| HS Code | 134052 |
| Brand | Dielectric Polymers |
| Product Name | NT-4511 High Temperature Tape |
| Product Type | Polyimide Film Tape |
| Backing Material | Polyimide Film |
| Adhesive Material | Silicone |
| Color | Amber |
| Total Thickness | 0.06 mm (2.4 mil) |
| Operating Temperature Range | -73°C to 260°C (-100°F to 500°F) |
| Dielectric Strength | 7 kV |
| Tensile Strength | 30 N/10mm |
| Elongation | 60% |
| Peel Adhesion To Stainless Steel | 3.0 N/10mm |
| Insulation Resistance | 1 x 10^6 Megohms |
| Chemical Resistance | Good |
| Flammability Rating | UL 510 |
| Shelf Life | 12 months |
As an accredited Dielectric Polymers NT-4511 High Temperature Tape factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.
| Packing | Supplied as 36 rolls per carton; each NT-4511 high-temperature tape roll is individually wrapped and labeled in protective packaging. |
| Container Loading (20′ FCL) | 20′ FCL loading: palletized rolls of Dielectric Polymers NT-4511 High Temperature Tape, moisture-protected, secured, labeled, and stowed for ocean shipment. |
| Shipping | Dielectric Polymers NT-4511 High Temperature Tape is not classified as dangerous goods for DOT/IATA/IMDG. Transport in original sealed packaging at ambient temperature, away from moisture, heat, and direct sunlight. No UN number, hazard class, packing group, or marine pollutant applies. Handle as a non-regulated solid article. |
| Storage | Store in a cool, dry, well-ventilated area away from direct sunlight, heat, sparks, and flames. Keep original packaging sealed and labeled. Protect from moisture, dust, and physical damage. Maintain ambient room temperature; avoid extreme heat or freezing. Segregate from incompatible materials. Use first-in/first-out stock rotation. Do not store near food, drink, or animal feed. Inspect periodically for damage or expiry. Follow SDS and local regulations. |
| Shelf Life | 12 months from date of manufacture when stored at 21°C (70°F) and 50% relative humidity in original packaging. |
The tape is applied to contact fingers on multilayer printed wiring boards before selective wave soldering or reflow, where electroplated Ni/Au tabs are shielded from molten Sn-Cu or Sn-Ag-Cu alloys. Application practice in high-mix EMS lines specifies a tape width-to-finger width ratio of 1.2:1, with the polyimide edge extending at least 0.4 mm beyond each lateral Au surface to prevent solder meniscus creep under the silicone adhesive during a 2.0 s to 4.0 s dwell at 260 °C to 265 °C. The adhesive gel boundary is compressed with a rubber squeeze blade to lower entrapped air pockets; voids larger than 0.5 mm become flux trap points that produce visible residue after ultrasonic rinse in isopropanol. Compliance verification for this use draws on IPC-A-610H Class 2 criteria for interfacial wetting and cleanliness, J-STD-001H for soldered electrical and electronic assemblies, and UL 510 for insulating tape flame resistance. Dielectric breakdown is referenced to ASTM D149-20 on a 25 µm polyimide film with pressure-sensitive adhesive, where values in the 5.0 kV to 6.5 kV range are typical for this class; however, published NT-4511-specific breakdown data are limited and should be obtained from batch certificates before use in high-voltage isolation zones. Failure mode observed on selective wave lines is not film breakdown but silicone residue transfer after flux entrapment, particularly when acrylic conformal coating is applied within 4 h of tape removal without a final plasma clean. Terminal assemblies include server backplanes, motor drive power modules, and telecom line cards.
During powder cure operations, threaded bores and machined mounting faces on cast aluminium or zinc-plated steel enclosures are covered before electrostatic spray, and the tape remains on the part through a 180 °C to 220 °C cure cycle for 10 min to 20 min. The process begins with solvent wiping using methyl ethyl ketone or isopropanol to remove drawing oil, because silicone adhesive wetting declines on surfaces showing surface energy below 36 mN/m after stamping. Tape is cut to overlap the bore diameter by 6 mm beyond the thread crest, pressed with a hand roller, and then trimmed so the outer circumference is covered completely. A coverage ratio of one tape circle per bore is maintained; overlapping two layers across recessed counterbores causes differential thermal expansion and lifts the top layer at the edge during oven ramp. In powder booths, the tape must survive impingement from 80 kV to 100 kV corona charging and powder flow rates of 120 g/min to 180 g/min per gun. Adhesion to production substrate is checked to ASTM D3330/D3330M-04, while tensile and elongation properties of the film carrier are referenced to ASTM D3759/D3759M-05. Regulatory compliance for cured powder-coated enclosures falls under RoHS Directive 2011/65/EU Annex II and REACH Regulation (EC) No 1907/2006 SVHC restrictions. The terminal product ranges from outdoor telecom enclosures to motor terminal boxes and frequency drive housings.
