| HS Code | 735781 |
| Productname | Dongguan Baoli ABS PC B3100 |
| Material | ABS/PC alloy |
| Grade | B3100 |
| Manufacturer | Dongguan Baoli |
| Density | 1.13–1.18 g/cm³ |
| Melt Flow Rate | 8–15 g/10 min at 230°C/5 kg |
| Tensile Strength | 45–55 MPa |
| Flexural Strength | 70–85 MPa |
| Flexural Modulus | 2100–2600 MPa |
| Notched Izod Impact Strength | 20–40 kJ/m² at 23°C |
| Heat Deflection Temperature | 95–110°C at 1.82 MPa |
| Vicat Softening Temperature | 110–120°C |
| Rockwell Hardness | 100–110 R scale |
| Molding Shrinkage | 0.4–0.7% |
| Water Absorption | 0.1–0.3% after 24 h |
As an accredited Dongguan Baoli ABS PC B3100 factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.
| Packing | Dongguan Baoli ABS PC B3100 is supplied in 25 kg moisture-resistant bags, 40 bags per pallet, securely wrapped for transport and storage. |
| Container Loading (20′ FCL) | 20′ FCL: Dongguan Baoli ABS PC B3100 resin loaded palletized, shrink-wrapped, secured, and evenly distributed for export shipment. |
| Shipping | Dongguan Baoli ABS PC B3100 is a non-hazardous ABS/PC resin blend shipped as general cargo. Pack in moisture-proof bags or cartons, keep dry, away from direct sunlight and heat, and avoid sharp impacts. No UN number or dangerous goods declaration is required. Store in ventilated conditions. |
| Storage | Dongguan Baoli ABS PC B3100 should be stored in a cool, dry, well-ventilated warehouse, away from direct sunlight, heat, flames, and strong oxidizers. Keep in original sealed, labeled containers or bags on pallets; protect from moisture, dust, and mechanical damage. Maintain moderate temperature, avoid prolonged UV exposure, and follow local regulations and the SDS. |
| Shelf Life | Typically 12 months from production date when stored unopened in a dry, cool, well-ventilated place, away from direct sunlight and moisture. |
In automotive interior lower trim production, B3100 is evaluated against flammability, fogging, and odor requirements before any grain finish is approved. The applicable compliance envelope for an EU and North American instrument panel lower carrier includes FMVSS 302 and ISO 3795:1989 for burn behavior, with a maximum burn rate of 100 mm/min for specimens thicker than 3 mm; VDA 275:2019-10 odor testing with a result not exceeding 3.0; DIN 75201:2011-01 fogging photometric method with condensate below 2 mg on glass; EU ELV Directive 2000/53/EC Annex II heavy-metal restrictions; GADSL declarable substance screening; and REACH Regulation 1907/2006 SVHC content below 0.1 wt% for articles. Formulation addition ratio for B3100 in this sector is 72–85 wt% as the PC/ABS matrix, first-pass regrind of unfilled sprues and runners up to 25 wt%, heat stabilizer at 0.3–0.6 phr, internal mold release at 0.2–0.5 phr, and carbon black masterbatch at 1–2 wt% for grained black lower trims. The downstream production route is injection molding on hydraulic or servo-hydraulic presses from 250–500 metric tons, with a desiccant dryer set at 100–110 °C for 4–6 h to achieve pellet moisture below 0.025%; melt temperature is maintained at 245–270 °C, mold temperature at 70–90 °C, holding pressure at 40–70 MPa, and screw L/D ratio at 20–24:1 with compression ratio 2.0–2.5:1. Multi-gate instrument panel substrates require sequential valve gates to move the weld line away from airbag deployment openings and clip towers. Observed production-scale failure modes include splay on the B-surface when residual moisture exceeds 0.03%, gloss mismatch between grained and ungrained zones, and low drop-weight impact at knit lines when melt temperature drops below 240 °C. Terminal product types include lower instrument panel carriers, door panel lower trim, seat side shields, center console side trims, and cowl side covers.
