| HS Code | 802485 |
| Density G Cm3 | 1.19 |
| Melt Flow Rate G 10min | 15 (220 °C/10 kg) |
| Tensile Strength Mpa | 44 |
| Elongation At Break Percent | 15 |
| Flexural Strength Mpa | 70 |
| Flexural Modulus Mpa | 2400 |
| Notched Izod Impact Kj M2 | 10 |
| Rockwell Hardness | R105 |
| Heat Deflection Temperature C | 75 (1.82 MPa) |
| Vicat Softening Temperature C | 90 |
| Flammability Rating | UL94 V-0 |
| Flammability Rating Thickness Mm | 1.5 |
| Molding Shrinkage Percent | 0.4-0.6 |
As an accredited CHIMEI (Chi Mei) ABS PA-776 factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.
| Packing | CHIMEI ABS PA-776 is supplied in 25 kg moisture-proof paper sacks, stacked 40 sacks per pallet, totaling 1,000 kg per pallet. |
| Container Loading (20′ FCL) | CHIMEI ABS PA-776 is packed in 25 kg bags, palletized, and loaded into a 20′ FCL container with secure stowage for export. |
| Shipping | CHIMEI ABS PA-776 is shipped as non-hazardous ABS resin pellets in moisture-proof 25 kg bags or 500–1000 kg jumbo bags, palletized and stretch-wrapped. Store in cool, dry conditions away from direct sunlight and heat. Not classified as dangerous goods; normal road/sea freight applies. |
| Storage | Store CHIMEI ABS PA-776 in a cool, dry, well-ventilated area, away from direct sunlight, heat, ignition sources, and moisture. Keep bags sealed and palletized, avoid contact with incompatible chemicals, and prevent dust or contamination. Use first-in, first-out stock rotation; dry resin before processing if exposed to humid conditions. |
| Shelf Life | Typically 24 months in original unopened packaging, stored dry, cool, and away from direct sunlight. |
Automotive grille and door-handle substrates molded from PA-776 are typically specified with wall thicknesses between 2.5 mm and 3.5 mm to provide sufficient section modulus during electrolytic copper and nickel deposition. Pre-drying in a desiccant dryer at 80 °C for 3–4 h to a residual moisture level below 0.02 wt% as measured by ISO 15512:2019 is mandatory, because moisture above this threshold produces splay at the gate and non-uniform chromic acid etch topography. Melt temperature is maintained at 220–250 °C, mold surface temperature at 40–60 °C, and back pressure at 0.5–1.5 MPa; the high-flow character of PA-776 reduces short shots in long grille tools but also raises the risk of gate blush on Class A surfaces. The chromic-sulfuric etch is operated at 380–420 g/L CrO₃ and 360–410 g/L H₂SO₄, with a working temperature of 62–68 °C and immersion of 8–12 min. Etch weight loss is controlled at 0.35–0.60 mg/cm² because lower values reduce mechanical interlock between the ABS matrix and the plated metal, while higher values create visible roughening after bright nickel. The plating stack for exterior trim uses 20–25 µm electrolytic copper, 8–12 µm semi-bright nickel, 3–5 µm bright nickel, and 0.25–0.5 µm chromium. Adhesion is verified by ASTM B533-85(2019); exterior automotive specifications commonly require peel strength above 0.7 N/mm. Thermal cycling between -30 °C and 80 °C for 20 cycles with 30 min dwell is used to detect blistering and delamination at gate areas, ribs, and edges. Corrosion resistance is evaluated by ASTM B368-21 copper-accelerated acetic acid salt spray for 24 h, with a rating of 9 or better typically required for exterior plated components.