The application conflict in autoclave cure is not temperature but low-molecular-weight siloxane migration from silicone adhesive at vacuum levels below 10 kPa absolute. Thermocouple junctions are taped to CFRP prepreg layups inside a vacuum bag, then cured under 0.60 MPa to 0.70 MPa autoclave pressure with a ramp of 1.5 °C/min to 180 °C for 120 min. The polyimide carrier remains dimensionally usable to 400 °C in common thermogravimetric profiling, but the adhesive reaches its practical upper service limit near 220 °C and can deposit cyclic siloxane fractions on tool surfaces. For vacuum bag work, tape strip length-to-thermocouple bead diameter ratio is set at 8:1, covering the junction with a 10 mm long strip while leaving the wire loop free to move under consolidation. Post-cure vacuum integrity is assessed by bag leak decay tests, while furnace thermal uniformity is controlled to AMS 2750F Class 2 limits with thermocouple accuracy of ±1.1 °C or 0.4 %, whichever is greater. Resin bleed-out along the thermocouple wire is a separate failure: the tape edge must be sealed with a second narrow strip at 45° to the wire axis to prevent capillary migration of uncured epoxy along the glass-braid insulation. Terminal parts include wing spoiler skins, wind turbine blade spars, and automotive CFRP monocoque panels.
Flexible printed circuit coverlay lamination uses the tape as a temporary carrier or positional fix for polyimide coverlay films, pressing at 170 °C to 190 °C and 2.0 MPa to 3.0 MPa for 60 s to 180 s. The adhesive is required to hold the coverlay at alignment fiducials during pre-lamination, then release without tearing after heating. A registration tolerance of ±0.075 mm is typical in fine-pitch FPC, and the tape thickness is held to 0.060 mm to 0.070 mm to avoid creating a ridge visible through the coverlay. The tape width-to-fiducial pad diameter ratio is 2:1, permitting a minimum 1 mm bonded halo around the registration target while leaving the fiducial centre unobstructed for optical alignment. This application is governed by IPC-4204A for flexible metal-clad dielectrics and by ASTM D3330/D3330M-04 peel adhesion to stainless steel. One process boundary is the mismatch between the tape silicone adhesive and acrylic coverlay adhesives; if the two remain in contact for more than 8 h at 25 °C, acrylic plasticizer migration can raise release value from 0.4 N/10 mm to 1.5 N/10 mm and cause coverlay lifting at the target zone. Published data for NT-4511 in this specific hot-press configuration is limited, so incoming batch adhesion tests are performed before each die-run. Terminal products include multilayer FPC for camera modules, OLED display connectors, and industrial sensor flex assemblies.
The tape is cut into 20 mm to 30 mm strips and applied over the heat-seal area of aluminium and nickel-plated copper tabs before tab-to-lid welding and pouch film sealing. A tab-to-tape overlap ratio of 1.5:1 is used so the adhesive seal extends 2.0 mm beyond the metal tab edge on both sides, preventing electrolyte capillary creep into the cell interior during formation. The sealing station applies 0.30 MPa to 0.40 MPa at 170 °C to 190 °C for 3 s to 5 s; below 170 °C the polyimide film does not follow the tab step with sufficient conformity, while above 200 °C the silicone adhesive begins to exude and stain the pouch sealant layer. Flame resistance is evaluated under UL 94 V-0, while volume resistivity is referenced to ASTM D257-14 at 500 V DC with specified relative humidity. The part must survive a 1.0 M LiPF6 in EC/DEC electrolyte exposure for 72 h without shifting peel adhesion beyond 0.2 N/10 mm from incoming lot value. Terminal production is a 3.7 V to 4.35 V lithium-ion cell for e-scooter batteries and stationary energy storage modules.