When a European EN 60335-1 end-product standard is applied to a PC/ABS housing, the wall section at the contact points is frequently the site of the highest glow-wire test temperature. For B3100 formulations in low-voltage distribution equipment, the compliance set includes IEC 60695-2-11:2021 glow-wire end-product testing at the specified Tref value, IEC 60695-2-12:2021 GWFI and IEC 60695-2-13:2021 GWIT at 750/775/850 °C depending on current and voltage class, IEC 60112:2020 comparative tracking index with CTI ≥ 175 V for base isolation, UL 94 V-0 at the final part wall thickness, and RoHS Directive 2011/65/EU Annex II as amended by Delegated Directive (EU) 2015/863. The formulation addition ratio for a V-0 low-voltage housing uses B3100 at 80–88 wt%, bisphenol A bis(diphenyl phosphate) flame retardant at 8–14 wt%, polytetrafluoroethylene anti-drip at 0.2–0.4 phr, and a phosphite/phenolic antioxidant package at 0.2–0.5 phr; first-pass regrind is limited to 15 wt% because repeated extrusion history accelerates phosphate ester migration. The production process is injection molding with a desiccant dryer at 90–105 °C for 4–6 h to below 0.02% moisture, melt temperature held at 235–255 °C to limit phosphate ester decomposition above 280 °C, mold temperature at 60–80 °C, vent depth of 0.02–0.03 mm, and valve-gate hot runners to reduce cold sprue regrind. At production scale, plate-out on vent surfaces is the dominant mold maintenance issue; a phosphate FR system migrates to the mold surface within 2–4 h of continuous cycling and reduces vent function until manual cleaning or dry-ice blasting is performed. End-product categories include miniature circuit breaker housings, residual current device bases, junction boxes, contactor covers, and DIN-rail terminal enclosures.
| Assessment | Standard/Method | Typical target or condition |
|---|---|---|
| Vertical flame | UL 94 V-0 | As-molded wall thickness, 48 h conditioning at 23 °C/50% RH |
| Glow-wire end-product | IEC 60695-2-11:2021 | Tref as specified in EN 60335-1:2012 + A15:2021 clause 30.2 |
| GWFI/GWIT | IEC 60695-2-12:2021 / IEC 60695-2-13:2021 | 750/775/850 °C based on product family and end-use current |
| Comparative tracking index | IEC 60112:2020 | ≥ 175 V PLC 3 unless higher creepage distance is required |
| RoHS restricted substances | Directive 2011/65/EU Annex II | Pb ≤ 0.1 wt%, Hg ≤ 0.1 wt%, Cd ≤ 0.01 wt%, Cr6+ ≤ 0.1 wt%, PBB/PBDE ≤ 0.1 wt%, DEHP/BBP/DBP/DIBP ≤ 0.1 wt% per (EU) 2015/863 |
Balancing flame-retardant let-down and dimensional stability in 1U front bezel geometries requires mold-flow simulation before tool steel is cut, because B3100 unfilled PC/ABS exhibits anisotropic shrinkage in the 0.5–0.7% range reported for unfilled PC/ABS of this class, and the long vertical bezel profile amplifies differential cooling between the sprue end and latch detail; exact grade-specific coefficients must be read from the B3100 batch certificate. Compliance for server and information technology equipment enclosures is set by IEC 62368-1:2018 Annex S.5, UL 94 V-0 or V-1 at the end-use thickness, CAN/CSA C22.2 No. 62368-1:2019, EPEAT lifetime extension criteria where recycled content is tracked, and RoHS Directive 2011/65/EU. Formulation addition ratio in this sector is B3100 at 75–90 wt%, post-industrial recycled PC/ABS at 10–25 wt%, halogen-free phosphate flame retardant at 8–12 wt% when V-0 is required, carbon black masterbatch at 0.5–1 wt%, and antioxidant at 0.2–0.4 phr. The production route is high-speed injection molding of 1.5–2.0 mm wall stock on presses from 250–800 metric tons, with pellet drying at 100–110 °C for 4 h to moisture below 0.025%, melt temperature between 250–270 °C, mold temperature at 70–90 °C, and sequential valve gating on four to eight gates to prevent weld lines under the ID badge or LED lens. In production, the critical bottleneck is not melt delivery but dimensional stability after demolding: parts removed at 80–90 °C surface temperature continue to shrink for 24–48 h at ambient storage, and single-plane flatness tolerances of 0.3 mm per 100 mm length require post-mold cooling fixtures. Terminal product types are server front bezels, hard disk drive caddies, RAID cage covers, rack management module fronts, and power distribution unit housings.
