory; production records for V-0 PC/ABS systems show that moisture above 0.03% at injection can shift glow-wire ignition temperature by 20–40°C and produce splay on textured surfaces. Screw speed is limited to 50–80 rpm, and back pressure is maintained at 2–5 MPa to avoid adiabatic temperature rise beyond the degradation threshold. Failure modes observed in large wallbox parts include weld-line cracks at gate intersections, loss of low-temperature drop impact at -20°C when regrind exceeds 15%, and CTI drift caused by flame-retardant additive inhomogeneity. Terminal products include AC charging controller enclosures, DC wallbox front shells, and internal insulating shields.
| Standard/test | Condition | Required value/classification |
|---|---|---|
| UL 94 vertical burn | Wall thickness 1.5 mm | V-0 |
| IEC 60695-2-11:2021 glow-wire | Wall thickness 1.5 mm | GWIT ≥775°C |
| IEC 60112 comparative tracking index | Solution A | ≥250 V |
| IEC 61851-1:2017 creepage clearance | Pollution degree 3, material group II | Design clearance per rated voltage class |
| IEC 62368-1:2023 fire enclosure | Flame class at 1.5 mm | V-0 material |
For thin-wall notebook chassis components and monitor rear frames, the principal processing constraint is the competition between melt flow length and flame-retardant thermal stability at wall thicknesses below 2.0 mm. FL3025G2800 is used at 100% of the polymer matrix; regrind is accepted only up to 20 wt% for non-visual internal brackets, whereas exposed surfaces require virgin resin to avoid black specks and gloss variation. Colored masterbatch is limited to 1–3 wt%, and the particle-size distribution must remain below 50 µm to avoid clogging thin-wall gates. The housing must meet UL 94 V-0 at 1.5 mm and comply with IEC 62368-1:2023 fire enclosure requirements; RoHS 2011/65/EU and REACH EC 1907/2006 SVHC screening are mandatory for market entry. Molding is performed with a melt temperature of 250–270°C and a mold temperature of 60–80°C; the acceptable processing window is ±5°C on melt and ±5°C on mold because lower temperatures create short shots when the flow length/wall thickness ratio exceeds 150:1, while higher temperatures generate splay from flame-retardant decomposition and increase flash at shut-off surfaces. Injection speed is set to 180–250 mm/s, holding pressure is 60–80 MPa, and back pressure is 5–8 MPa to maintain homogeneous additive distribution without excessive shear heating. Screw decompression after plastication is limited to 2–3 mm; larger decompression draws air into the melt and produces streaking. Terminal products include notebook bottom shells, monitor rear housing frames, router top covers, and detachable service covers.
Repeated disinfectant exposure determines housing polymer selection in diagnostic medical devices where surfaces undergo cyclic contact with 70% isopropanol, 0.5% sodium hypochlorite, and quaternary ammonium formulations. For these enclosures, FL3025G2800 is used at 100% base resin with ≤15 wt% reprocessed material from internally generated runners because higher regrind fractions can increase surface micro-crack density when parts are exposed to polar disinfectants. No external plasticizer or amine-based modifier should be added; such additives accelerate molecular weight loss through transesterification and reduce tensile strength beyond the ISO 527-2:2012 acceptance limit. Electrical safety is governed by IEC 60601-1:2005/AMD1:2012 for medical electrical equipment enclosure flammability and mechanical strength, while externally accessible surfaces may require biocompatibility records per ISO 10993-5:2009 and ISO 10993-10:2021. Molding is performed in a controlled environment with melt temperature 250–265°C, mold temperature 70–85°C, and holding pressure 50–70 MPa to achieve high-gloss Class A surfaces without secondary painting; mold surface finish is maintained at SPI A-2 or finer. Pre-drying at 95–105°C for 4–6 h to below 0.02% moisture is necessary because moisture interacts with the PC phase and promotes splay on polished mold surfaces. Terminal parts include diagnostic system front frames, handheld analyzer enclosures, laboratory instrument covers, and ultrasound cart side panels.