The electroplating sequence for sanitary fitting escutcheons, faucet handles, and diverter knobs begins with alkaline soak cleaning at 50–60 °C to remove ejection grease and handling oils. Mold release residues remaining on PA-776 before etching are a common production-line cause of skip plating and white bloom after chromium deposition. For plumbing components, the etch bath is maintained at 370–420 g/L CrO₃ and 360–420 g/L H₂SO₄, with immersion at 65–70 °C for 10–14 min. The longer dwell relative to automotive parts compensates for thicker sections and recessed cavity geometries, but over-etching can enlarge butadiene rubber cavities and reduce copper coverage at sharp corners. The decorative plating stack for potable water contact components uses 18–25 µm copper, 10–15 µm semi-bright nickel, 3–5 µm bright nickel, and 0.25–0.5 µm chromium. Handles exposed to frequent abrasion may include a microporous nickel layer of 1–2 µm to distribute corrosion current. Plated parts must satisfy ASME A112.18.1/CSA B125.1 for mechanical integrity and NSF/ANSI 61 for drinking water contact materials, although the intact metallic deposit does not release nickel or chromium ions under normal service. Thermal shock testing from -30 °C to 70 °C for 10 cycles is performed to detect adhesion failure at molded ribs. Chlorinated solvents must not be used for cleaning PA-776 because ABS undergoes environmental stress cracking; approved pre-plating cleaners are non-ionic surfactant solutions at 2–5 vol% with mild agitation.
| Application Segment | Etch Temperature and Immersion | Copper Layer | Nickel Layer | Chromium Layer | Key Qualification Test |
|---|---|---|---|---|---|
| Automotive exterior trim | 62–68 °C / 8–12 min | 20–25 µm | 11–17 µm | 0.25–0.5 µm | ASTM B533-85(2019), ASTM B368-21 |
| Sanitary fittings | 65–70 °C / 10–14 min | 18–25 µm | 13–20 µm | 0.25–0.5 µm | ASME A112.18.1/CSA B125.1, NSF/ANSI 61 |
| Cosmetic closures | 60–65 °C / 6–9 min | 10–15 µm | 5–8 µm | 0.2–0.3 µm | EN 1811:2015+A1:2020, EN 12472:2020 |
| Appliance control bezels | 63–68 °C / 8–10 min | 18–22 µm | 11–15 µm | 0.25–0.4 µm | ASTM B533-85(2019), IEC 60335-1:2020 |
| Electronics shielding shells | 60–66 °C / 5–9 min | Electroless 0.5–1.5 µm | Electroless 0.3–0.8 µm | Not applied | ASTM D257-14, IEEE 299 |
| Nameplates and badges | 60–65 °C / 5–8 min | 12–18 µm | 6–9 µm | 0.2–0.3 µm | ASTM B533-85(2019), ISO 105-B02:2014 |
| Furniture hardware | 62–67 °C / 7–10 min | 10–15 µm | 9–14 µm | 0.25–0.5 µm | ASTM D4060-19, ASTM B368-21 |
Cosmetic closure applications using PA-776 include jar covers, mascara caps, and fragrance bottle overcaps. These components require bright chromium appearance but must also comply with skin-contact nickel release limits. The electroplated PA-776 closure is tested according to EN 1811:2015+A1:2020, with release below 0.5 µg/cm²/week required under REACH Annex XVII Entry 27. A continuous chromium layer of 0.2–0.3 µm over bright nickel is normally sufficient to meet the limit when the nickel layer is fully sealed, but pinholes and microcracks remain pathways for nickel migration. The etching step is operated at 350–380 g/L CrO₃ and 330–370 g/L H₂SO₄, at 60–65 °C for 6–9 min, producing a less aggressive topography than automotive or sanitary parts. Peel adhesion for cosmetic closures commonly falls in the 0.5–0.7 N/mm range as tested by ASTM B533-85(2019); this lower band is acceptable because service temperatures rarely exceed -20 °C or 50 °C. The plating stack is reduced to 10–15 µm copper, 5–8 µm bright nickel, and 0.2–0.3 µm chromium to minimize part weight and residual stress. PA-776 is injection molded at 220–240 °C with mold temperature of 40–60 °C; gate vestige removal and polishing before plating are critical because gate blush remains visible through thin bright nickel. Fragrance oils, alcohol-based lotions, and UV-blocking cosmetic formulations can migrate into unplated ABS and cause environmental stress cracking. The metallic layer acts as a barrier, but pinholes in the chromium topcoat become preferential migration sites. Production-scale quality control uses EN 12472:2020 wear simulation followed by EN 1811:2015+A1:2020 nickel release testing. Export to EU consumer markets requires that the PA-776 compound itself does not contain intentionally added lead, mercury, cadmium, or hexavalent chromium under RoHS Directive 2011/65/EU.