Double-insulated hand-held tool construction depends on the retention of impact resistance after 5,000-cycle vibration testing and a fall test from 1.0 m onto concrete, which shifts material selection away from glass-filled systems because weld-line impact strength becomes the controlling property. The applicable compliance framework for B3100 in this sector is IEC 62841-1:2015/AMD1:2021 for motor-operated hand-held tools, UL 62841-1, IEC 60664-1:2020 for insulation coordination and creepage distances, UL 94 V-2 or HB at the as-molded thickness, RoHS Directive 2011/65/EU, and REACH Regulation 1907/2006. The formulation addition ratio for B3100 in hand-held tools is 95–100 wt% unfilled, color masterbatch at 1–2 phr, antistatic concentrate at 0.5–1.5 phr where dust accumulation on the motor cooling path must be limited, and no fluorinated processing aid. The downstream process is injection molding with a desiccant dryer at 100–110 °C for 4 h to moisture below 0.025%, melt temperature at 255–270 °C, mold temperature at 75–95 °C, two-plate cold runner with tunnel gates into the B-surface, screw L/D 20:1, compression ratio 2.2:1, and back pressure at 0.5–1.0 MPa. Production-scale issues include gate blush on textured outer shells when injection velocity exceeds 200 mm/s, screw boss cracking when hold pressure is reduced below 45 MPa, and dimensional drift in ambient storage due to moisture uptake after 24 h at 23 °C/50% RH. Terminal product types include angle grinder clamshells, circular saw motor housings, leaf blower shells, drill/driver housings, and rotary tool bodies.
Outdoor telecommunication cabinets molded from B3100 require qualification against long-term UV aging, damp heat, and dimensional stability because the gasket sealing surface can open a leakage path when the lid and base shrink at different rates. The compliance set includes ISO 4892-2:2013 xenon-arc exposure with cycle 1 or cycle 2 as specified in the end-user specification, ASTM D2244 CIELAB color difference ΔE ≤ 3.0 after the agreed exposure interval, UL 746C f1 outdoor suitability, IEC 60068-2-30:2005 damp heat cyclic test, and GR-487-Core where North American carrier requirements apply. Published data for this specific B3100 configuration under GR-487-Core is limited; end-product qualification is therefore required before series release. The formulation addition ratio for outdoor enclosures uses B3100 at 70–80 wt%, post-industrial recycled PC/ABS at 15–25 wt%, hindered amine light stabilizer at 0.3–0.8 phr, titanium dioxide at 2–4 phr for non-black cabinets, and antioxidant at 0.2–0.4 phr. The production route is large-part injection molding on presses from 800–1,200 metric tons, with desiccant drying at 100–110 °C for 4–6 h to moisture below 0.025%, melt temperature at 250–275 °C, mold temperature at 70–85 °C, sequential valve gating with four to eight gates, and cooling time of 30–50 s depending on wall thickness. Production facilities typically use acid-etched cavity surfaces and a coarse grain to hide gloss variation from multiple gates. Molded article classes include antenna mounting plates, cable splice enclosures, pole-mounted cabinet frames, telemetry node housings, and fiber termination tray covers.
Because diagnostic analyzer front covers are not patient-contact articles, molding facilities supplying IEC 60601-1 equipment still impose stricter contamination controls than general electrical work. The compliance set for B3100 in laboratory diagnostic and clinical equipment enclosures is IEC 60601-1:2005/AMD2:2020 creepage and clearance requirements for reinforced insulation, IEC 61010-1:2010/AMD1:2016 for IVD laboratory equipment, UL 94 V-0 or V-2 at final thickness, ISO 10993-5:2009 and ISO 10993-10:2010 if skin contact is part of the risk assessment, ISO 13485:2016 for certified component manufacturing, and FDA 21 CFR 820 for finished device supply where B3100 is part of the device master record. Formulation addition ratio is B3100 at 90–100 wt%, medical-grade color masterbatch at 2–3 phr, antistatic concentrate at 0.5–1.0 phr where triboelectric charging is identified as a risk, and no post-consumer or post-industrial regrind. The process is injection molding in an ISO 8 cleanroom envelope, with a dedicated desiccant dryer at 100 °C for 4–6 h to moisture below 0.025%, melt temperature 250–265 °C, mold temperature 70–90 °C, hot-runner direct side gating, and filtered vents. Production-scale controls focus on particulate contamination rather than dimensional throughput; mold cleaning intervals are set by lint and volatiles accumulation on vent channels, and the cleaning solvent must be compatible with PC/ABS to avoid environmental stress cracking at the gate. Final article categories include ultrasound cart doors, ventilator front covers, IV pump housings, chemistry analyzer front panels, and point-of-care reader enclosures.
