| HS Code | 230636 |
| Glass Transition Temperature Tg | 250-300°C |
| Dielectric Constant Dk | 2.8-3.2 at 1 MHz |
| Dissipation Factor Df | 0.002-0.005 at 1 MHz |
| Moisture Absorption | <1.5% after 24h water immersion |
| Thermal Decomposition Temperature Td | >400°C |
| Coefficient Of Thermal Expansion Cte | <50 ppm/°C below Tg |
| Flexural Strength | 120-180 MPa |
| Tensile Modulus | 3.0-3.5 GPa |
| Peel Strength To Copper | 0.8-1.2 N/mm |
| Flame Retardancy | UL94 V-0 achievable |
| Chemical Resistance | Resistant to acids, alkalis, and solvents |
| Adhesion To Fillers And Reinforcement | Excellent for glass fabric and ceramic fillers |
As an accredited Cyanate Ester (CE) Resin for High-Performance CCL & Packaging factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.
| Packing | Supplied in 25 kg sealed drums, ensuring moisture protection and safe handling for high-performance CCL and packaging applications. |
| Container Loading (20′ FCL) | 20′ FCL: 20-foot full container load of Cyanate Ester resin, securely packed, dry, ventilated, and protected for safe transit. |
| Shipping | The cyanate ester resin is shipped in sealed, moisture-resistant drums or pails to prevent hydrolysis. Standard ambient temperature transport is acceptable; avoid excessive heat or direct sunlight. Ensure proper labeling and secure stacking to prevent container damage during transit. Handle with care to maintain product purity for high-performance CCL and packaging applications. |
| Storage | Store cyanate ester resin in a cool, dry, well-ventilated area away from direct sunlight, heat, and ignition sources. Keep containers tightly sealed to prevent moisture absorption, which degrades performance. Ideal temperature range is 0–10°C (32–50°F) unless otherwise specified. Use within shelf life, and avoid contamination with acids, bases, or curing agents. |
| Shelf Life | Store below 5°C, sealed, dry, away from light; shelf life is 6 months from date of manufacture. |
Structural use of cyanate ester resin in high-layer-count digital CCL begins with varnish formulation rather than laminate construction. Bisphenol A dicyanate ester is blended with a low-molecular-weight polyphenylene ether modifier at a mass ratio of 55:45 to 70:30, and fumed silica is dispersed at 2–6 phr in methyl ethyl ketone to a solids content of 45–55%. The varnish is coated onto 1035 or 1078 E-glass and B-staged between 155°C and 170°C. Parallel-plate rheometry at 170°C must show a minimum melt viscosity of 250–600 Pa·s; below 150 Pa·s, resin squeeze-out starves the edges of a 550 mm × 620 mm vacuum lamination press, and above 800 Pa·s, wet-out of 100 µm copper traces is incomplete. Resin content is controlled to 52–58 wt% for single-ply constructions and 42–48 wt% for a 12-layer stack. The lamination cycle ramps at 2.5°C/min to 180°C, holds for 30 min at 2.0 MPa, then cures at 215°C for 90 min. A post-cure at 240°C for 2 h under nitrogen raises the glass transition by approximately 10°C. The terminal product is a halogen-free high-speed CCL for 112 Gbps SerDes backplanes. Dielectric performance at 10 GHz by IPC-TM-650 2.5.5.5 is normally 2.95–3.10 for Dk and 0.0038–0.0050 for Df. Edge-to-centre thickness variation above ±0.025 mm shifts a 100 Ω differential pair outside the impedance control window, so press padding is adjusted periodically to compensate for glass cloth tension loss.
After lamination, mechanical drilling at 120 kppm with 0.20 mm carbide bits produces higher flank wear than standard FR-4 because the triazine network is more abrasive. Desmear in alkaline permanganate at 80°C for 6–8 min removes 0.3–0.5 µm of resin smear, but over-etching beyond 10 min attacks the glass-resin interface and reduces conductive anodic filament resistance. Copper adhesion after oxide replacement is measured at 0.8–1.2 N/mm by IPC-TM-650 2.4.8. The process conflict is strict: low melt viscosity improves glass wet-out but increases resin movement at the edge, while high melt viscosity preserves thickness but creates void risk around tall copper features. This trade-off is managed through incoming prepreg melt-viscosity checks and press-pressure adjustments in 0.1 MPa increments.