Thin-wall appliance control bezels and knob shells molded from PA-776 are specified when the final assembly must combine high surface hardness after plating with dimensionally stable multi-cavity molding. Wall thickness is typically 1.8–2.5 mm, melt temperature 225–245 °C, and mold temperature 45–60 °C. The high-flow character of PA-776 reduces short shots in hot-runner tools with multiple cavities, but the grade must be protected against excessive shear heating. For dishwasher and washing machine control panels, the plated stack is exposed to alkaline detergent solution at 60–70 °C. The chromic-sulfuric etch is run at 63–68 °C for 8–10 min to generate moderate surface topography that anchors copper without creating microvoids that accelerate detergent ingress. The plating sequence uses 18–22 µm copper, 8–10 µm semi-bright nickel, 3–5 µm bright nickel, and 0.25–0.4 µm chromium. Adhesion is inspected after boiling water immersion for 30 min by ASTM B533-85(2019) cross-cut or peel methods. End-product safety standards for household appliances, IEC 60335-1:2020, govern electrical insulation; a metal-plated plastic knob cannot be relied upon for protective earthing or reinforced insulation unless the plating is intentionally grounded and bonded. PA-776 with plated surface may exhibit altered comparative tracking index as measured by IEC 60112:2020; creepage and clearance distances must therefore be evaluated after plating rather than on the raw resin. Regrind levels in appliance molding are often limited to 15–20 wt% maximum because higher levels cause inconsistent etch topography and visible rejects on bezel surfaces. Black specks arising from rubber degradation in the barrel are a known failure mode when melt residence time exceeds 10 min or melt temperature exceeds 250 °C.
Electronics shielding applications require a continuous conductive layer on a polymer shell. PA-776 can be used for internal reader covers, sensor housings, and portable device bezels where electromagnetic compatibility is required. The ABS substrate is etched in chromic-sulfuric acid using the same palladium-tin activation sequence as decorative plating, but the electrolytic copper step is replaced by electroless copper of 0.5–1.5 µm, followed by electroless nickel of 0.3–0.8 µm. Surface resistivity after plating typically falls from bulk ABS values above 10¹⁴ Ω/sq to 0.1–0.5 Ω/sq as measured by ASTM D257-14, though published data for PA-776 in this specific configuration is limited. Shielding effectiveness depends on shell geometry, seam continuity, and aperture size. A continuous electroless copper layer of 1.0 µm can provide 60–80 dB attenuation from 30 MHz to 1 GHz in standardized test fixtures, but actual enclosure performance must be verified by IEEE 299 or SAE ARP6248. Design radii below 0.5 mm at internal ribs create etch stagnation and thin electroless copper at the root, producing high-frequency leakage. Molding parameters for electronic housings use melt temperature 220–240 °C and mold temperature 40–55 °C. Flame-retardant additives are not recommended because halogenated or phosphorus-based packages can poison the palladium activation bath. PA-776 is not inherently flame-retardant; end-product flammability is governed by UL 94 at the specified wall thickness, and additional FR measures are required for IEC 62368-1:2023 compliance. The plated shell must be post-rinsed to remove residual etching chemicals because ionic contamination above 1.0 µg/cm² chloride equivalent can cause leakage currents on printed circuit assemblies.
