| HS Code | 546860 |
| Density | 1.05 g/cm³ |
| Meltflowrate | 7.0 g/10 min (220°C/10 kg) |
| Tensilestrength | 44 MPa |
| Tensileelongationatbreak | 25% |
| Flexuralstrength | 70 MPa |
| Flexuralmodulus | 2300 MPa |
| Notchedizodimpactstrength | 18 kJ/m² (23°C) |
| Rockwellhardness | R105 |
| Heatdeflectiontemperature | 88°C (1.82 MPa) |
| Vicatsofteningtemperature | 104°C |
| Flammability | UL94 HB |
| Moldshrinkage | 0.4–0.6% |
| Waterabsorption | 0.3% |
As an accredited CHIMEI (Chi Mei) ABS PA-777S factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.
| Packing | CHIMEI (Chi Mei) ABS PA-777S comes in 25 kg net paper bags, typically palletized and shrink-wrapped for shipment. |
| Container Loading (20′ FCL) | 20′ FCL: CHIMEI ABS PA-777S in 25 kg bags, palletized, shrink-wrapped, and secured for safe, dry ocean transport. |
| Shipping | CHIMEI ABS PA-777S ships as non-hazardous thermoplastic resin pellets in 25 kg moisture-barrier bags, palletized and stretch-wrapped. Store in a cool, dry, ventilated area away from heat, sunlight, and ignition sources. No UN/DG classification; follow local transport regulations. |
| Storage | Store CHIMEI ABS PA-777S in a cool, dry, well-ventilated area away from direct sunlight, heat sources, open flames, and moisture. Keep original bags/packages closed and palletized; protect from rain and physical damage. Use first-in, first-out. If humid exposure occurs, dry resin per supplier/processing guidelines before use. Avoid prolonged storage in high humidity. |
| Shelf Life | Typically 12 months from production date when stored in unopened original packaging under cool, dry conditions, away from direct sunlight. |
Enclosure components for ITE products are routinely injection-molded from CHIMEI PA-777S in nominal wall sections of 2.00 mm to 2.50 mm because the grade is listed for UL 94 V-0 testing at these thicknesses under UL 94:2013, which permits compliance with IEC 62368-1:2023 Clause 6.2.3.2 for fire enclosure bottom openings. Drying is executed in closed-loop desiccant dryers with supply air at 80°C to 85°C for 3 h to 4 h, a dew point of -30°C or lower, and an airflow rate not less than 3.7 m³/h per kg/h of polymer throughput. Injection barrel settings are commonly split at 180°C rear, 210°C middle, and 220°C front, with nozzle temperature held at 215°C to 225°C. Mold temperature is maintained at 50°C to 70°C for acceptable gloss uniformity and weld-line strength. The melt residence time at processing temperature should not exceed 8 min in the barrel; longer holding times cause visible black specks from flame-retardant degradation and reduce Izod impact energy at gate-blush zones. A reciprocating screw with L/D ratio of 20:1 to 22:1 and compression ratio of 2.2:1 to 2.5:1 is used on standard hydraulic or servo-driven machines. Screw rotation should remain between 30 rpm and 60 rpm, with back pressure limited to 0.5 MPa to 1.0 MPa. Regrind addition is capped at 20 wt% in virgin material because successive melt histories shift the V-0 margin at boss roots and snap-fit hooks. Typical published mechanical ranges for PA-777S under ISO 527-2/1A show tensile yield stress between 35 MPa and 42 MPa and flexural modulus between 2,200 MPa and 2,500 MPa, which are sufficient for thin-wall monitor back covers but not for structural metal-replacement parts. Terminal products in this segment include LCD monitor rear housings, router bottom shells, set-top box base covers, printer side panels, and powerline adapter clamshells. The material is accepted in these applications only when the molder verifies the supplier RoHS 2011/65/EU as amended by (EU) 2015/863 declaration and confirms that the flame-retardant system does not create PBB or PBDE above 0.1% in homogeneous material.