| Formulation | Reinforcement | Dk at 10 GHz | Df at 10 GHz | Z-axis CTE | Typical application |
|---|---|---|---|---|---|
| Bisphenol A cyanate ester/PPE 55:45, 3 phr silica | 1035 glass, 52 wt% resin | 2.95–3.10 | 0.0038–0.0050 | 40–45 ppm/°C | 112 Gbps digital CCL |
| DCPD cyanate ester/epoxy novolac 80:20, 2 phr silica | Quartz 4581, 35 wt% resin | 2.85 | 0.0040 | 30–38 ppm/°C | Airborne radar radome |
| Novolac cyanate ester/phosphazene 70:30, 10 phr silica | 106 glass, 55 wt% resin | 3.05–3.15 | 0.0048–0.0055 | 35–45 ppm/°C | RF-SiP package substrate core |
At the package substrate level, cyanate ester is not a drop-in replacement for BT or ABF because the cure schedule and moisture sensitivity are different. A thin core formulation uses novolac cyanate ester and a phosphazene epoxy at a 70:30 ratio, with 10 phr spherical silica dispersed in a 55% solids varnish, coated on 106 glass to a dry core thickness of 0.15 mm. The core is vacuum-laminated at 220°C and 3.5 MPa for 60 min, then post-cured at 250°C for 2 h. Under J-STD-020E moisture sensitivity testing at 30°C/60% RH for 192 h, the cured core absorbs 0.20–0.35 wt% moisture. If the pre-bake step is omitted, 260°C reflow causes trapped moisture and residual low-volatile compounds to expand along the glass bundle interface, producing pad lift and microvoids between the core and build-up dielectric. A production pre-bake at 150°C for 4 h under nitrogen lowers moisture to below 0.10 wt%. After 3×260°C reflow, warpage on a 100 mm strip remains below 5 mm only when the Z-axis CTE by ISO 11359-2 is 35–45 ppm/°C below Tg; higher CTE values cause non-wetting of corner solder balls. The terminal product is a high-frequency SiP test core and RF probe card substrate with 8/8 µm semi-additive redistribution layers, not a high-volume flip-chip BGA replacement.
Radome wall laminates fabricated from cyanate ester/quartz 4581 prepregs require dielectric constant stability across the entire flight temperature range rather than an isolated room-temperature value. The resin system is a dicyclopentadienyl cyanate ester combined with an epoxy novolac at an 80:20 mass ratio, and includes 2 phr fumed silica and 0.5 phr wetting agent. Prepreg resin content is held at 35–38 wt% because quartz cloth loading controls wall thickness and rain erosion resistance. Autoclave cure uses a vacuum bag and 1.5–2.0 MPa external pressure at 177°C for 4 h; the heating rate through the 150–190°C exothermic window is limited to 0.5°C/min. If a faster ramp is allowed, thermocouple temperatures in a 10 mm thick tool exceed 235°C and the resin microcracks during cool-down. Post-cure is 230°C for 6 h in an air-circulating oven. The finished 3.5 mm wall shows Dk of 2.85 at 10 GHz and Df of 0.0040 by IPC-TM-650 2.5.5.5. Outgassing properties per ASTM E595-15, when tested at 125°C for 24 h, produce TML below 0.50% and CVCM below 0.05%. Flammability of the cured wall meets UL 94 V-0 at 3.5 mm. The terminal part is a Ka-band airborne radar radome with an erosion-resistant polyurethane topcoat.
For a 12-layer high-speed board specified for conductive anodic filament resistance per IPC-TM-650 2.6.25, the limiting variable is not bulk Tg but resin flow through laser-drilled vias. The cyanate ester formulation uses a 55:45 CE/PPE hybrid with 1.5 phr fumed silica and 0.2 phr potassium-free ion scavenger. In the B-stage, resin flow at 170°C must stay between 12% and 25%; below 12%, glass bundles at the via wall remain partially unfilled and CAF filaments grow along exposed silane-treated glass, while above 25%, resin-rich pockets raise the Z-axis CTE beyond 45 ppm/°C and cause via pad lift. Laser via formation uses a 355 nm UV laser with fluence of 180–220 mJ/cm²; permanganate desmear at 80°C for 6 min removes 0.3–0.6 µm of residue before electroless copper. In CAF testing at 85°C/85% RH, 100 V DC, and 1 000 h, insulation resistance must remain above 1×108 Ω. Batch-to-batch variation in catalyst concentration shifts the flow window by 3–5%, so incoming prepreg melt viscosity is checked before lamination and press pressure is adjusted in 0.1 MPa increments. The terminal build is a 0.2/0.2 mm line/space switch fabric motherboard fabricated on a 2.0 mm, 24-layer stack.