Low-temperature impact resistance and heat deflection under continuous motor load determine the service limits of professional power tool housings, where drop impact at -20°C and motor-gearbox temperatures above 90°C occur in the same part. In this application, FL3025G2800 is molded at 100% resin without mineral filler for double-insulated drill and grinder housings; if higher flexural modulus is required for long cantilever handles, 10–15 wt% short-glass fiber may be compounded, but published data for this specific configuration are limited and, in standard unfilled PC/ABS systems, short-glass fiber addition can reduce notched Charpy impact energy per ISO 179-1/1eA:2010 by 20–30%, requiring revalidation for drop survival. Compliance is assessed under IEC 62841-1:2023 for hand-held motor-operated electric tools, with flame classification at UL 94 HB or V-0 depending on internal spacing; glow-wire requirements are taken from IEC 60695-2-11:2021 when the housing functions as an uninsulated live-part guard. Molding uses thick-wall tooling with nominal wall thickness 2.5–4.0 mm, melt temperature 250–270°C, mold temperature 60–80°C, and extended hold time of 3–5 s/mm of nominal wall to prevent sink marks at bosses and screw wells. Clamp tonnage must be at least 4–6 tonnes/cm² of projected area because thick-wall sections generate high melt cushion and require intensified packing. Terminal products include angle grinder gear housings, circular saw blade guards, hammer drill motor housings, and battery pack shells.
For appliance control panel frames, the established practice is to mold FL3025G2800 at a melt temperature of 245–260°C with a mold temperature of 60–70°C, using 100% virgin resin with ≤20% regrind, to meet IEC 60335-1:2020 glow-wire requirements for unattended appliances carrying loads above 0.2 A, producing control panel frames and detachable service covers.
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Dongguan Fenglong PC/ABS FL3025G2800 is a supplier-specific grade designation within the polycarbonate/acrylonitrile-butadiene-styrene compounding segment. The material is specified where the high-energy ductile failure mode of polycarbonate is combined with the improved melt processability and cost position of ABS. Because PC/ABS alloys are multi-phase systems, property retention depends on phase morphology, residual moisture, and thermal history during both compounding and molding. The FL3025G2800 identifier must therefore be evaluated against the supplier’s certificate of analysis and UL Yellow Card, if applicable. Independent published data for this exact grade are limited; property ranges in this document are representative of unfilled commercial PC/ABS and should not replace lot-specific measurements.
The prefix and suffix in “FL3025G2800” are not governed by an international designation standard; they are supplier-specific. No inference about flame-retardant loading, glass content, or filler content should be drawn from the code alone. Purchasing specifications should state the exact resin, melt-flow window, flammability rating at the required wall thickness, and the expected tensile and impact values measured on the applicant’s tooling.
For unfilled PC/ABS, the conventional release property set includes density, melt volume-flow rate, tensile stress at yield, tensile elongation at break, flexural modulus, notched impact, and temperature resistance under flexural load. The relevant methods are ISO 1183-1 for density, ISO 1133-1 for melt mass-flow rate or melt volume-flow rate, ISO 527-1/-2 for tensile properties, ISO 178 for flexural properties, ISO 180/1A for notched Izod impact, and ISO 75-1/-2 for deflection temperature under load. North American equivalents include ASTM D792-20, ASTM D1238-20, ASTM D638-14, ASTM D790-17, ASTM D256-10(2018), and ASTM D648-18.
Representative unfilled PC/ABS grades of this class show density between 1.14 g/cm³ and 1.19 g/cm³, tensile stress at yield between 48 MPa and 60 MPa, flexural modulus between 2,100 MPa and 2,500 MPa, and notched Izod impact at 23°C from 40 kJ/m² to 65 kJ/m². Melt volume-flow rate at 260°C/5 kg commonly falls between 15 cm³/10 min and 35 cm³/10 min. Heat deflection temperature under 1.8 MPa is typically 100–120°C. Published data for this specific configuration is limited; values for flame-retarded or filled versions may fall outside these ranges.