| Evaluation scope | Standard / method | Application-specific criterion |
|---|---|---|
| Flammability at end-use wall thickness | UL 94:2013, IEC 60695-11-10 | V-0 at 2.00 mm minimum; mold trial plaque required because color and regrind shift the burn margin |
| Fire enclosure requirements | IEC 62368-1:2023 Clause 6.2.3.2 | No secondary flame path; bottom openings per applicable fire enclosure figures |
| Tensile and flexural data | ISO 527-2/1A, ISO 178 | Reported batch values must exceed the enclosure drop-test and snap-fit calculation limits |
| Melt flow rate | ISO 1133-1:2022 | Used to define gate freeze-off and shear-rate limits for thin-wall runner systems |
| Restricted substances | 2011/65/EU + (EU) 2015/863 | Pb, Hg, Cd, Cr(VI), PBB, PBDE at 0.1%; DEHP, BBP, DBP, DIBP at 0.1% in homogeneous material |
Before a production run, the moisture exposure history of PA-777S determines whether the desiccant hopper can maintain granulate below the critical water concentration for surface quality. Molded parts from this grade exhibit silver streaks, splay, and localized delamination when residual moisture exceeds 0.05 wt%. Granulate stored at 23°C and 50% relative humidity can reach surface moisture levels of 0.2 wt% to 0.4 wt% within several hours if hopper lids are left open. The drying hopper should therefore be sized for the full shot cycle, not for theoretical plasticating capacity. Required dry-air volume is calculated by multiplying polymer throughput in kg/h by 3.7 m³/h per kg/h and then adding 20% reserve for desiccant bed regeneration cycles. Dew point is verified at the hopper outlet with a portable dew point meter and must remain at -30°C or lower. Drying temperature is set at 80°C to 85°C for 3 h to 4 h. Overdrying beyond 6 h is not recommended because volatile flame-retardant components can migrate to pellet surfaces and produce plate-out in the mold venting channels. In operations with intermittent packaging, hot air hoppers are not acceptable because they cannot reach the required dew point in humid coastal production sites. A desiccant wheel or twin-tower dryer with closed-loop airflow, aftercooler, and dew-point-controlled regeneration is the minimum system. Processors should verify moisture by Karl Fischer titration or a calibrated loss-on-drying balance with resolution of 0.01 wt% before startup. The practical failure mode observed on production lines is not visible splay alone but a drop in notched Izod impact under ISO 180/1A at 23°C of 15% to 25% when weld lines are present. This translates into cracked snap features during drop testing of thin-wall consumer router housings and small power adapter covers. In those parts, residual moisture and high melt temperature combine to create hydrolysis-like degradation products from the flame-retardant package that deposit on core pins and increase ejection force. Terminal products under this moisture-control scope are network equipment enclosures with snap-fit seams, VGA port covers, small appliance switch housings, and internal shields for point-of-sale terminals. Published data for the exact moisture absorption curve of PA-777S is limited; therefore the dryer setpoints above are derived from application guidance for flame-retardant ABS grades of similar melt-flow class.
