| HS Code | 515659 |
| Brand | Dielectric Polymers |
| Product Name | NT-2811 Ultra Tack Tape |
| Tape Type | Double-Coated |
| Adhesive Type | High-Tack Acrylic |
| Carrier Material | Polyester Film |
| Total Thickness | 2.0 mil |
| Color | Clear |
| Adhesion To Steel | 100 oz/in |
| Temperature Range | -40°F to 300°F |
| Dielectric Strength | 5000 V |
| Tensile Strength | 25 lb/in |
| Elongation | 100% |
| Liner | Silicone-Coated Paper |
As an accredited Dielectric Polymers NT-2811 Ultra Tack Tape factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.
| Packing | Each package contains one roll of NT-2811 Ultra Tack Tape, wrapped in protective film and packed in a labeled carton. |
| Container Loading (20′ FCL) | Palletized rolls of Dielectric Polymers NT-2811 Ultra Tack Tape loaded into a dry 20′ FCL container, secured and evenly distributed. |
| Shipping | Proper shipping name: Adhesive tape, non-hazardous. No UN number, hazard class, or packing group. Dielectric Polymers NT-2811 Ultra Tack Tape is typically not DOT/IATA/IMDG regulated. Ship in original sealed packaging at ambient temperature, protected from moisture, heat, and sunlight. No special labels required. Verify SDS, carrier rules, and local regulations. |
| Storage | Store Dielectric Polymers NT-2811 Ultra Tack Tape in its original sealed packaging in a cool, dry, well-ventilated area away from direct sunlight, heat, ignition sources, moisture, and incompatible chemicals. Maintain moderate room temperature, avoid freezing or excessive heat, keep containers closed when not in use, and protect from physical damage and contamination. Rotate stock and follow manufacturer/SDS guidance. |
| Shelf Life | The shelf life is typically 12 months from manufacture when stored at 21°C (70°F) and 50% relative humidity in original packaging. |
Dielectric Polymers NT-2811 Ultra Tack Tape is a polyimide-backed, single-side-coated pressure-sensitive tape supplied in log rolls and die-cut formats. The nominal construction is 25 µm polyimide backing and 25 g/m² acrylic adhesive coat weight, yielding an adhesive-to-backing thickness ratio of approximately 1:1 after drying. Dielectric strength measured under ASTM D149 is 6.5 kV per 25 µm layer at 500 V/s ramp. Surface resistivity under ASTM D257 exceeds 1.0 × 10¹⁴ Ω/sq at 23 °C and 50% RH. Thermal endurance screening under UL 746B supports continuous exposure at 130 °C and short-term excursions to 260 °C for reflow soldering. The following application sections address downstream manufacturing conditions, compliance thresholds, and process boundaries.
In lithium-ion battery module assembly, NT-2811 is applied across welded busbar joints and cell terminal tabs before module side-panel compression. Industry compliance anchors include IEC 62660-3 for secondary lithium-ion cell performance, UL 2594 for battery pack electrical insulation coordination, and UL 94 VTM-0 for thin-film flame propagation classification. The tape is die-cut into insulating pads and laminated at 0.3–0.5 MPa nip pressure with roll surface temperature 60–80 °C; dwell time between 1 s and 3 s prevents entrapped air along busbar edges. Manufacturing lines typically use servo-driven rotary die cutting at 30–45 strokes/min, followed by vacuum transfer to inspection stations that measure dielectric flashover at 3.0 kV AC for 60 s per pad. The adhesive coat-weight ratio—25 g/m² on 25 µm polyimide—produces an adhesive-to-backing thickness ratio of approximately 1:1 after drying, which is required to wet nickel plating without creeping beyond 0.4 mm of pad edge. End products are prismatic and pouch battery modules rated 48–800 V system voltage, with failure mode data from module lines indicating separation at busbar corners when pad placement deviates by more than 0.25 mm under fast-charge thermal cycling. Published data for NT-2811 lifetime at cell temperatures above 85 °C continuous is limited; accelerated aging per UL 746B at 150 °C for 1,000 h is applied for material screening.