AC charging station faceplate production with B3100 is constrained by two overlapping requirements: IK10 impact after outdoor exposure and dimensional tolerance after thermal cycling from -40 °C to 85 °C. The applicable compliance framework is IEC 61851-1:2017 for conductive charging systems, IEC 62262:2002/AMD1:2021 IK code verification, UL 94 V-0 at 1.5 mm when flame retardance is required, UL 2251 or CSA C22.2 No. 281 for North American EV coupler and enclosure approvals, and RoHS Directive 2011/65/EU. In this sector, B3100 is let down at 70–85 wt%, with mineral filler at 5–10 wt% to reduce the coefficient of linear thermal expansion to approximately 0.6–0.7 × 10⁻⁴ K⁻¹, impact modifier at 3–5 wt% to recover ambient and low-temperature ductility, phosphate flame retardant at 8–12 wt% if V-0 is specified, and black pigment at 1 wt%. The downstream production process is injection molding on presses from 400–1,000 metric tons, with drying at 100 °C for 4 h to below 0.025% moisture, melt temperature 245–265 °C, mold temperature 80–100 °C to reduce molded-in stress near the gate area, sequential valve gating for large front faces, and wall thicknesses of 2.5–3.5 mm to achieve IK10 impact energy of 5 J. Post-mold annealing at 90–100 °C for 1 h is sometimes applied to reduce stress in screw bosses and snap-fit catches, but it can increase surface gloss variation and should be validated for dimensional audit. Final part categories include AC Mode 2/Mode 3 charger faceplates, inlet covers, wallbox enclosure covers, charging pedestal doors, and cable hanger brackets.
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Dongguan Baoli ABS PC B3100 is an engineering thermoplastic granulate in the acrylonitrile-butadiene-styrene/polycarbonate alloy family. The grade code B3100 is a supplier-specific commercial designation; it does not replace the resin identification required by ISO 1043-1:2011 for an ABS+PC blend and does not disclose the exact polycarbonate mass fraction. The material is positioned for injection molding applications where a balance of tensile strength, notched impact resistance, and heat deflection capability is required. Published data for this specific grade are limited to supplier documentation. Where lot-specific values are not available, the performance envelope described in this document is inferred from conventional ABS/PC alloy ranges reported in industrial literature and tied to ASTM D638-14, ISO 1133-1:2022, ISO 180/A, and ISO 75-1/2. Incoming resin identification should be verified against the lot certificate by melt flow-rate measurement, density determination under ISO 1183-1:2019, or infrared spectroscopy.
On compounding lines producing B3100-type ABS/PC pellets, the main quality risks are phase inversion, residual volatile content, and moisture-induced chain scission. Twin-screw extruders with L/D ratios between 32:1 and 44:1 are common. The first 8–10 barrel diameters are used for conveying and preheating, the middle section for dispersive kneading, and the final section for vacuum devolatilization. Vacuum vent pressure below −0.08 MPa is typically applied to strip water and degradation volatiles. The grade should not be compounded with alkaline or amine-based carrier systems that can attack polycarbonate carbonate linkages. If regrind is used, addition is commonly limited to 20–30 wt% for engineering enclosure compounds, but the actual ceiling should be based on retained notched Izod impact and weld-line strength rather than a fixed percentage.