In electrical distribution equipment, a molded enclosure is not simply a mechanical cover; it is an insulating barrier that must maintain creepage and clearance dimensions after repeated thermal cycling. PA-777S is used for bases and covers of miniature circuit breakers, residual current devices, terminal blocks, and meter enclosures when the application requires UL 94 V-0 at 2.00 mm and glow-wire resistance under IEC 60695-2-11. For unattended household appliances with current greater than 0.2 A, the end-product standard may require a glow-wire ignition temperature of 750°C, and for some terminal parts 850°C is specified; the supplier certificate for PA-777S must be checked against the exact end-product clause. The material is not recommended for primary circuit parts where comparative tracking index values above 400 V are mandatory, because unfilled flame-retardant ABS typically falls below that threshold. Molded bosses around brass inserts should maintain a surrounding wall thickness of at least 2.0 mm to prevent cracking during ultrasonic insertion of threaded inserts. Gate placement is critical for switchgear parts because a weld line located on an arc barrier can become an ignition path under fault conditions. On production scale, sequential valve gating is used for large distribution box covers to eliminate hesitation marks and to position weld lines away from high-voltage compartments. The processing window uses a melt temperature of 220°C to 240°C, a mold temperature of 60°C to 70°C, and injection speed in the range of 50 mm/s to 150 mm/s depending on flow length. Holding pressure is typically 50% to 70% of the peak injection pressure, with a cushion maintained at 3 mm to 5 mm. The use of brass inserts is common in terminal blocks, but the insert must be preheated to 80°C to 100°C before molding because a cold insert causes microcracking at the interface due to differential thermal contraction. Terminal products include MCB base carriers, RCD housing halves, meter-box glazing frames, and DIN-rail-mounted accessory shells. For outdoor distribution boxes, an added UV-stabilized coating or top cover is required because PA-777S is not designed for prolonged direct sunlight exposure, and unprotected parts can exhibit chalking within a service life of 10 years in high-UV regions.
For indoor electric vehicle supply equipment, the internal frame adjacent to PCB and AC relay modules is molded from PA-777S only when the enclosure is protected from direct sunlight and the service temperature does not exceed the heat deflection temperature under load. Under ISO 75-2/A at 1.82 MPa, the grade falls in the region of 80°C to 88°C; therefore the application is limited to indoor wallbox interior brackets, connector guide plates, socket shrouds, and non-weather-exposed bezels. In this segment, the compliance anchor is IEC 61851-1:2019 for conductive charging systems, combined with IEC 62368-1 for the internal electronics housing portions. The designer checks creepage and clearance distances prescribed by IEC 60664-1 for pollution degree 2, and if the installation environment carries dust or condensation risk, the board enclosure is sealed with a gasket rather than relying on the polymer alone. PA-777S can accept annealing at 70°C for 2 h after molding to relax internal stresses around metal screw bosses; this operation improves dimensional stability during thermal cycling from -10°C to 60°C. Injection molds for AC charger guide plates require polishing in the direction of part ejection because release angle lower than 0.5° produces visible drag marks and increases the force needed to eject the part from the core. A rib-to-wall ratio of 0.5:1 to 0.6:1 is maintained to prevent sink marks at the visible front surface near gasket channels. The material is not approved for direct contact with current-carrying conductors at temperatures above its thermal index, and no published RTI for PA-777S under UL 746B is assumed without an active UL Yellow Card. Where a specific batch is approved for indoor EVSE use, the molder retains the supplier certificate and a third-party test report from an ISO/IEC 17025 laboratory for flame, heat deflection, and mold shrinkage.
When PA-777S replaces a non-flame-retardant HIPS grade in an appliance rear panel, the conversion is not a drop-in color change. The gate diameter must be increased from typical HIPS pin gates of 1.2 mm to 1.5 mm to 2.0 mm to 2.5 mm because PA-777S generates higher shear heating in narrow channels and may produce burn streaks near the gate land. Existing cold runner systems designed for HIPS are opened by 10% to 15% in cross-sectional area on high-flow-length panels longer than 300 mm. Mold shrinkage for PA-777S is generally in the 0.4% to 0.7% range, which overlaps with HIPS but creates different anisotropic warpage behavior because the flame-retardant package alters crystallization only marginally while increasing melt viscosity at the frozen layer. Packing time should be extended from the HIPS baseline by 1 s to 3 s for panels with ribbing around motor shrouds. A melt temperature of 220°C to 235°C and a mold temperature of 50°C to 65°C are used. Injection is profiled as a slow-to-fast fill: the first 30% of flow length is filled at 30 mm/s to 50 mm/s, and the remaining path is filled at 80 mm/s to 120 mm/s to prevent hesitation lines at the air-purifier outlet grill. The flame-retardant ABS exhibits a lower gloss than HIPS under identical mold polish, so the mold cavity is polished to SPI-A2 or finer if the rear panel has visible side wrap-around edges. Terminal products in this substitution segment include air purifier back covers, vacuum cleaner motor shrouds, heater appliance rear panels, and dehumidifier machine frames. Compliance is driven by IEC 60335-1:2020 Clause 30.2.2 for small component flame categories, and the finished appliance must pass the needle-flame test of IEC 60695-11-5 if the panel is within 50 mm of a potential ignition source. Regrind from HIPS must not be mixed with PA-777S because the incompatibility produces delamination at the interface and reduces notched impact beyond acceptable limits. For transition runs, the barrel and hot runner are purged with a general-purpose ABS or purging compound at 240°C before introducing PA-777S.
