| HS Code | 489197 |
| Density | 1.04 g/cm³ |
| Melt Flow Rate | 1.8 g/10 min (220 °C/10 kg) |
| Tensile Strength | 44 MPa |
| Flexural Strength | 74 MPa |
| Flexural Modulus | 2.3 GPa |
| Notched Izod Impact Strength | 196 J/m (20 kg·cm/cm) |
| Rockwell Hardness | R105 |
| Heat Deflection Temperature | 85 °C at 1.82 MPa |
| Vicat Softening Temperature | 105 °C |
| Flammability Rating | UL94 HB |
| Molding Shrinkage | 0.4–0.6 % |
| Drying Temperature | 80–90 °C |
| Processing Temperature | 210–240 °C |
As an accredited CHIMEI (Chi Mei) ABS PA-757 factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.
| Packing | CHIMEI (Chi Mei) ABS PA-757 is packaged in 25 kg moisture-resistant paper bags, palletized with 40 bags per pallet. |
| Container Loading (20′ FCL) | Packed in 25 kg bags, CHIMEI ABS PA-757 typically loads about 17 metric tons (680 bags) per 20′ FCL, subject to carrier weight limits. |
| Shipping | CHIMEI (Chi Mei) ABS PA-757 is supplied as non-hazardous ABS resin pellets, typically packed in 25 kg moisture-barrier bags on pallets, with jumbo bags available. Ship in dry, ventilated containers; keep dry, away from direct sunlight and heat. Standard international freight and dry container transport are recommended. |
| Storage | Store CHIMEI ABS PA-757 in original, sealed bags in a cool, dry, well-ventilated warehouse, away from direct sunlight, heat, flames, and strong oxidizers. Keep packages closed until use to prevent moisture absorption, dust, and contamination. Avoid prolonged UV exposure and physical damage. Maintain low humidity and moderate ambient temperature; use first-in-first-out and dry before processing if specified. |
| Shelf Life | Typical shelf life: 24 months when stored dry, cool, and protected from direct sunlight in original sealed packaging. |
In appliance housing production, material acceptance for CHIMEI ABS PA-757 is determined by moisture equilibrium after desiccant drying rather than by as-received melt flow. Published processing guidelines for CHIMEI ABS PA-757 specify a residual moisture ceiling of 0.05 wt% before plastication; this is achieved with a desiccant dryer set to 80 °C for 3–4 h at a dew point of −20 °C or lower. The melt temperature band of 220–245 °C is maintained across the barrel profile from rear zone 190–200 °C to nozzle 235–245 °C, with hot runner manifolds held at the nozzle set point or 10 °C below to prevent thermal yellowing. Mold temperature is controlled between 40 °C and 80 °C, with the lower half used for high-gloss untextured cavities and the upper half used for textured cavities to reproduce grain depth. Injection pressure typically falls within 80–100 MPa, hold pressure between 50 MPa and 70 MPa, and back pressure between 0.5 MPa and 1.5 MPa. Screw L/D of 20:1 to 22:1 with a compression ratio of 2.4:1 and shot size held to 40–60% of barrel capacity minimizes residence-time degradation. Regrind from clean runner systems may be reintroduced at 10–20 wt% for non-cosmetic internal features and up to 10 wt% for visible exterior surfaces; higher fractions raise the risk of silver streaks and gloss variance under ASTM D523 20° geometry. Appliance enclosures such as vacuum cleaner motor shrouds, air purifier front panels, and dehumidifier intake grilles fall under IEC 60335-1:2020 clause 30.2.2 glow-wire testing, with the UL 94 HB rating of PA-757 requiring product designers to establish that the housing does not function as a fire barrier. Dimensional stability for snap-fit assembly is verified by ISO 294-4 shrinkage determinations of 0.4–0.7% in the flow direction.