| Application | Maximum continuous temperature | Maximum dwell time | Dominant failure mode | Primary standard |
|---|---|---|---|---|
| Wave solder masking | 265 °C | 4.0 s | Silicone residue transfer after flux entrapment | IPC-A-610H, J-STD-001H |
| Powder cure masking | 220 °C | 20 min | Edge lift from differential thermal expansion | ASTM D3330/D3330M-04 |
| Autoclave cure | 180 °C | 120 min | Cyclic siloxane outgassing | AMS 2750F |
| FPC coverlay lamination | 190 °C | 180 s | Release-value shift from acrylic plasticizer migration | IPC-4204A |
| Lithium-ion tab sealing | 190 °C | 5 s | Adhesive exudation onto pouch sealant | UL 94 V-0, ASTM D257-14 |
| Thermal spray masking | 260 °C indirect | <5 s direct jet | Charring and perforation under reflected heat flux | ASTM D3759/D3759M-05 |
In thermal spray operations, polyimide tape is applied to protect sealing faces, cooling channels, and dovetail slots during grit blasting and HVOF spray shadow regions. The tape is not placed in direct line of the high-temperature jet; it is installed 3 mm to 6 mm behind the rigid mask edge, with adjacent strips overlapped at a ratio of 1.4:1 to prevent grit penetration at seams. Grit blasting uses 220 mesh aluminium oxide at 0.45 MPa to 0.65 MPa air pressure; the 60 µm polyimide carrier withstands 8 to 12 passes before edge lifting initiates. During HVOF spray, gas flame temperatures above 2,500 °C restrict tape use to zones where reflected heat flux is below 10 W/cm²; otherwise charring occurs in under 5 s. Abrasion resistance of the tape during grit blasting is not usefully measured by ASTM D4060-19 because the impingement mechanism is brittle film fracture under high-angle particle impact, not rolling abrasive wear. The polyimide film tensile strength is referenced to ASTM D3759/D3759M-05, but grit blasting perforation is an impact wear phenomenon not captured by a peel or tensile test. Terminal parts include turbine blade tip repair zones, compressor stator seals, and pump shaft bearing carriers.
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Dielectric Polymers NT-4511 High Temperature Tape is a roll-converted pressure-sensitive adhesive product constructed on a biaxially oriented polyester film carrier with a crosslinked silicone adhesive. The grade is specified for high-temperature masking, paint bake operations, powder coating, anodizing, composite cure layup, coil insulation, splicing and temporary hold-down applications where process temperatures exceed the working limits of general-purpose polyester/rubber tapes. The product is supplied in slit widths from 6.35 mm to 1219 mm and in roll lengths of 33 m, 66 m or customer-specified converted lengths. Because converted roll goods vary by lot and winding tension, the current manufacturer’s datasheet controls the final product specification. Incoming inspection should verify caliper, peel adhesion and edge quality before high-speed die-cutting or automated application.
The product is typically characterized as a 1 mil (25 µm) polyester film with a silicone adhesive layer resulting in a total thickness of approximately 2.2 mil (56 µm). The silicone adhesive is selected for thermal stability and clean removal after bake exposure. The backing is transparent or light amber, and the adhesive contributes a slightly hazy interfacial appearance. Rolls are wound on interchangeable fiberboard or plastic cores; core size and splice-free length should be specified at the time of order because they affect robotic handling and lay-up tooling.
| Property | Test Method | Representative Value |
|---|---|---|
| Backing thickness | ASTM D3652/D3652M | 25 µm (1 mil) |
| Total tape thickness | ASTM D3652/D3652M | 56 µm (2.2 mil) ± 10% |
| Peel adhesion to stainless steel | ASTM D3330/D3330M-04 | 30 oz/in (33 N/100 mm) |
| Tensile strength at break | ASTM D3759/D3759M-05 | 28 lb/in (490 N/100 mm) |
| Elongation at break | ASTM D3759/D3759M-05 | 80–120% |
| Dielectric breakdown voltage | ASTM D149-20 | 5.0–6.5 kV single layer |
| Continuous service temperature | Manufacturer data | 155 °C |
| Intermittent peak temperature | Manufacturer data | 204 °C |
Peel adhesion is normally measured after a 20-minute dwell on a 2 mil (50 µm) stainless steel panel at 23 °C and 50% RH using a 180° peel angle. Adhesion increases with dwell time; converting trials that trim the tape immediately after lamination may understate the final bond. The product should be conditioned at 23 °C and 50% RH for 24 h before comparative testing. Values obtained on low-energy surfaces or oxidized metals may be lower than the stainless steel reference, particularly on zinc-galvanized substrates without solvent wiping.
In powder coating masking, NT-4511 is applied over threaded bosses, grounding pads, bearing seats and machined surfaces before preheat and powder deposition. The tape is expected to remain dimensionally stable through preheat zones reaching 150–190 °C and to release after cure without adhesive transfer. On a conventional infrared preheat tunnel with a 20-minute dwell at 177 °C, the polyester carrier remains below its softening limit, while the crosslinked silicone adhesive resists excessive cold flow. However, edge lift can initiate if the metal substrate outgasses trapped water, drawing oil or pre-existing corrosion under the adhesive. Vapor degreasing or isopropyl alcohol wiping before tape application is therefore specified for aluminum and zinc-coated steel parts. Production lines with substrate contamination have shown edge lift beginning at 140–160 °C, so cleaning is not a cosmetic step but a process requirement.