Office automation subassemblies such as paper cassette frames, copier side rails, automatic document feeder trays, and internal covers impose long-term dimensional stability under intermittent heat loads from fuser units. PA-777S is selected for these parts when the engineering specification lists UL 94 V-0 at 2.00 mm and when internal fire barriers are required by IEC 62368-1. The limiting condition is sag deformation under sustained load near the fuser, so heat deflection temperature under ISO 75-2/A is the controlling property rather than tensile strength. For paper cassette frames longer than 400 mm, the mold uses a central sprue with a cold runner transition to a fan gate of 3.0 mm width at the non-visible side. Post-mold annealing at 70°C for 2 h reduces residual stress around paper-tray side locks and improves dimensional stability after the first exposure to a 60°C internal compartment temperature. The material has a greater unannealed shrinkage anisotropy than unfilled ABS, so the tooling inserts are cut with a correction factor of 0.2% to 0.3% on dimensions parallel to flow. Precision snap-fit gaps on ADF trays are held to ±0.05 mm by measuring post-mold dimensions after 24 h at 23°C and 50% relative humidity, then adjusting packing pressure in 5 MPa increments. Processing uses a back pressure of 0.5 MPa to 0.8 MPa and a screw speed of 40 rpm to 60 rpm to avoid generation of black specks at the check ring. The terminal OEM parts include laser printer paper cassettes, copier duplexer inner frames, inkjet service doors, and document scanner rails. Published data for long-term creep of PA-777S in this specific configuration is limited, so design engineers should request batch-specific creep modulus values measured under ISO 899-2 at 60°C before committing to unsupported fuser-area housing sections.
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CHIMEI (Chi Mei) ABS PA-777S is a pelletized acrylonitrile-butadiene-styrene terpolymer designated as a high-heat injection-molding grade. The model identification PA-777S places the material above the manufacturer’s general-purpose ABS products in thermal deflection behavior while retaining a medium-impact profile. Incoming resin should be controlled against the lot-specific certificate of analysis because SAN graft ratio, polybutadiene particle-size distribution, and residual monomer concentration introduce batch-to-batch variation. The primary test designations used for release include ISO 1133-1:2022 for melt mass-flow rate, ISO 1183-1:2019 for density, ISO 527-2 for tensile properties, ISO 178 for flexural properties, ISO 180/A for notched Izod impact, ISO 75-2 for heat deflection, and ISO 306 for Vicat softening temperature.
The material is considered for injection-molded automotive interior trim, instrument panel subcomponents, electrical enclosures, and appliance structural parts where short-term thermal soak or paint-bake exposure is present. It is not a flame-retardant compound. Under IEC 60695-11-10, the grade generally falls into the HB class at enclosure thickness. If an application requires UL 94 V-0 at 1.5 mm, the appropriate substitution is a flame-retardant ABS such as CHIMEI PA-765A, because PA-777S does not carry the brominated or brominated-phosphate additive package required for V-0 performance. Published UL 746B relative thermal index entries for ABS typically range from 60 °C to 85 °C depending on thickness, color, and impact retention; the UL Yellow Card for the specific PA-777S file should be checked for the applicable RTI classification.