Furniture pulls, hinge cover plates, and decorative caps molded from PA-776 are plated with satin or bright nickel-chromium finishes. The polymer is injection molded with wall thicknesses of 2.0–3.0 mm and mold temperature of 50–65 °C to avoid visible weld lines. The chromic-sulfuric etch for furniture hardware is adjusted for parts with deep draw and sharp lettering: 370–400 g/L CrO₃ and 360–400 g/L H₂SO₄, at 62–67 °C for 7–10 min. A satin finish is produced by controlled micro-roughness of the substrate before plating or by using a satin nickel top layer. The satin nickel layer is typically 4–6 µm over 10–15 µm copper and 5–8 µm semi-bright nickel. Abrasion resistance is evaluated by ASTM D4060-19 Taber wear with CS-10 wheels and 500 g load; plated surfaces show significantly lower mass loss than painted ABS, but published data for PA-776 at specific satin layer thicknesses is limited. Environmental exposure for furniture hardware is tested by ASTM B368-21 CASS for 8 h or 16 h depending on service category. Stress cracking is a known field failure when assembly screws are over-torqued into molded bosses; the boss outer diameter should be at least 2.0–2.5× the screw diameter to avoid hoop stress that cracks the electroplated shell. PA-776 processed at the upper melt temperature limit of 250 °C can experience surface gloss reduction; keeping barrel residence time below 8 min and using reverse profile screw temperature settings from 210 °C rear to 240 °C nozzle is recommended.
Nameplate and badge substrates are molded from PA-776 because the grade flows into thin, flat geometries with sharply defined lettering and rib borders. Tooling is typically single- or multi-cavity with gate thickness of 0.8–1.2 mm and mold temperature of 50–65 °C to replicate textured surfaces that are later electroplated. In the pre-plating line, alkaline soak cleaning at 55–60 °C removes ejection grease and handling oils. The chromic etch is operated at 360–400 g/L CrO₃ and 350–390 g/L H₂SO₄, with immersion of 5–8 min because thin cross-sections reach the required weight loss faster than thick automotive grilles. For selective chrome emblems, PA-776 is plated with 12–18 µm copper, 6–9 µm bright nickel, and 0.2–0.3 µm chromium. Logo recess areas are filled with a screenable mask or etch-resist ink before plating. Peel adhesion of nameplate specimens is tested by ASTM B533-85(2019) after 24 h conditioning at 23 °C and 50 % RH. Field failures on actual badge plating lines have been traced to insufficient etching of molded-in stress near the sprue gate; relocating the gate to a non-visible edge or increasing mold temperature to 60 °C reduces the defect. UV exposure of plated badges is evaluated by ISO 105-B02:2014 for colorfastness of any secondary organic coatings, not for the metallic layer. The final article is subject to RoHS Directive 2011/65/EU; metallic chromium and nickel are not restricted substances, but the resin compound must not contain intentionally added lead, mercury, cadmium, or hexavalent chromium.
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CHIMEI ABS PA-776 is an electroplating-grade acrylonitrile–butadiene–styrene terpolymer supplied as cylindrical pellets for injection molding of decorative and semi-structural automotive, sanitary, and appliance components. The resin is formulated to produce low molded-in residual stress and a controlled polybutadiene particle-size distribution that permits uniform micro-etching in chromic-sulfuric acid baths. Its melt volume-flow rate, measured in accordance with ISO 1133-1 at 220 °C and 10 kg, is commonly specified in supplier technical literature as 20–24 cm³/10 min; density under ISO 1183-1 is approximately 1.05 g/cm³. Published data for exact lot-dependent notched impact and tensile values should be confirmed against the manufacturer certificate of analysis, but typical datasheet values place the material in the medium-to-high-impact plating-ABS envelope with Charpy notched impact strength near 20 kJ/m² at 23 °C under ISO 179-1/1eA and tensile stress at yield near 43 MPa under ISO 527-2.