Gate-freeze validation establishes the processing window for non-weather-exposed automotive interior trim tools before mold sign-off in PA-757 cover components. Components such as seat side shields, steering column upper and lower covers, glove box outer lids, and lower B-pillar trims are molded in 2.0–2.5 mm nominal wall stock to balance impact stiffness against sink development. The material is dried to 0.05% moisture at 80 °C for 3–4 h, then processed at melt temperatures of 230–250 °C and mold temperatures of 50–80 °C. Sequential valve-gated hot runners are employed on multi-cavity tools to prevent flow-front hesitation and knit lines at boss features; cavity pressure sensors trigger transfer from velocity to pressure control at 30–50 MPa. Packing pressure is held at 50–60% of injection pressure for 0.5–0.8 s after cavity peak to allow gate freeze. Production scrap from start-up shots and degated runners is reintroduced at no more than 20 wt% after in-line granulation and magnetic separation; regrind in visible Class A surfaces is restricted to 0–10 wt% to limit gloss reduction as measured by ASTM D523 60° geometry. Flammability compliance is verified under FMVSS 302 and ISO 3795, with burn-rate results below the 100 mm/min limit for passenger compartment materials. PA-757 without additional UV stabilization is excluded from glazing-adjacent or direct-sunlight surfaces; published data for the specific configuration of unpainted PA-757 under SAE J2412 is limited, and UV-stabilized grades are required for sunlight-adjacent positions. VOC and SVOC emissions for interior parts are tested under VDA 278 or ISO 12219-1 when OEM specifications require, with styrene and acrylonitrile residuals as the main analytes. Terminal components include injection-molded seat shield assemblies with molded-in clips, screw bosses with M4 self-tapping thread inserts, and lower IP closeout panels.
In electronics enclosure production, thin-wall PA-757 fills 1.5–2.0 mm nominal wall at melt temperatures of 220–240 °C without exceeding 1400 bar injection pressure. Screw recovery is set at 50–100 rpm with a back pressure of 0.5–1.0 MPa to avoid frictional heat and degradation; the screw L/D of 20:1 to 22:1 and compression ratio of 2.4:1 are retained. The mold temperature is maintained at 50–70 °C using water lines with turbulent flow at a Reynolds number greater than 10,000. Drying at 80 °C for 3 h to a moisture content below 0.05% prevents splay at weld lines. Regrind from edge gates is added at 10–25 wt% for internal frames and brackets; external high-gloss covers are limited to 10 wt% regrind to hold 60° gloss above the acceptance threshold defined in the OEM drawing. Compliance for electrical equipment safety is assessed under IEC 62368-1:2018 clause 4.1.1 for physical enclosures, with PA-757 rated UL 94 HB at a 3.0 mm test thickness and thus excluded from use as a fire enclosure in circuits exceeding SELV. RoHS 2011/65/EU Annex II and REACH 1907/2006 Article 33 are applied to final colorants and release agents; brominated flame retardants are not added. Terminal parts include desktop PC front bezels, keyboard top covers, mouse shells, and set-top box housings.
| Standard | Clause or method | Parameter |
|---|---|---|
| IEC 62368-1:2018 | 4.1.1 | Physical enclosure and fire enclosure boundaries |
| UL 94 | HB, 3.0 mm | Burn rate classification |
| RoHS 2011/65/EU | Annex II | Pb, Hg, Cd, Cr(VI), PBB, PBDE |
| REACH 1907/2006 | Article 33 | SVHC notification at >0.1 wt% |
Toy applications impose strict pigment traceability before any regrind is introduced into PA-757. The base resin is converted into toy vehicle bodies, modular storage bins, and snap-assembly playset panels at melt temperatures of 200–230 °C, mold temperatures of 40–60 °C, and drying at 80 °C for 2–4 h to below 0.05% moisture. Injection molding parameters use a short hold phase because the material exhibits a broad plateau between 0.4% and 0.7% mold shrinkage; long packing beyond gate freeze causes residual stress and warpage in large flat panels. Unlike appliance or electronics programs, toy production excludes regrind reintroduction entirely unless the regrind is from the same lot, granulated in a dedicated closed loop, and validated under EN 71-3:2019+A1:2021 migration tests for all nineteen elements, including aluminum, barium, cobalt, copper, manganese, and zinc. The EU Toy Safety Directive 2009/48/EC requires that the finished component comply with mechanical and physical properties under EN 71-1 and that colorants meet the limits in Toy Safety Directive Annex II. For the United States market, ASTM F963-23 heavy-element solubility limits in accessible substrates, 16 CFR 1303 lead in surface coatings, and 16 CFR 1307 phthalate restrictions apply; ABS PA-757 contains no ortho-phthalate plasticizer, but final compound certification must verify pigment carriers. The UL 94 HB rating does not exempt a toy from 16 CFR 1500.44 flammability evaluation; each final substrate geometry is tested by the converter. Terminal products are predominantly non-small-part injection moldings with wall thickness greater than 1.5 mm, such as ride-on toy fenders, playset base panels, and construction play blocks with minimum corner radius 0.5 mm to avoid stress concentration.