At -30°C, notched Izod impact for PC/ABS normally drops to 25–45 kJ/m², a lower-bounding condition for exterior automotive and appliance applications. This ductile-to-brittle transition is influenced by rubber volume fraction and PC molecular weight. A higher PC phase concentration usually raises heat resistance, while a higher butadiene content preserves low-temperature impact but lowers heat resistance and increases melt viscosity.
| Property | Test method | Unfilled PC/ABS class | Unmodified PC | Unmodified ABS |
|---|---|---|---|---|
| Density | ISO 1183-1 | 1.14–1.19 g/cm³ | 1.20 g/cm³ | 1.04–1.06 g/cm³ |
| Tensile stress at yield | ISO 527-2 | 48–60 MPa | 60–70 MPa | 40–50 MPa |
| Flexural modulus | ISO 178 | 2,100–2,500 MPa | 2,300–2,500 MPa | 2,000–2,600 MPa |
| Notched Izod impact, 23°C | ISO 180/1A | 40–65 kJ/m² | 60–80 kJ/m² | 15–30 kJ/m² |
| Heat deflection temperature, 1.8 MPa | ISO 75-2/A | 100–120°C | 125–135°C | 85–100°C |
| Melt volume-flow rate | ISO 1133-1 | 15–35 cm³/10 min, 260°C/5 kg | 10–20 cm³/10 min, 300°C/1.2 kg | 20–40 cm³/10 min, 220°C/10 kg |
Values in the comparative table are representative open-literature ranges for unfilled materials. Direct comparison requires identical specimen thickness, mold temperature, moisture condition, and conditioning time. For FL3025G2800, the supplier’s product-specific technical data sheet is the controlling document.
PC/ABS grades are hygroscopic. Prior to molding, residual moisture must be below 0.02% by weight to prevent splay, silver streaking, and molecular-weight loss through hydrolysis. Desiccant hopper dryers with an air dew point no higher than -30°C are recommended. Drying at 80–100°C for 3–4 h is typical, but resin exposed to >60% relative humidity may require extension to 4–6 h. Hot-air tray dryers are generally inadequate because they introduce ambient moisture and can overheat the granule surface without reducing core moisture.
Injection molding barrel profiles are commonly set to 240–270°C from rear to nozzle, with a melt temperature of 250–270°C. Nozzle temperatures above 280°C accelerate ABS rubber-phase degradation and can produce color shifts toward yellow. Mold temperatures should be maintained at 60–90°C; the higher end reduces molded-in stress and improves surface gloss, while the lower end shortens cycle time but increases the risk of delamination at weld lines.
Shear heating in the screw check ring, nozzle tip, and gate can raise local melt temperature beyond the barrel set point. Gate shear rates above 30,000 s⁻¹ are generally avoided for PC/ABS unless the grade is specifically designed for thin-wall molding. The pressure drop across a cold runner should not exceed 35 MPa; beyond this, the molder should increase runner diameter rather than raise melt temperature.
Residence time should be kept below 5 min at 270°C. When a machine uses less than 30% of shot capacity, the material spends excessive time in the barrel and may undergo chain scission. On standard hydraulic injection molding machines with clamp force between 800 kN and 12,000 kN, the material is processed through a shutoff nozzle with a flat or general-purpose tip. Production-scale experience with 20:1 to 22:1 L/D general-purpose screws shows that a compression ratio of 2.0:1 to 2.5:1 and a smear-tip check ring reduce stagnation points. Flame-retarded grades may require hardened barrel and screw surfaces because phosphorus-based additives can generate acidic species at elevated temperatures.
On twin-screw compounding lines with 40:1 L/D, PC and ABS are blended in a staged screw profile. High shear zones should not exceed 300°C; otherwise ABS rubber domains crosslink or degrade, lowering Izod impact. Vacuum devolatilization at -0.08 MPa to -0.095 MPa is used to strip residual volatiles. At 270°C and 1,000 s⁻¹, apparent viscosity for unfilled PC/ABS with melt volume-flow rate of about 20 cm³/10 min typically lies between 60 Pa·s and 150 Pa·s in capillary rheometry. This shear-thinning behavior means that filling thin-wall sections is more effective by increasing injection velocity than by elevating melt temperature.