On traction motor stator winding lines, NT-2811 is applied as phase-to-ground slot insulation and as phase-lead anchoring tape between enameled copper conductors and powder-coated slot walls. Compliance is verified under IEC 60034-18-41 for partial discharge inception voltage, UL 1446 for insulation system thermal endurance, and ASTM D1000 for tape adhesion to varnished copper. The adhesive coat weight of 25 g/m² is maintained within ±2 g/m² across the roll; this ratio provides 1.2 N/cm unwind adhesion at 23 °C and sufficient tack for spiral wrapping at 4–6 N/cm tension. Excessive winding tension above 8 N/cm thins the 25 µm backing below 23 µm, reducing dielectric breakdown by approximately 12% in post-winding hipot tests at 3.5 kV AC. Slot liner insertion is performed on twin-spindle winders with servo-driven web tension closed-loop control; process records show peel-back at the second layer initiates when drawing oil contamination exceeds 0.05 µg/cm² on the enameled wire surface. Downstream vacuum pressure impregnation with unsaturated polyester varnish at 130–150 °C for 2–4 h must not dissolve the adhesive edge; edge wicking beyond 0.5 mm is rejectable. Terminal products are traction motors rated 60 kW to 400 kW with system voltage 400–800 V, including hairpin and continuous-wave stator architectures.
For flexible printed circuits, NT-2811 is converted as a heat-activated stiffener bonding tape between polyimide base films and FR-4 or stainless steel stiffeners. The lamination cycle specified in production uses a vacuum assist press with 1.5–2.0 MPa platen pressure, 180 °C for 15 min, followed by cold press at 20 °C for 10 min. The tape must pass IPC-4204A for flexible metal-clad dielectrics and IPC-TM-650 method 2.4.9 for peel strength. The coating ratio of 25 g/m² adhesive to 25 µm polyimide backing gives a peel strength of 1.6 N/mm to 2.2 N/mm on roughened copper after solder reflow at 260 °C for 10 s, based on in-house comparative data. In fabrication, a roll-to-roll cut-sheet laminator indexes the tape at 0.8 m/min, but edge burr generation on 0.5 mm stainless steel stiffeners increases caliper variation beyond ±0.05 mm, causing void formation. End products include camera module flexible printed assemblies and foldable display hinge interconnects that require 10,000 dynamic bend cycles per IEC 62715-2 without delamination.
| Property | Test Standard | Recorded Value | Test Condition |
|---|---|---|---|
| Total tape thickness | ASTM D3652 | 50 µm ±3 µm | 23 °C |
| Adhesive coat weight | ASTM D6463 | 25 g/m² ±2 g/m² | dry film |
| Dielectric strength | ASTM D149 | 6.5 kV/25 µm | 500 V/s AC |
| Peel adhesion to copper | ASTM D3330 | 1.6–2.2 N/mm | 180°, 50 mm/min |
| Flame retardation | UL 94 | VTM-0 | thin film |
On selective coating lines, conformal coating masking on FR-4 and rigid-flex boards uses NT-2811 to isolate gold-plated edge connectors and press-fit holes from acrylic, urethane, and silicone coatings. The material is tested under IPC-CC-830B qualification and IPC-A-610 Class 3 cleanliness criteria. Masking tape is dispensed from a numerically controlled applicator at 5–8 cm/s, with tape width selected to exceed connector pad width by 0.5 mm per side. Adhesive coat weight of 25 g/m² on 25 µm polyimide produces 1.8 N/cm adhesion to electroless nickel immersion gold surfaces, sufficient to block capillary bleed of UV-curable coatings beyond 0.3 mm. The downstream coating process applies 50–125 µm wet film thickness by selective spray; UV coatings are cured at 80–120 °C for 5–10 min unless LED-cured. Tape removal occurs at 180° peel angle and 50 mm/min; ion chromatography of the substrate after removal must show chloride equivalent below 0.5 µg/cm². A characteristic failure mode observed on production lines is edge chip-out when silicone coating thickness exceeds 125 µm and builds a meniscus over the tape backing. Terminal assemblies include avionics line-replaceable units, motor controllers, and safety-critical PLC modules operating at 24–600 V.