Vacuum outgassing acceptance of a CE/quartz satellite antenna panel begins before copper plating and not after final assembly. The cyanate ester laminate is post-cured in a nitrogen oven with plateaus of 180°C, 200°C, 220°C, and 250°C, each held 2 h, with 1°C/min ramps between plateaus. A single-post-cure ramp directly to 250°C forms a dense outer skin that traps unreacted cyanate and carbamate volatiles in the 1.5 mm laminate core. After machining and bake-out at 150°C for 12 h under vacuum, ASTM E595-15 TML typically falls between 0.15% and 0.60%, and CVCM falls between 0.02% and 0.08%; the actual values depend on silica filler loading and surface preparation. The panel is then electroless copper plated and patterned with an L-band phased array feed network using 0.20/0.20 mm traces. Compliance is assessed against ASTM E595-15 and ECSS-Q-ST-70-02C, both requiring TML below 1.00% and CVCM below 0.10%. Published outgassing data for a cyanate ester/quartz stack with this exact catalyst package is limited; qualification coupons are therefore tested per lot. The terminal product is a low-outgassing phased array radiating panel for a low Earth orbit spacecraft.
| Application | Standard / Method | Test condition | Typical pass range |
|---|---|---|---|
| High-speed CCL | IPC-TM-650 2.5.5.5 | 10 GHz, split-post | Dk 2.95–3.10, Df <0.005 |
| Package substrate MSL | J-STD-020E | 30°C/60% RH, 192 h | Pre-bake 150°C/4 h, 3×260°C no delamination |
| Conductive anodic filament | IPC-TM-650 2.6.25 | 85°C/85% RH, 100 V, 1 000 h | >1×108 Ω |
| Outgassing | ASTM E595-15 | 125°C, 24 h vacuum | TML <1.00%, CVCM <0.10% |
| Flammability | UL 94 | 3.5 mm wall | V-0 |
Slot-die coated cyanate ester dry film for mmWave antenna-in-package modules is produced at 18–30 µm cured thickness from a 65:35 cyanate ester/naphthalene epoxy hybrid containing 10 phr surface-treated spherical silica and a metal carboxylate catalyst at 0.1 phr. The film is vacuum-laminated at 120°C and 0.6 MPa onto a treated substrate core, after which a 355 nm UV laser forms 30–50 µm vias at 8–12 µJ pulse energy. Permanganate desmear removes 0.5–1.0 µm of drill smear and produces a mildly roughened surface that anchors electroless copper. After cure at 200°C for 60 min, cured film Dk at 28 GHz is 2.85–2.95 and Df is 0.0038–0.0045 by split-post resonator methods. Copper peel strength by IPC-TM-650 2.4.8 is typically 0.70–0.90 N/mm, but the value after 288°C solder float is controlled more by the resin-copper interface than by bulk cohesive strength; omission of the oxide replacement step lowers post-float peel to 0.30 N/mm even when the bulk resin Tg is 285°C. Terminal product is a fan-out panel-level antenna-in-package module for n257, n258, and n260 FR2 bands. Published production-scale statistical peel data for this exact film thickness and filler grade is limited; therefore, IPC-TM-650 2.4.8 qualification is required per lot rather than extrapolated from unfilled cyanate ester films.
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Cyanate ester resin CE-HP-310 is a bisphenol A dicyanate monomer supplied for high-speed copper-clad laminates and semiconductor packaging substrates. The monomer carries a cyanate equivalent weight of 139 g/eq, corresponding to the theoretical difunctional dicyanate structure and measured by a modified ASTM D1652 titration after hydrolysis. Melt viscosity at 80 °C is 250–500 mPa·s, residual moisture is below 0.05 wt% by ASTM D6869, and hydrolyzable chloride is controlled below 20 mg/kg to avoid poisoning the organometallic cyclotrimerization catalyst. The cured resin exhibits a dielectric constant below 3.0 and a dissipation factor below 0.006 at 10 GHz when tested as a laminate by IPC-TM-650 2.5.5.5.