Moisture control is the dominant processing constraint. Hydrolysis of polycarbonate occurs through chain cleavage at carbonate linkages and becomes autocatalytic above 0.03 wt% residual moisture. Before molding, B3100 should be dried in a desiccant-bed or rotomold dryer with a dew point of −30 °C to −40 °C. Hopper air temperature is set at 80–100 °C for 2–4 h. Target residual moisture before the melt enters the barrel is ≤0.02 wt% by Karl Fischer titration or a calibrated moisture analyzer. Dryer capacity should be matched to shot weight and cycle time so that dried pellets are not exposed to ambient air longer than 30–60 min. At relative humidity above 60%, moisture regain follows Fickian diffusion at the pellet surface, and open hopper residence can produce surface splay even when bulk moisture remains low.
Drying temperature should not exceed 100 °C for prolonged periods because ABS/PC pellets can soften, bridge, or fuse in the hopper. If the dryer dew point rises above −25 °C, the drying process should be stopped and the desiccant bed regenerated. Batch-to-batch variance in pellet moisture is a recognized bottleneck on production lines; processors may need to extend drying time by 1–2 h when ambient air is humid or when pellets are stored in torn bags. The use of hot air alone without desiccant does not achieve the required 0.02 wt% residual moisture for critical aesthetic or structural parts.
The B3100 resin is an alloy, not a dry blend. The polycarbonate-rich domains raise heat resistance and low-temperature ductility, while the ABS phase improves melt flow, reduces melt viscosity relative to polycarbonate homopolymer, and reduces notch sensitivity. Compared with general-purpose ABS, the alloy shifts the heat deflection temperature upward by roughly 20–30 °C and raises tensile yield stress. Compared with polycarbonate homopolymer, the alloy generally lowers melt pressure and improves flow in thin-wall tools, but sacrifices some heat deflection, transparency, and chemical resistance. Representative published property bands for general-purpose ABS, ABS/PC alloys, and polycarbonate homopolymer are given in Table 1.
| Property | Test method | ABS general-purpose | ABS/PC alloy class | PC homopolymer |
|---|---|---|---|---|
| Density | ISO 1183-1:2019 | 1.03–1.07 g/cm³ | 1.10–1.15 g/cm³ | 1.20–1.22 g/cm³ |
| Tensile yield stress | ASTM D638-14 | 40–50 MPa | 50–65 MPa | 60–70 MPa |
| Tensile modulus | ISO 527-1:2019 | 2000–2600 MPa | 2200–2900 MPa | 2300–2500 MPa |
| Notched Izod impact, 23 °C | ISO 180/A | 15–25 kJ/m² | 35–60 kJ/m² | 65–80 kJ/m² |
| Heat deflection temperature, 1.8 MPa | ISO 75-1/2 | 85–100 °C | 105–130 °C | 125–135 °C |
| Melt volume-flow rate, 260 °C/5 kg | ISO 1133-1:2022 | 15–30 cm³/10 min | 8–25 cm³/10 min | 8–15 cm³/10 min |
In practice, the substitution boundary between B3100 and unfilled ABS is defined by creep and stiffness at 60–80 °C. General-purpose ABS loses load-bearing stiffness faster than ABS/PC in this temperature band, making the alloy suitable for internally heated enclosure components. The mold shrinkage of unfilled ABS/PC alloys is typically 0.005–0.008 mm/mm by ASTM D955-08, placing it between general-purpose ABS and polycarbonate homopolymer. Existing ABS tooling may therefore produce slightly different critical dimensions, while existing PC tooling may require adjustment of hold pressure. Against polycarbonate homopolymer, the main operational trade-off is chemical resistance: ABS/PC grades have poorer resistance to aromatic hydrocarbons, ketones, esters, and strong acids than high-molecular-weight polycarbonate. B3100 should not be exposed to toluene, xylene, strong acids, or alkaline water at elevated temperature without component-level testing. For painted or plated parts, adhesion must be revalidated because low-molecular-weight additives can migrate to the surface after molding and alter wetting or metal deposition. Published data for the specific B3100 formulation under aggressive solvents is limited; chemical exposure trials must be performed on molded plaques, not raw pellets.