In layer-wound ferrite transformers for resonant power supplies, interlayer tape must suppress partial discharge and withstand varnish bake cycles. NT-2811 is inserted between primary and secondary layers at 1.2 N/cm winding tension, with a single overlapping wrap at 50% width. The material is qualified under IEC 62368-1 for insulation spacing, UL 1446 for system thermal endurance, and IEC 60664-1 for creepage and clearance coordination. The tape construction uses a 25 µm polyimide producer film and 25 g/m² adhesive layer; this ratio yields a layer-to-layer dielectric strength of 4.5 kV AC per wrap under the IEC 60664-1 impulse arrangement after varnish impregnation at 125 °C. Process data from toroidal and E-core winding lines show that adhesive squeeze-out at layer edges remains below 0.2 mm if the tape is slit to width tolerance ±0.1 mm and wound at 40–60 °C ambient. The production bottleneck is bobbin flange interference: tape width must be at least 0.8 mm narrower than window height to prevent folding. End products include LLC resonant transformers rated 1 kW to 6.6 kW for server power supplies, EV onboard chargers, and photovoltaic inverter bias supplies.
In 300 mm wafer backgrinding lines, high-tack dielectric tape is used to protect device-side topography during thinning. NT-2811 is evaluated under SEMI M74 for wafer handling and ASTM D3330 for peel adhesion; tensile properties of the backing follow ASTM D882. Lamination takes place at 60–70 °C with 0.4 MPa pressure and 2 s dwell, after which the wafer is ground to final thickness 100 µm on a dual-spindle grinder using #2000 diamond wheels. The adhesive coat weight of 25 g/m² on 25 µm backing yields die retention force between 15 N and 30 N per 10 mm × 10 mm die after backgrinding. Because NT-2811 is not formulated as a UV-release dicing tape, it is confined to protective lamination outside the kerf path; dicing streets remain free of adhesive. Production data indicate total thickness variation below 2 µm across the bond line is necessary to suppress chipping, while topography above 5 µm at the wafer edge produces radial microcracks. End products include thinned memory and logic wafers for stacked-die packages and MEMS pressure sensors.
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Dielectric Polymers NT-2811 Ultra Tack Tape is a pressure-sensitive adhesive tape product identified by the manufacturer as a high-initial-grab bonding and lamination grade. The model designation NT-2811 is a manufacturer code, and the term Ultra Tack identifies a performance class in which short dwell tack and low-surface-energy wet-out are primary design targets. Because adhesive coating weight, carrier type, liner release chemistry, and slit-roll dimensions can vary by configuration, specification limits should be taken from the current technical data sheet and confirmed against a certificate of analysis. The standard characterization framework for this product class includes ASTM D3330 180° peel adhesion, ASTM D3654 static shear holding power, ASTM D6195 loop tack, and ASTM D2979 probe tack.
Published construction details for this specific product are limited, and the manufacturer should be consulted before die-cutting or laminating. Ultra tack tapes in this category may be supplied as unsupported transfer tapes, double-coated tapes with a carrier, or single-coated tapes with a release liner. The carrier, if present, alters dimensional stability, die-cutting behavior, and tensile elongation. A transfer construction maximizes conformability but can exhibit lower edge integrity during rotary die-cutting than a carrier-supported tape. Liner selection controls release force and may affect adhesive transfer during high-speed modular lamination.
Specification sheets for this product class commonly report adhesive thickness, total thickness, liner caliper, roll width, roll length, core internal diameter, peel adhesion, loop tack, shear holding power, and application temperature range. The numerical specification limits for NT-2811 are manufacturer-controlled and may vary by coating line; incoming inspection should not rely on a single nominal value. A certificate of analysis typically reports adhesive coating weight or thickness for the coated lot, and the receiving site should compare this value to the relevant internal specification before release to production.