| Property | Test method | Typical value or range |
|---|---|---|
| Melt volume-flow rate | ISO 1133-1 | 20–24 cm³/10 min at 220 °C/10 kg |
| Density | ISO 1183-1 | 1.05 g/cm³ |
| Tensile stress at yield | ISO 527-2 | 43 MPa |
| Tensile strain at break | ISO 527-2 | 15% |
| Flexural modulus | ISO 178 | 2.3 GPa |
| Charpy notched impact strength at 23 °C | ISO 179-1/1eA | 20 kJ/m² |
| Vicat softening temperature | ISO 306 | 98 °C |
| Deflection temperature under load at 1.8 MPa | ISO 75-2/A | 94 °C |
| Mold shrinkage | ISO 294-4 | 0.4–0.6% |
Pre-drying in a closed-loop desiccant dryer with a dew point below −30 °C is required when ambient relative humidity exceeds 60%. The resin should be dried at 80–90 °C for 2–4 h to a residual moisture content below 0.05% by weight before plastication. Production-scale molding on a 100–160 t toggle-clamp injection molding machine with a 20:1 L/D reciprocating screw and a non-return ring has produced consistent filling of direct-gated bezels when the melt temperature is held at 235–255 °C and the mold surface temperature is maintained at 60–80 °C on both cavity and core. These conditions are not universal; the processing window narrows when wall thickness falls below 1.0 mm or when the flow length exceeds 200 mm. Shot size should remain below 65% of barrel capacity, and the cushion should be controlled at 3–6 mm to avoid shear heating and polybutadiene degradation. Regrind addition above 15% is generally not recommended for plating-critical surfaces because oxidized butadiene domains reduce etching uniformity. Post-mold shrinkage measured according to ISO 294-4 may vary directionally; flow-direction shrinkage in highly packed gate regions can be 0.1–0.2 percentage points lower than transverse shrinkage, altering plate thickness distribution on large surfaces.
The distinction is not captured solely by melt flow rate or tensile strength. Standard injection-molding ABS grades often produce acceptable mechanical test bars but variable etched surfaces because the polybutadiene phase is not optimized for oxidative attack. In chromic-sulfuric acid etching, the rubber particles are selectively oxidized, leaving micro-cavities with diameters in the 0.1–0.5 µm range. PA-776 is formulated with a narrow rubber particle-size distribution and controlled grafting of styrene-acrylonitrile copolymer onto the polybutadiene core, which permits more uniform etched pores. This property is not reported on a typical datasheet but is inferred from plating adhesion results under ASTM B571. If the rubber particle size is too large or too polydisperse, the etched pores may exceed 0.5 µm, reducing mechanical anchor strength and producing skip plating. PA-776 is controlled to avoid this defect mode.
For adhesion measurement, the metallic coating is crosshatched and subjected to thermal cycling or hot-water immersion. Common acceptance criteria include no blistering or peeling after immersion in water at 60 °C for 30 min followed by tape pull. In plating audits on a 180 t injection molding cell for radiator-grille vanes, general-purpose ABS showed edge blistering at low-current-density areas while PA-776 showed full coverage. The comparison is process-specific; published data for directly controlled side-by-side testing of this specific configuration is limited, but the failure pattern is consistent with residual stress and etch-depth variation.
The electroplating sequence begins with alkaline cleaning and acid neutralization, followed by chromic acid etching at 60–70 °C for 5–12 min in baths containing 350–420 g/L chromic acid and 380–430 g/L sulfuric acid. Etch bath temperature must be controlled within ±2 °C because the etch rate follows an Arrhenius dependence; a 5 °C deviation may increase etch depth by 20–40% and produce over-etching in high-stress regions. After neutralization in sodium bisulfite at 10–50 g/L and 25–35 °C for 1–3 min, the surface is immersed in a palladium-tin colloidal activation bath at 25–35 °C, followed by acceleration in dilute sulfuric acid. Electroless copper or nickel deposition then produces a conductive seed layer of 0.5–1.0 µm thickness before electrolytic copper strike. Total decorative plating thickness on automotive door handles and grille surrounds is often 20–40 µm, measured by ISO 2177:2003 coulometric thickness determination.