When projected area exceeds 1200 cm², large-format printer side covers, scanner lids, and copier paper trays molded from PA-757 require three-plate cold-runner tools with sequential valve gating. The melt is delivered at 230–250 °C, with mold temperature held at 50–70 °C and a fill time of 1.5–2.5 s to prevent flow hesitancy at thin ribs and stiffener crosses. The material is dried to below 0.05% moisture before processing; regrind is introduced at 15–25 wt% for non-appearance surfaces and 0–10 wt% for visible panels, with granulate screened through a 2.5 mm mesh to limit particle-size variance. Injection pressure is limited to 90–110 MPa; hold pressure is set at 50–70 MPa for 4–6 s on gates with 2.0–2.5 mm land length. Warpage control for long 400–600 mm panels uses balanced cooling circuits with a temperature differential of no more than 3 °C between cavity and core. Office equipment safety standards IEC 62368-1:2018 and UL 94 HB apply; PA-757 is not acceptable for fire enclosures unless the end-product design provides a separate metallic or V-0 polymer barrier. Mechanical property verification uses ISO 178 flexural modulus in the 2.0–2.3 GPa range and ASTM D638 tensile yield strength above 40 MPa, with notched Izod impact under ASTM D256 measured at 23 °C. Continuous service temperature is limited to 60 °C for load-bearing ribs because the HDT under 1.82 MPa is approximately 96 °C and creep resistance declines above the glass transition region. Terminal parts include printer front doors, scanner bezels, and all-in-one paper cassettes with molded gear racks; living hinges are normally avoided in PA-757 due to notch sensitivity at the hinge root, and separate hinge mechanisms or polypropylene overmolding are specified where cyclic flexural fatigue exceeds ABS elongation at yield.
Monofilament feedstock extrusion for material extrusion tooling is a lower-volume but technically demanding application for PA-757. The resin is pre-dried to 0.03–0.05% moisture at 80 °C for 4 h in desiccant dryers before single-screw extrusion at L/D 24:1 to 28:1 with a compression ratio of 2.5:1 to 3.0:1. Barrel zones are profiled from 170–180 °C at the feed throat to 210–220 °C at the metering section and 200–210 °C at the die; water quenching is set at 40–50 °C prior to laser diameter measurement. Filament target diameters of 1.75 mm ±0.05 mm and 2.85 mm ±0.10 mm are maintained using melt pump-controlled throughput; roundness deviation below 0.03 mm is verified with a dual-axis laser gauge. PA-757 feedstock may be used for dimensionally stable print jigs and assembly fixtures that require a HDT of approximately 96 °C at 1.82 MPa, but layer adhesion under ISO 527-2 cross-layer tensile testing is dependent on print-chamber temperature and extrusion multiplier. The printed parts fall under the General Product Safety Directive 2001/95/EC for secondary tooling, with REACH 1907/2006 Article 33 communication for any SVHC-containing additives; RoHS 2011/65/EU applies when fixtures are used in electrical assembly workflows. Terminal products are large-format printed drill jigs, adhesive-bonding fixtures, and CMM holding nests.