Compared with unmodified polycarbonate, a PC/ABS alloy such as FL3025G2800 usually exhibits a lower heat deflection temperature—typically 10–25°C lower at 1.8 MPa—but better melt flow and improved resistance to environmental stress cracking in the presence of oils and cleaning agents. PC/ABS is opaque, whereas polycarbonate can be transparent; this optical difference excludes the alloy from lenses and transparent guards. Unmodified PC retains higher notched Izod impact at room temperature, often above 60 kJ/m², but its melt viscosity is higher and its chemical stress cracking window is narrower.
Compared with unmodified ABS, PC/ABS offers higher heat resistance and higher impact, particularly at low temperature. The density penalty is real: PC/ABS is approximately 0.10–0.15 g/cm³ heavier than ABS. The drying burden also increases because ABS is less sensitive to moisture than PC. A molder replacing ABS with PC/ABS should verify that tool cooling capacity, mold temperature control, and hot runner thermocouple accuracy can support the higher mold and melt temperatures.
Against PC/PBT alloys, PC/ABS usually shows inferior resistance to automotive fuels and industrial solvents but better low-temperature impact and easier flow into thicker sections. Against flame-retardant PC/ABS grades based on brominated additives, halogen-free phosphorus-based systems may require higher loadings to achieve the same UL 94 V-0 at 1.5 mm, with a corresponding reduction in heat deflection temperature and impact. The exact UL Yellow Card rating for FL3025G2800 must be confirmed with the supplier; no classification is assigned here.
For a product such as FL3025G2800, the certificate of analysis should report melt volume-flow rate, density, tensile stress at yield, notched Izod impact, and flammability classification where applicable. Supplier ISO 9001:2015 process control and lot traceability are used to reduce batch-to-batch variance, but PC/ABS alloys can still show rheological drift when feedstock PC or ABS viscosity changes. Incoming-material audits should include ISO 1133-1 melt flow determination and ISO 1183-1 density as quick release checks. If the material contains recycled PC/ABS feedstock, the proportion should be disclosed because it influences mechanical and thermal properties.
Regulatory documentation should confirm compliance with EU 2011/65/EU for RoHS substances and EC 1907/2006 for REACH. A UL Yellow Card under UL 94 is separate from these chemical regulations and must be obtained at the compound level, not inferred from a generic material class.
In electrical and electronic housing applications, flame-retarded PC/ABS grades of this class are evaluated under IEC 60695-2-11 for glow-wire end-product testing. A housing for an unattended appliance carrying current above 0.2 A may require a glow-wire flammability index above 850°C at the final wall thickness, but the specific suitability of FL3025G2800 requires a third-party test report on the molded part. Comparative tracking index per IEC 60112 is often specified at 250 V or higher for insulating barriers; standard PC/ABS grades may fall below 250 V unless the flame-retardant package is selected for electrical insulation.
For automotive interior structural parts, PC/ABS is used in instrument panel retainers, center console carriers, and airbag covers. The material must be dried before molding and evaluated for low-temperature deployment using OEM-specific tear-energy or high-speed puncture tests, not a generic ISO tensile method. Phosphorus-based flame retardants can migrate to the surface over time, with surface enrichment affecting paint adhesion and solvent bonding; the kinetics are temperature-dependent and should be evaluated after accelerated storage at 85°C and 85% relative humidity per ISO 6270-2.
PC/ABS without UV stabilization should not be used for unpainted exterior panels exposed to >1,000 h xenon arc weathering per ISO 4892-2 because surface yellowing and gloss loss occur. Basic aqueous cleaners with high pH can initiate polycarbonate hydrolysis; alkaline cleaning agents above pH 9 are generally incompatible. Avoid amine-containing masterbatches and lubricants because amines accelerate polycarbonate degradation and can reduce molecular weight at processing temperatures. For medical housing applications, ISO 10993-1 biocompatibility data must be requested for the specific compound and sterilization cycle; not all PC/ABS grades in this class are supplied as medical-grade materials.