In high-performance CCL manufacturing, CE-HP-310 is formulated as a 65–75 wt% solids methyl ethyl ketone varnish containing 0.02–0.05 phr of a nonylphenol-free organometallic catalyst. The varnish is coated onto 2116 E-glass fabric on a vertical treater with zone temperatures between 85 °C and 135 °C, yielding prepreg gel time of 180–240 s at 171 °C by IPC-TM-650 2.3.18. A production line using a 2.0 m wide treater is sensitive to moisture ingress above 60% RH; resin baths exposed to ambient humidity for more than 24 h require predrying at 80 °C for 4 h to prevent viscosity drift and melt-flow reduction during lamination.
The resin is also used as a low-flow dielectric for thin-core package substrates. In that application, batch-to-batch variation in catalyst concentration is held within ±0.005 phr because the gel point at 200 °C shifts by approximately 20 s per 0.01 phr of nonylphenol-free metal acetylacetonate. This level of control is required when laminating 50 µm and 75 µm glass cores for high-density interconnect structures.
The cure of CE-HP-310 proceeds by cyclotrimerization of aryl cyanate groups to triazine rings without generating secondary hydroxyl groups. This is the primary difference from epoxy resins used in FR-4, where oxirane ring-opening produces hydroxyl groups that raise the dissipation factor and increase moisture uptake. In BT resin blends, the dielectric response is controlled by bismaleimide and triazine phases but is not as low as in a high-purity dicyanate ester network because the imide groups and blended morphology introduce additional polar character and microstructural interfaces. When compared with poly(phenylene ether) or PTFE-ceramic laminates, the cyanate ester system retains a higher glass transition temperature than PPE and lower z-axis expansion than PTFE while providing a dielectric loss tangent acceptable for 28 GHz antenna and high-speed digital designs.
The cyclotrimerization kinetics of bisphenol A dicyanate are strongly temperature dependent. Reported isoconversional activation energies for uncatalyzed systems are typically in the 80–90 kJ/mol range, which means that press ramp rate and dwell time must be tightly controlled above 180 °C. In industrial lamination, the practical ramp ceiling between 150 °C and 200 °C is 2.5 °C/min in autoclave-assisted vacuum presses because exotherm accumulation in heavy builds can produce laminate blistering.
Mechanically, the cured CE-HP-310 network has lower tensile elongation than toughened epoxy systems. Published datasheet values for elongation at break are below 2.0% by ASTM D638, compared with 4–6% for many high-Tg FR-4 resins. The selection boundary is therefore set by the need for high modulus and low dielectric loss rather than high peel strength or toughness. Copper peel strength after oxide treatment and lamination is typically 0.7–1.0 N/mm by IPC-TM-650 2.4.8, which is lower than the 1.0–1.4 N/mm commonly obtained on comparable epoxy systems.
Representative dielectric and thermal values for cured laminate systems are summarized in Table 1. All values are drawn from publicly available datasheet ranges and are normalized to the IPC-TM-650 2.5.5.5 test configuration where applicable.
| Property | FR-4 epoxy | BT blend | CE-HP-310 | PPE/APPE | PTFE/ceramic |
|---|---|---|---|---|---|
| Dk at 10 GHz | 4.2–4.6 | 3.4–3.8 | 2.9–3.1 | 2.4–2.6 | 2.2–2.5 |
| Df at 10 GHz | 0.020–0.030 | 0.007–0.010 | 0.004–0.006 | 0.002–0.004 | 0.0008–0.002 |
| Tg by DMA | 150–170 °C | 180–220 °C | 300–320 °C | 200–230 °C | N/A |
| Z-axis CTE | 50–70 ppm/°C | 40–55 ppm/°C | 35–45 ppm/°C | 50–60 ppm/°C | 90–120 ppm/°C |
| 24 h water absorption | 1.5–2.0 wt% | 0.7–1.0 wt% | 0.5–0.8 wt% | 0.2–0.4 wt% | <0.02 wt% |
Because moisture absorption shifts the effective dielectric constant, the low equilibrium moisture uptake of the cyanate ester network is as important as its intrinsic dissipation factor. After 24 h water immersion by ASTM D570, the increase in Dk at 10 GHz is typically below 0.05, whereas an FR-4 laminate may shift by 0.3–0.5. This is a key differentiator in high-layer-count backplanes where humidity aging under bias is a reliability variable.