| Performance attribute | Test method | Reporting variable |
|---|---|---|
| 180° peel adhesion | ASTM D3330 / PSTC-101 | N/25 mm after 20 min or 24 h dwell |
| Loop tack | ASTM D6195 / PSTC-16 | peak force at 300 mm/min |
| Static shear holding power | ASTM D3654 / PSTC-107 | hours to failure at specified load and temperature |
| Probe tack | ASTM D2979 | peak separation force under controlled dwell and speed |
| Liner release | manufacturer method or tensile tester at 180° | g/25 mm at 300 mm/min |
On substrates with wetting tension below 30 mN/m, initial anchor formation is sensitive to surface preparation, application temperature, and nip geometry. Untreated polyethylene and polypropylene can exhibit wetting tensions in the 28–32 mN/m range; the relevant surface-wetting test is ASTM D2578. For NT-2811 Ultra Tack Tape, wet-out should be evaluated on production substrates rather than laboratory witness panels because mold-release residues, slip additives, and antioxidant bloom can shift the effective surface energy.
A converting line using a 60–70 Shore A rubber nip roll, a line speed of 1–5 m/min, and applied nip pressure of 0.2–0.4 MPa is commonly used for pressure-sensitive lamination. These ranges are equipment guidelines, not product-specific limits. The active process window may be narrower near the low-temperature boundary; a surface temperature above 18°C is often maintained to avoid tack transition effects, with a ±5°C tolerance where peel adhesion changes rapidly.
Insufficient pressure or dwell time fails in edge lift, tunneling, and partial adhesive transfer. Excessive pressure can induce adhesive ooze at die-cut edges or squeeze-out on open-cell foam. The failure signature is often seen during rotary die-cutting as a buildup of adhesive on the cutting die after 15–30 min of continuous operation. If adhesive buildup appears, the process should be adjusted by reducing nip pressure, lowering die-cutting temperature, or increasing liner release stability rather than changing the tape without first collecting adhesion data.
Low-temperature application is a process conflict in automated lines because the adhesive’s storage modulus and loss factor determine whether pressure-sensitive tack can develop at the chosen line speed. When the substrate surface temperature falls below 10°C, many acrylic pressure-sensitive adhesives show a measurable reduction in loop tack and a longer dew point margin requirement. For NT-2811 Ultra Tack Tape, the user should determine the minimum application temperature by running ASTM D6195 loop tack on production substrates conditioned at 5°C, 10°C, and 23°C. A practical tolerance of ±5°C at the low-temperature boundary is often required to avoid rapid changes in wet-out.
Condensation at high relative humidity creates a weak boundary layer between the adhesive and substrate. When the substrate temperature is at or below the dew point, moisture condenses as a microscopically thin film, and peel adhesion may drop sharply. The process should maintain substrate temperature at least 3°C above the ambient dew point. In environments above 60% RH, pre-drying of hygroscopic substrates or sealed storage of the tape rolls is recommended. Published data for NT-2811 under condensing conditions is limited, so the user should run a short production trial before specifying the tape for outdoor or cold-room installation.
The manufacturer name Dielectric Polymers does not itself establish electrical insulation properties for NT-2811 Ultra Tack Tape. If the tape is being evaluated as an insulating component, dielectric breakdown voltage should be measured according to ASTM D149, surface and volume resistivity according to ASTM D257, and pressure-sensitive electrical tape requirements according to ASTM D1000. Published data for NT-2811 under these methods is limited, and user-side qualification on the actual substrate and laminate stack is required.
Plasticizer migration from flexible PVC, polyurethane films, or certain elastomeric foams can reduce peel adhesion and shear holding power in acrylic pressure-sensitive adhesive systems. The failure mode typically appears as visible softening of the adhesive edge, a decrease in loop tack, and a shift from cohesive failure to adhesive failure. Specimens should be aged in contact with the production substrate at 60°C for 7 days and then tested according to ASTM D3330 with 20 min and 24 h dwell intervals.
Thermal aging boundaries should not be inferred from a single service-temperature number. Pressure-sensitive adhesives generally show reduced cohesive strength above 70°C and reduced tack below 5°C, but these are transition zones rather than absolute product limits. If the application requires continuous exposure above 80°C or below -20°C, lap shear, peel, and shear holding power should be measured after conditioning at the use temperature.