Manufacturer-published typical values for PA-777S place the heat deflection temperature under ISO 75-2 method A in the range 93–98 °C when the test specimen is annealed and loaded at 1.82 MPa. Vicat softening temperature under ISO 306 method B50 is generally 100–105 °C. General-purpose PA-757 is commonly reported near 89 °C HDT A and 96 °C Vicat B50. The thermal shift means PA-777S can tolerate paint-bake cycles above 80 °C for 30 min without the degree of stress relaxation observed in PA-757. The trade-off is lower melt flow and higher viscous shear. On a 120 t hydraulic injection molding machine with a 35 mm diameter, 22:1 L/D general-purpose screw, PA-777S requires the metering zone at 230–250 °C, approximately 5–10 °C higher than PA-757 under identical cycle conditions to maintain equivalent fill pressure. Where exact lot-specific HDT and impact values are required, published data for this specific configuration is limited and the certificate of analysis is the controlling source.
From a production-scale standpoint, the main bottleneck with PA-777S compared with PA-757 is gas generation and plate-out at elevated melt temperature. Vented barrels are not a substitute for dry resin. If pellet moisture exceeds 0.05 wt%, dissolved water boils in the melt and produces silver streaks, pit marks, and reduced impact. Injection units with a 36 mm screw and 23:1 L/D show screw recovery time increases of 10–20% when PA-777S replaces PA-757 at the same back pressure because the high-heat SAN matrix is more viscous. Screw speed should be held at 50–100 rpm and back pressure at 0.5–1.0 MPa. Injection velocity between 40 mm/s and 80 mm/s is normally required for flow lengths above 150 mm at a wall thickness of 2.5 mm; below 30 mm/s, jetting and visible gate-area flow lines appear.
Moisture is the principal variable. PA-777S should be dried in a desiccant dryer at 80 °C for 2–4 h with a dew point of -20 °C or lower and an air-flow rate of at least 3.7 m³/h per kg/h resin throughput. Residual moisture measured by Karl Fischer titration under ISO 15512 should be below 0.05 wt% before molding. Hopper residence time should not exceed 4 h at 80 °C; prolonged hot-air exposure oxidizes the butadiene phase and causes yellowing, lower gloss, and upward drift in melt mass-flow rate. Feed-throat temperature should remain below 50 °C to prevent pellet sticking and bridging. Barrel settings are typically: feed 190–210 °C, compression 220–240 °C, metering 230–250 °C, and nozzle 235–245 °C. Melt temperature measured at the nozzle should not exceed 250 °C for continuous runs; excursions above 255 °C produce brown and black degradation specks and a sharp styrene odour within 10 min of residence time. If a hot runner holds melt above 245 °C for more than 10 min, shut-off gates should be used and oversized manifold channels avoided. A hot-runner volume greater than 15% of shot volume creates a degradation risk.
| Property | Test method / condition | Typical envelope |
|---|---|---|
| Melt mass-flow rate | ISO 1133-1:2022, 220 °C / 10 kg | 3–6 g/10 min |
| Density | ISO 1183-1:2019, 23 °C | 1.04–1.06 g/cm³ |
| Tensile stress at yield | ISO 527-2, 50 mm/min | 40–46 MPa |
| Tensile strain at break | ISO 527-2 | 10–25% |
| Flexural modulus | ISO 178, 2 mm/min | 1900–2300 MPa |
| Flexural strength | ISO 178 | 60–70 MPa |
| Notched Izod impact, 23 °C | ISO 180/A | 18–24 kJ/m² |
| Heat deflection temperature A | ISO 75-2, 1.82 MPa, annealed | 93–98 °C |
| Vicat softening temperature B50 | ISO 306, 50 N | 100–105 °C |
| Molding shrinkage, parallel | ISO 294-4, 60 °C mold | 0.4–0.7% |
Tooling for PA-777S should incorporate generous venting along the flow path. In two-plate molds with cavity surface roughness near Ra 0.4 µm, inadequate venting produces weld-line tensile strength below 60% of parent material under ISO 527-2. Vent depth should be 0.02–0.03 mm for ABS, and runner diameters should be at least 6 mm for parts above 150 mm flow length. A cold sprue bushing orifice of 3.5–4.5 mm is typical; hot-runner drops of 2.0 mm or smaller increase shear heating and black-spec formation. Mold temperature should be held at 40–70 °C. Below 40 °C, weld lines are brittle and gloss falls. Above 70 °C, cycle time lengthens and sticking can occur in deep ribs and bosses. Packing pressure of 50–70 MPa and packing time of 6–10 s for a 2.5 mm wall are common; gate seal time should be established by part weight because short packing increases sink and post-mold shrinkage.