Above 270 °C, polycarbonate chain scission and SAN phase decomposition begin to reduce molecular weight. The apparent melt flow may increase even at constant barrel temperature, creating a false signal of improved processability while the part loses weld-line strength and notched impact resistance. Production trials on general-purpose ABS/PC grades indicate that melt residence time above 270 °C should be kept below 5 min; barrel temperatures above 280 °C are not recommended unless the hot runner system has a validated short thermal history. A typical barrel profile is rear 230–250 °C, center 240–260 °C, front 250–270 °C, and nozzle 250–270 °C. Back pressure is usually restricted to 3–7 MPa, and screw rotation speed should produce plastication time within 70–85% of cooling time to avoid overheating. Mold temperature is maintained at 60–90 °C for unfilled grades. Mold temperatures below 50 °C increase delamination and surface gloss loss, while temperatures above 100 °C increase cycle time without a proportionate property gain.
When hot runner systems are used, hot drops should be fully externally heated, and dead zones should be eliminated to keep any portion of the melt from exceeding 10 min residence. Shut-off nozzles or valve gates can be used for larger shot weights. If a part shows splay or silver streaks despite verified drying, the first diagnostic step is to measure melt residence time and nozzle temperature rather than increase drying time. The interaction between moisture, shear heating, and thermal degradation is nonlinear; a screw with excessive compression ratio or high back pressure can generate local melt temperatures above 300 °C even when barrel sensors read lower.
Impact strength is a more sensitive indicator of ABS/PC degradation than tensile yield stress. In molded plaques exposed to excessive residence or hot-runner shear, the notched Izod value may drop by 20–40% before tensile strength changes by more than 5%. Therefore, production approval for B3100 should include notched Izod testing under ISO 180/A or ASTM D256-10, preferably on specimens cut parallel and perpendicular to flow. Weld-line tensile specimens machined from a double-gate plaque are recommended for evaluating degradation at knit lines. If tensile strength is used alone, a degraded lot may pass incoming inspection and later crack at snap-fit features in service. Melt flow rate under ISO 1133-1:2022 should be recorded at the start and end of each production run; a shift of more than 15% indicates unacceptable molecular weight change for most structural enclosures.
Injection molds for B3100 should use closed-loop control with cavity pressure monitoring. For wall thicknesses between 1.5 mm and 3.0 mm, injection velocities of 30–90 mm/s are typical, with transfer to pack pressure triggered by screw position rather than time. Hot runner systems should use full-length external heating and avoid stagnation. Cold runner sprue and runner diameters should remain above 5 mm for thin-wall parts to prevent premature freeze-off. Vent depths of 0.02–0.05 mm should be placed at flow-front end positions. Insufficient venting can produce gas marks that are mistaken for moisture splay even when residual moisture is within specification. Weld-line strength in ABS/PC alloys can be as low as 50–70% of neat material strength; weld lines should be located away from snap-fit retention features, bosses, and impact load paths.
Regulatory compliance for Dongguan Baoli ABS PC B3100 must be confirmed against the supplier’s lot-specific declaration. Typical requirements include the REACH candidate list declaration under Regulation (EC) No 1907/2006, restrictions under RoHS Directive 2011/65/EU, and, if applicable, UL 94 flammability classification. No food-contact claim should be made without a written FDA 21 CFR 177 or EU Regulation (EU) No 10/2011 statement for the specific grade and lot. Automotive interior applications may require low volatile or odor screening under VDA 278 or ISO 12219-2; not all unfilled ABS/PC alloys meet low-emission interior limit values. If B3100 carries no UL Yellow Card, flammability class cannot be assumed from another ABS/PC product. Under continuous underhood heat-soak exposure above 110 °C, an unfilled ABS/PC grade is unlikely to be suitable; published data for this specific configuration is limited, and component-level testing under the actual thermal profile should be performed.
The use of B3100 is most consistent with automotive interior trim brackets, appliance consoles, handheld power-tool housings, electrical switchgear covers, and consumer electronics enclosures. These applications require notched impact resistance, moderate heat deflection, dimensional stability, and good injection molding flow but do not involve severe chemical exposure or sustained load at high temperature. In thin-wall work, flow-length-to-wall-thickness ratios of 100:1 to 150:1 are attainable with adequate gate size and packing pressure, but weld lines remain the dominant failure origin. For electroplated or vacuum-metallized parts, the ABS phase content improves adhesion relative to polycarbonate homopolymer, but the grade must be free of exudating mold release and low-molecular-weight surface additives.