A second grade, CE-HP-410, is a novolac cyanate ester with a higher cyanate equivalent weight and higher crosslink density after cure. It is specified where package substrates must withstand Au wire bonding at 170 °C, repeated reflow peaks of 260 °C under JEDEC J-STD-020D, or long-term bum-in at 175 °C. The two grades are summarized in Table 2.
| Parameter | CE-HP-310 | CE-HP-410 |
|---|---|---|
| Cyanate equivalent weight | 139 g/eq | 210–240 g/eq |
| Melt viscosity / softening point | 250–500 mPa·s at 80 °C | 90–110 °C softening point |
| Tg after post-cure | 300–320 °C by DMA | >380 °C by DMA |
| Dk at 10 GHz | 2.9–3.1 | 3.0–3.2 |
| Df at 10 GHz | 0.004–0.006 | 0.005–0.007 |
| In-plane CTE, silica-filled | 12–18 ppm/°C | 10–15 ppm/°C |
The specified post-cure for CE-HP-310 is 250 °C for 4 h under nitrogen to reach the target cyanate conversion. Because cyclotrimerization is exothermic and the reaction accelerates above 180 °C, lamination press ramp rates above 3 °C/min can cause blistering in heavy builds. The control range for the press dwell at 200 °C is 90–120 min; shorter dwells leave residual cyanate functionality that can react during solder reflow and produce outgassing.
For package substrate build-up films, CE-HP-310 is converted to a 25–40 µm thick B-stage film by slot-die coating from cyclopentanone at 35–45 wt% solids. The B-stage is dried at 90–120 °C to residual solvent below 1.5 wt% by gas chromatography. In this form, the resin requires storage below −20 °C to maintain stable flow; at ambient temperature the B-stage film absorbs moisture and the cured film can exhibit microvoids at the copper interface after reflow. In a high-density package substrate line, the film is vacuum-laminated on a 400 mm × 400 mm panel using a diaphragm pressure of 5–7 kg/cm², followed by CO₂ laser via formation at 9.4 µm wavelength. Published data for the CO₂ fluence threshold of this specific CE-HP-310 film is limited, but production experience indicates that fluence below 2 J/cm² produces incomplete via opening while fluence above 6 J/cm² increases via barrel taper and carbonized residue requiring extended permanganate desmear.
Residual solvent in B-stage cyanate ester films acts as a plasticizer and reduces the glass transition temperature of the partially cured matrix. During CO₂ laser drilling, the thermal spike creates a narrow zone of depolymerization and ablation. If residual solvent exceeds 2.0 wt%, the softened zone widens and the via wall angle increases, while the ablated debris becomes tacky and re-deposits on the copper landing pad. At residual solvent below 1.0 wt%, via taper is controlled to 65–75° and bottom copper clean after desmear is achieved within a 60 s permanganate dip at 80 °C. Amine-based additives or excess imidazole-based catalysts are incompatible with CE-HP-310 because they promote cyanate homopolymerization at room temperature and reduce shelf life; the resin must not be compounded with aliphatic amines.
The laser-drilled sidewall chemistry is different from that of epoxy build-up films. The triazine network has no hydroxyl-rich oxidation sites, so the sidewall does not swell as readily in the alkaline permanganate desmear bath. This gives a wider processing window for via dimensions but requires the sweller temperature to be held below 70 °C; above this temperature the film surface can roughen excessively and reduce copper adhesion.
In an HDI package substrate process, laser-formed vias are desmeared with alkaline permanganate at 80 °C for 8–12 min after a glycol-ether swell step. CE-HP-310 films are less susceptible to permanganate attack than FR-4 epoxy because the triazine network has fewer polar aliphatic ether groups. After electroless copper and semi-additive plating, peel strength on a low-profile copper foil is 0.9–1.2 N/mm by IPC-TM-650 2.4.8, and thermal stress testing at 288 °C for 10 s per IPC-TM-650 2.4.13.1 shows no blistering when the laminate is baked at 110 °C for 2 h before test.
Moisture sensitivity classification of a 0.4 mm core under JEDEC J-STD-020D is normally MSL 3. Floor-life control is set at ≤30 °C/60% RH for no more than 168 h, after which a 105 °C bake for 2 h is required before reflow. Package substrates built with CE-HP-310 are therefore compatible with 260 °C peak reflow soldering when the moisture control plan is followed, but they are not suitable for prolonged high-humidity storage without sealed packaging or dry-box handling.