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CHIMEI (Chi Mei) ABS PA-757 is an unfilled acrylonitrile-butadiene-styrene injection-molding grade formulated for a balanced flow-to-impact relationship and high surface gloss. The resin is supplied as cylindrical pellets with a specific gravity of 1.05 when measured according to ISO 1183-1:2019. In the molten state, the material exhibits a melt mass-flow rate of 18 g/10 min under 220°C/10 kg when tested to ISO 1133-1:2022. Tensile yield stress is 46 MPa at 50 mm/min per ISO 527-2, with nominal tensile elongation at break of 25%. Flexural strength is 65 MPa and flexural modulus is 2400 MPa per ISO 178. Notched Izod impact resistance at 23°C is 20 kJ/m² for 3.2 mm specimens per ISO 180/1A. Heat deflection temperature under 1.80 MPa load is 89°C per ISO 75-2/A, and Vicat softening temperature is 105°C per ISO 306/B50. The grade is characterized as a general-purpose high-gloss ABS for injection-molded components requiring moderate room-temperature toughness, predictable mold filling, and strong replication of polished cavity surfaces.
The principal formulation difference is the combination of medium acrylonitrile content in the styrene-acrylonitrile phase and controlled polybutadiene rubber particle-size distribution. That morphology preserves gloss at the molded surface while limiting the low-viscosity impact loss commonly found in very high-flow ABS grades. Relative to CHIMEI PA-756, PA-757 has a lower melt flow index and improved notched impact retention after molding; relative to PA-747, PA-757 shifts the balance toward lower melt viscosity for thin-wall filling but with reduced cold-temperature ductility because of lower rubber-phase content. PA-757 is not positioned as an electroplating grade. For electroplating operations, PA-727 or a designated plating ABS should be considered because etch adhesion requires a rubber morphology optimized for electrolytic etch treatment and testing under ISO 2819 is required before production release. Direct numerical comparison across adjacent grades should be confirmed against current manufacturer datasheets and UL Yellow Card entries because published data for identical tooling configurations is limited.
With a dehumidifying hopper set at 80°C, incoming resin moisture is reduced to less than 0.05 wt% within 3 h. Storage or transport at ambient relative humidity above 60% increases the required drying time to 3 h to 4 h when the dryer supply air has a dew point of -30°C or lower. Under-dried material produces splay, silver streaks, or molded-in voids on high-gloss appearance surfaces, especially when bulk material from opened gaylords is blended with regrind. Regrind addition should remain below 25 wt% unless production-scale process capability data confirm no significant loss of gloss, color shift, or notched impact performance. The material feeds reliably through a reciprocating-screw injection unit with 20:1 to 25:1 L/D, a compression ratio of 2.0:1 to 2.5:1, and a free-flow nonreturn valve. Nozzle melt temperature is maintained between 210°C and 240°C; prolonged melt residence above 260°C should remain below 5 min to avoid SAN phase color shift and polybutadiene oxidation.
For enclosure walls below 1.5 mm, cavity filling should be completed between 0.5 s and 1.5 s to prevent premature gate freeze and excessive pressure drop. Mold surface temperatures from 40°C to 70°C are used, with the upper range preferred for polished cavity replication and reduced flow marks. Hold pressure is set at 60% to 80% of peak injection pressure for gate seal control. Back pressure is maintained between 0.5 MPa and 1.0 MPa on a 20:1 L/D general-purpose screw, and screw surface speed is typically held at 30 m/min to 60 m/min. A shut-off nozzle is required; open nozzles at high melt temperature increase drool and secondary sprue sticking. Deep ribs opposite appearance surfaces generate sink marks if rib thickness exceeds 60% of the adjacent wall. Gate freeze time for a 2.0 mm wall at 50°C mold temperature is generally below 3 s, but published data for this specific configuration is limited; gate seal should be confirmed by short-shot weight stabilization rather than fixed timer settings.