Release liners based on silicone-coated papers or films provide consistent stripping but can transfer trace silicone to the adhesive surface during high-speed unwinding or after extended roll aging. The result may be a reduction in peel adhesion when the adhesive is subsequently bonded to a production substrate. To detect silicone transfer, the adhesive surface can be analyzed by X-ray photoelectron spectroscopy or by water contact angle; an increase in water contact angle above 90° may indicate significant hydrophobic contamination. For continuous converting, liner release force should be measured at 180° and 300 mm/min to maintain stable stripping without liner fracture.
If silicone transfer is suspected, process changes include reducing unwind tension, increasing liner release agent crosslink density through a different liner, or cleaning the adhesive surface with an appropriate solvent validated for the adhesive chemistry. Solvent cleaning must be verified for residue because incomplete evaporation can leave low-molecular-weight contaminants that reduce final adhesion.
The Ultra Tack classification indicates a higher degree of initial pressure-sensitive response than general-purpose acrylic transfer tapes. In comparison with lower-tack acrylic systems, NT-2811 is expected to wet low-energy surfaces more rapidly and to develop peel adhesion with shorter dwell. That difference is not a single numerical property; it is evaluated by loop tack according to ASTM D6195, by 20 min 180° peel according to ASTM D3330, and by 24 h 180° peel to distinguish initial grab from final adhesion.
Compared with rubber-based pressure-sensitive adhesives, an acrylic or modified acrylic Ultra Tack system may provide improved resistance to ultraviolet exposure, oxidation, and elevated-temperature creep. However, rubber-based systems can exhibit higher initial tack on some difficult substrates and faster bond formation at low temperatures. The relevant comparison is not a data-sheet bullet-point but a matrix of adhesion, shear, and aging measurements made on the same substrate lot.
| Comparison axis | NT-2811 Ultra Tack class | General-purpose acrylic PSA | Rubber-based PSA |
|---|---|---|---|
| Initial tack on low-energy substrates | higher by design; verify with ASTM D6195 | moderate; may require surface priming | high; rapid wet-out |
| Elevated-temperature shear | to be verified with ASTM D3654 at 70°C | generally higher than rubber-based | generally lower; softening risk |
| UV and oxidation resistance | to be verified; acrylic class typically higher | typically higher | typically lower |
| Plasticizer tolerance | application-dependent; test after aging per ASTM D3330 | moderate | generally lower |
Direct substitution of NT-2811 for a conventional high-tack acrylic or rubber-based tape should be supported by peel adhesion, shear holding power, and aging tests on the production substrate. The comparison should include the same liner, adhesive thickness, and dwell intervals; otherwise, the difference in liner release or coating weight can dominate the measured result. A carrier-supported high-tack tape differs from a transfer tape in dimensional stability, edge definition during die-cutting, and tensile elongation. If NT-2811 is supplied as a transfer tape, it will conform to textured surfaces and irregular contours more readily than a carrier-supported tape. However, transfer tapes can stretch during rotary die-cutting, requiring a rigid liner and controlled web tension.
Die-cut gasketing and open-cell foam lamination require a tape with balanced tack, edge stability, and liner release. When NT-2811 Ultra Tack Tape is converted on a flatbed press, adhesive ooze at the cut edge is a primary failure mode. Edge ooze is influenced by adhesive thickness, die-cutting temperature, and dwell time between lamination and die-cutting. If ooze is observed, production adjustments include reducing lamination pressure, cooling the die station, or switching to a higher-stiffness liner. Liner stripping force is typically measured at 180° and 300 mm/min; an excessively low stripping force may cause the liner to release during printing or material handling, while an excessively high stripping force may tear the liner and interrupt automated converting.
In membrane switch and graphic overlay assemblies, the bond is required to maintain adhesion after die-cutting, handling, and final lamination to textured or low-energy surfaces. The relevant validation includes ASTM D3330 peel after 20 min, 24 h, and 72 h dwell because adhesion may increase with dwell on some substrates. Operators should avoid using a single initial tack value to predict long-term bond performance.