Adhesion failures rarely appear immediately after plating. They emerge after thermal cycling between −30 °C and 80 °C or after hot-humidity exposure. The failure mode is usually cohesive rupture within the etched ABS surface layer, not separation at the metal-polymer interface. Test methods such as ASTM B571 specify mechanical and thermal procedures, including crosshatch cutting with a sharp-edged tool at 1 mm spacing and tape adhesion testing. In plating-grade ABS, the etched surface layer is typically 0.1–0.3 µm deep; over-etching creates deep but mechanically weak pores, while under-etching yields insufficient mechanical interlocking. PA-776's controlled butadiene particle size is designed to keep the etch layer within this critical thickness band, but the result depends on injection gate location, pack pressure, and molded-in stress.
Process audits on a 240 t two-platen injection molding machine used for instrument-panel bezels showed that plate delamination after thermal cycling correlated with excessive holding pressure above 90 MPa and with a melt temperature above 265 °C. The high pack pressure increased orientation in the gate region, causing locally high residual stress and faster chromic acid attack. When the mold temperature was increased from 50 °C to 70 °C, the same tool produced parts that passed 3 cycles of −30 °C/80 °C thermal shock without blistering. Thermal expansion mismatch between the plated metal layer and ABS substrate is also relevant; literature values for ABS coefficient of linear thermal expansion are commonly 80–100 × 10⁻⁶/K, whereas electrolytic copper-nickel-chromium layers are typically 10–30 × 10⁻⁶/K. These observations are specific to the tool geometry and plating line; published data for other configurations is limited.
PA-776 occupies a lower heat-deflection position than electroplating-grade PC/ABS. Under ISO 75-2/A at 1.8 MPa, the ABS plating grade is commonly cited near 94–98 °C, while PC/ABS electroplating blends may exceed 105–115 °C. The trade-off is lower melt viscosity and easier filling of thin-wall geometries. The melt volume-flow rate of PA-776 at 220 °C/10 kg is generally 10–20 cm³/10 min above many general-purpose ABS grades and permits lower peak cavity pressure, commonly 70–100 MPa in 1–2 mm wall sections, compared with 90–140 MPa for PC/ABS in similar sections. Flexural modulus of the unplated PA-776 is approximately 2.3 GPa under ISO 178; after electrolytic copper-nickel-chromium deposition at 25 µm total thickness, finished part bending stiffness may increase, but published data for exact stiffening ratio in PA-776 is limited.
Compared with general-purpose ABS, the measurable differences include a plating-grade melt flow rate around 20–24 cm³/10 min and a lower tendency for skip plating; compared with PC/ABS, PA-776 has lower heat resistance but does not require the high mold temperatures and aggressive drying of PC-containing blends. It is also less prone to plate-to-resin stress cracking caused by organic solvents used in cleaning after plating, although aromatic and chlorinated solvents should be avoided.
| Attribute | CHIMEI ABS PA-776 | General-purpose ABS | PC/ABS electroplating grade |
|---|---|---|---|
| Melt volume-flow rate at 220 °C/10 kg | 20–24 cm³/10 min | 5–15 cm³/10 min | 8–20 cm³/10 min |
| Deflection temperature under load at 1.8 MPa, ISO 75-2/A | 94–98 °C | 96–100 °C | 105–115 °C |
| Plating etch response | Uniform microporosity | Variable, skip plating risk | Special etch may be required |
| Typical mold surface temperature | 60–80 °C | 40–80 °C | 80–100 °C |
PA-776 is not intended for continuous load-bearing exposure above 85 °C, for direct contact with strong alkalis, or for applications requiring inherent conductivity before plating. Avoid compounding with amine-based flame retardants, which can interfere with the palladium-tin activation step and reduce electroless coverage. If regrind is used, it should be kept below 15% and must be dried under the same residual-moisture control as virgin pellets. The resin has no inherent resistance to ultraviolet exposure in unplated condition; ASTM G154 cycle testing on unpigmented substrates typically shows gloss reduction after 500 h unless painted or plated. Published data for the specific UV weathering of PA-776 in unpigmented form is limited, but the limitation is relevant for parts with partially masked plating.