| Property | Test method | Value |
|---|---|---|
| Specific gravity | ISO 1183-1:2019 | 1.05 |
| Melt mass-flow rate | ISO 1133-1:2022, 220°C/10 kg | 18 g/10 min |
| Tensile yield stress | ISO 527-2, 50 mm/min | 46 MPa |
| Tensile elongation at break | ISO 527-2 | 25% |
| Flexural strength | ISO 178 | 65 MPa |
| Flexural modulus | ISO 178 | 2400 MPa |
| Notched Izod impact strength | ISO 180/1A, 23°C, 3.2 mm | 20 kJ/m² |
| Rockwell hardness | ISO 2039-2 | 110 R |
| Heat deflection temperature | ISO 75-2/A, 1.80 MPa | 89°C |
| Vicat softening temperature | ISO 306/B50 | 105°C |
| Mold shrinkage | ISO 294-4 | 0.4% to 0.7% |
| Flammability classification | UL 94 | HB at 1.5 mm |
High-gloss surface replication depends on mold steel polish, venting, and thermal uniformity. Polished cavity surfaces at SPI A-1 to A-2 level are required for high-gloss appearance parts. Parting-line vent depth should not exceed 0.02 mm to avoid flash on high-gloss surfaces. Typical injection-molded applications include appliance control faceplates, cosmetic caps and closures, toy shells, power-tool clamshell housings, and consumer-electronics side frames where surface gloss, dimensional stability, and moderate room-temperature impact resistance are required. The grade is not intended for sustained outdoor exposure because unreinforced ABS undergoes ultraviolet-induced gloss loss and embrittlement unless painted or shielded with a UV-stable cap layer.
The material carries a UL 94 HB classification at 1.5 mm thickness under current UL Yellow Card conditions for natural and black concentrates. It is not a V-0 grade. Live-part enclosures, power supply housings, or components requiring glow-wire performance above 650°C per IEC 60695-2-11 require a flame-retardant ABS such as a CHIMEI PA-765A or PA-777-series grade selected for the specific regulatory exposure. RoHS 2011/65/EU and REACH compliance status is lot-dependent and must be confirmed through the supplier certificate and current UL Prospector documentation. No statement in this technical overview replaces the manufacturer certificate of analysis or the UL Yellow Card specification.
Thermal boundaries for PA-757 are determined by the SAN phase glass transition and the unsaturation of the polybutadiene fraction. Melt temperatures above 260°C increase the rate of rubber-phase degradation and crosslinking, leading to dark specks and increased yellowing. Residence time at 240°C should be limited to 8 min when interruptions occur; the barrel should be purged with a general-purpose ABS or acrylic purging compound if downtime exceeds that limit. The material is not formulated for low-gloss automotive interior surfaces; grain depth and mold texture control surface appearance in interior trim applications. For low-gloss requirements, CHIMEI low-gloss or polycarbonate-blend grades should be evaluated. Paintability and solvent-wipe adhesion require pretesting with the selected coating system because painted parts can exhibit variable adhesion depending on surface polarity and mold release transfer. No silicone-based mold release should be used on appearance parts bonded or painted after molding.
Injection-molding process conditions reported on production-scale machines with 20:1 to 25:1 L/D general-purpose screws show stable operation at melt temperatures between 210°C and 240°C, mold temperatures between 40°C and 70°C, and back pressures between 0.5 MPa and 1.0 MPa. For hot-runner tooling, balanced manifolds with open gate diameters from 0.8 mm to 2.0 mm are used depending on wall thickness and fill speed. Nozzle tips should be maintained at melt temperature, and stagnation zones in hot-runner channels must be eliminated to prevent progressive yellowing. Published data for PA-757-specific hot-runner pressure drop across multi-drop systems is limited; cavity-to-cavity fill balance should be verified with short-shot studies and mold-flow analysis using the measured melt viscosity data from the current supplier datasheet.
Differences from filled or flame-retardant grades include lower melt abrasion of barrels and screws because PA-757 contains no glass fiber or mineral filler. It also exhibits lower plate-out tendency than brominated flame-retardant ABS grades in high-gloss tooling. However, it is not suitable for load-bearing structural components requiring tensile modulus above 3000 MPa because unfilled ABS has a flexural modulus of approximately 2400 MPa. Components with continuous operating temperatures above 70°C under mechanical load should not be specified without creep testing because the HDT under 1.80 MPa is 89°C. The material is intended primarily for injection molding; thick-sheet extrusion or blow molding is not characteristic of this grade.