Regrind use in PA-777S is constrained by impact retention and melt-flow shift. Closed-loop molding with granulator rotor speed between 300 rpm and 500 rpm and a screen size of 6–8 mm produces regrind with low fines. When fines below 0.5 mm exceed 5 wt% of the regrind fraction, surface splay and gate-area delamination increase. At 20 wt% regrind, notched Izod impact under ISO 180/A at 23 °C typically remains within 10% of virgin values. At 30 wt% or higher, impact retention can fall by 10–15% because the butadiene phase undergoes additional thermal shear during reprocessing, and melt mass-flow rate increases from chain scission. For dimensionally stable parts where post-mold shrinkage is controlled by ISO 294-4, the maximum recommended regrind fraction is 20 wt%. When regrind is used, incoming quality control should measure melt flow, notched impact, and color every 2 h to detect lot drift.
Compared with other CHIMEI ABS grades, PA-777S occupies the high-heat injection-molding position. PA-757 is the general-purpose high-gloss grade; its lower Vicat temperature and higher flow suit thin-wall appliance housings, but it softens earlier in hot service. PA-747 and PA-709 are high-impact grades with larger polybutadiene particles or higher rubber content; their notched Izod values can exceed 25 kJ/m², but HDT A is lower and directional shrinkage is higher. PA-765A is the flame-retardant ABS class; it meets UL 94 V-0 at 1.5 mm but requires lower screw speed and careful purging to avoid black specks from FR additive degradation. PA-777B is an electroplating grade; its SAN graft and butadiene particle-size distribution are selected for chromic-acid etch uniformity and electroless copper/nickel adhesion. PA-777S is not optimized for plating adhesion and should not be substituted in plating-rack applications without etching and plating-adhesion validation under the relevant OEM thermal-cycling standard.
PA-777S is non-flame-retardant and is not designed for electroplating. It should be kept free of PVC, polyoxymethylene, and polycarbonate residues. PVC contamination at concentrations as low as 2 wt% can release hydrogen chloride during ABS processing and corrode the screw and mold. Polyoxymethylene residues generate formaldehyde at ABS melt temperatures and create surface splay. Polycarbonate contamination above 5 wt% can raise melt viscosity and create delamination layers because PC/ABS blends require a distinct compatibilized morphology. Avoid running PA-777S immediately after a flame-retardant grade without purging with a general-purpose ABS or commercial purging compound; residual brominated species can degrade at PA-777S processing temperatures and produce brown specks. The recommended purging sequence is to empty the barrel, run a general-purpose ABS purge for 20 min at 220–240 °C, then introduce PA-777S. The mold surface should be cleaned with a neutral solvent to remove plate-out before switching to this grade.
For automotive interior applications, the grade is subject to emission and odor limits rather than mechanical specifications alone. OEM requirements commonly reference thermal desorption methods such as VDA 278 for VOC and FOG fractions, and total organic emission limits may be enforced per vehicle platform. PA-777S must be validated per lot because emissions depend on residual styrene, ethylbenzene, and butadiene oligomers. RoHS Directive 2011/65/EU and REACH SVHC declarations should be obtained from the supplier for each production lot. Food-contact applications require EU 10/2011 migration testing; an ABS grade is not automatically food-contact approved by its datasheet classification.