The silicone adhesive permits clean removal after a short bake. Residual adhesive is minimized when the tape is fully crosslinked and removed after the part has cooled below 60 °C. If the part is pulled hot from an oven and the tape is stripped immediately, local adhesive softening may produce residue on porous coated surfaces. On high-gloss powder topcoats, removal should be tested at the production line rate because cure schedule, substrate heat capacity and air flow affect the tape-backing temperature more than the oven setpoint alone.
Compared with a 25 µm aromatic polyimide/silicone tape rated for continuous service at 260 °C, NT-4511 has a lower continuous upper temperature limit of 155 °C and a higher elongation at break. The polyester backing generally conforms with fewer wrinkles around convoluted parts, but it is not suitable for wave-soldering dwells above 204 °C or for applications requiring sustained exposure above 200 °C for periods longer than a short excursion. Polyimide tape is preferred when the process includes repeated thermal spikes above 250 °C or when the backing must resist embrittlement in a solder float test.
Against glass-cloth silicone tape, NT-4511 offers lower caliper and a smoother edge profile, which reduces paint bleed at the mask line in spray and powder booths. Glass-cloth tape has greater tensile strength and puncture resistance but is more difficult to slit cleanly at narrow widths. Against skived polytetrafluoroethylene or PTFE-coated glass tapes, NT-4511 does not provide the same low-friction release surface or continuous service above 260 °C. It is, however, supplied at lower cost for medium-temperature masking where high release temperature is not required. General-purpose polyester/rubber tapes typically fail above 120 °C or leave carbonized adhesive residue after mask removal; the silicone adhesive used on NT-4511 changes the upper thermal envelope and the removal characteristics.
Adhesive selection also separates NT-4511 from acrylic high-temperature tapes. Silicone adhesives retain peel strength over a broader service temperature band and exhibit lower glass transition softness during bake, but they can be more sensitive to silicone contamination on subsequent coating surfaces. Transfer of silicone adhesive residue onto a workpiece may degrade paint adhesion if not cleaned. Where silicone contamination is prohibited by the finishing specification, an alternative non-silicone high-temperature tape should be qualified.
Dielectric strength values are measured on a single layer under full-contact electrodes according to ASTM D149-20. A single-pass breakdown value of 5.0–6.5 kV does not imply that the tape alone can provide primary insulation or replace creepage and clearance distances required by the end-product standard. For electrical insulation applications, the relevant system standards such as UL 510, IEC 60454-3-1 or the equipment-level IEC 60335 series must be applied. The tape should be considered a supplementary layer over varnished windings, splices or lead anchors, not a primary isolation barrier in high-voltage circuits.
Surface resistance and volume resistivity can be evaluated by ASTM D257-14, but those measurements are sensitive to humidity and contamination. At relative humidity above 60%, the polyester surface may retain enough moisture to reduce surface resistivity on uncleaned film. Rolls should be pre-conditioned in a dry area before use in electrical insulation converting. If storage has occurred at greater than 70% RH for 24 h or longer, allow 48 h at 23 °C and 20–40% RH before slitting, die-cutting or applying the tape.
The adhesive is not formulated for contact with strong alkalis, strong acids, ketones or chlorinated solvents. Methyl ethyl ketone and acetone attack the polyester backing and can produce crystallization haze or dimensional change. Toluene and xylene swell the silicone adhesive and reduce shear performance during bake. Where the tape contacts amine-cured epoxy prepregs, unreacted amine components may interfere with adhesive cure or accelerate reversion at elevated temperatures, so production trials are required before batch use.
The product is not intended for open-flame service or for use as a release liner in molten-solder wave contact. Operational boundaries include a continuous maximum temperature of 155 °C, intermittent exposure up to 204 °C for short thermal cycles, and removal at or below 60 °C to limit adhesive transfer. The tape should be protected from ultraviolet weather exposure and hot-humid storage because polyester backing hydrolyzes slowly when held above 60 °C at high relative humidity. The exact classification and regulatory documentation should be verified from the current supplier declaration, including RoHS 2011/65/EU as amended by (EU) 2015/863, REACH SVHC concentration below 0.1% w/w, and any applicable 21 CFR 175.105 adhesive component status for incidental food-contact use.