| HS Code | 479178 |
| Product | CHIMEI ABS PA-736 |
| Manufacturer | Chi Mei Corporation |
| Polymer Type | Acrylonitrile Butadiene Styrene (ABS) |
| Grade | PA-736 |
| Processing Method | Injection Molding |
| Density | 1.18 g/cm³ |
| Melt Flow Rate | 15 g/10 min (220°C/10 kg) |
| Tensile Strength | 42 MPa |
| Flexural Modulus | 2400 MPa |
| Notched Izod Impact Strength | 12 kJ/m² |
| Heat Deflection Temperature | 75°C at 1.82 MPa |
| Vicat Softening Temperature | 90°C |
| Flammability Rating | UL94 V-0 at 1.5 mm |
| Features | Flame retardant |
As an accredited CHIMEI (Chi Mei) ABS PA-736 factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.
| Packing | CHIMEI ABS PA-736 is packed in 25 kg moisture-barrier paper bags, 40 bags per pallet (1,000 kg net). |
| Container Loading (20′ FCL) | CHIMEI ABS PA-736 is packed on pallets and loaded into a 20′ FCL container, secured for safe export transport. |
| Shipping | CHIMEI (Chi Mei) ABS PA-736 is shipped as non-hazardous ABS resin pellets and is not regulated under DOT/IMDG/IATA. Typical packaging is 25 kg moisture-barrier bags or 500–1000 kg jumbo bags. Keep dry, away from direct sunlight and heat, and avoid contamination or sharp impacts during transport. |
| Storage | Store CHIMEI ABS PA-736 in a cool, dry, well-ventilated area, away from direct sunlight, heat, sparks, and open flames. Keep containers tightly sealed and protect contents from moisture and contamination. Avoid contact with strong oxidizers. Maintain good housekeeping, prevent dust accumulation and static buildup, and use original packaging. Rotate stock and follow local storage regulations. Do not store near food or drinking water. |
| Shelf Life | CHIMEI ABS PA-736 has a typical shelf life of two years when stored unopened in a cool, dry, well-ventilated area. |
On multicavity router and set-top box tooling, PA-736 is dried in a desiccant hopper dryer at 80°C for 3–4 h until pellet moisture by Karl Fischer titration is below 0.05 wt% and inlet dew point is ≤ -32°C. The grade is fed into a hydraulic toggle clamp machine of 120–180 tonnes with a 20:1 to 24:1 L/D general-purpose screw, a compression ratio of 2.2:1–2.8:1, and a reverse-pitch non-return valve checked for shot-to-shot cushion stability. Barrel zones from rear to nozzle are set at 190–210°C, 200–220°C, 210–230°C, and 220–245°C. Mold surface temperature is held at 40–60°C, with the upper end used when high-gloss front bezels are molded against polished S136 cavity steel. Injection speed is profiled at 150–250 mm/s for walls of 1.6–2.5 mm, followed by hold pressure of 50–70 MPa for 2–5 s and cooling time of 6–10 s/mm. Venting depth is maintained at 0.02–0.03 mm at the end of fill; insufficient venting on textured ribs generates burn marks and local molecular weight reduction at gate vestiges. For these electronics housings, gate land length is set to 0.8–1.2 mm and runner diameter to 4–6 mm in cold-runner tools, or hot-runner valve tips with a pitch of 60–80 mm are used to balance filling across four-cavity faces. The downstream parts include Wi-Fi router bottom shells, network switch front bezels, set-top box covers, and small server drive sleds. RoHS Recast 2011/65/EU Annex II screening is performed by XRF on homogenized molded plaques: Pb, Hg, and Cr VI below 1000 mg/kg, Cd below 100 mg/kg. REACH Article 33 communication is documented at 0.1% w/w SVHC threshold. IEC 62368-1 enclosure requirements are end-product tests, not raw-material certifications. The unfilled grade is typically documented as UL 94 HB at 3.0 mm under IEC 60695-11-10, but thinner walls, regrind, and pigmented concentrates require finished-part horizontal burning re-evaluation because PA-736 is not a self-extinguishing formulation.
| Parameter | 1.2–1.8 mm wall | 1.8–2.5 mm wall | 2.5–4.0 mm wall |
|---|---|---|---|
| Nozzle temperature | 235–245°C | 220–235°C | 200–220°C |
| Mold surface temperature | 50–65°C | 40–55°C | 30–45°C |
| Hold pressure | 65–80 MPa | 50–70 MPa | 35–50 MPa |
| Screw back pressure | 0.5–1.2 MPa | 0.4–1.0 MPa | 0.3–0.8 MPa |
| Screw speed | 60–90 rpm | 50–80 rpm | 40–70 rpm |
| Cooling time per mm | 4–7 s/mm | 6–10 s/mm | 8–14 s/mm |
The limiting paint adhesion variable on low-bake interior trim is not topcoat chemistry alone but the molded-in stress at gate vestiges and knit lines. On PA-736 steering column covers, instrument cluster hoods, air vent louvers, and door inner decorative frames, mold temperature is raised to 50–70°C to reduce frozen-in orientation, and fill velocity is staged at 120–200 mm/s with a short final packing step of 45–65 MPa for 2–3 s followed by 25–35 MPa for the remaining cooling phase. Molding operators record cushion position at 3–6 mm and reject parts when cushion variation exceeds ±1.5 mm, because unstable packing creates residual stress concentrated near thin-to-thick transitions. Painted parts are allowed at least 24 h of stress-relief at 23°C±2°C before solvent wiping. Isopropanol wiping at 35–45 vol% is standard, but acetone, methyl ethyl ketone, butyl acetate, and aromatic hydrocarbons are excluded from pre-paint cleaning because they induce environmental stress crazing in stressed gate areas. A waterborne 2K polyurethane primer is applied at 8–15 μm dry film thickness and baked at 70–80°C for 30–45 min; part surface temperature is maintained below the published heat deflection temperature of the grade under 1.8 MPa by placing thermocouples at the thickest boss. Cross-cut adhesion after 40°C water immersion for 240 h is evaluated per DIN EN ISO 2409, with classification 0 or 1 on smooth and grained surfaces. Finished interior parts are also assessed under OEM flammability specifications based on FMVSS 302; because grain depth, part thickness, and paint system alter burn rate, published data for this specific configuration is limited and component-level testing is required. Terminal painted trim includes lower steering column covers, instrument panel side scuff inserts, air outlet knob surrounds, and painted door handle bezels.
Citric acid at 10% concentration in hot water at 60°C is used as a cleaning agent in food processing equipment housings, and this solution creates a recurrent environmental stress cracking test condition for ABS grades. For PA-736 food processor bowl covers, hand blender bodies, vacuum cleaner upper covers, and small appliance footplates, the mold design must avoid high packing stress at bosses and screw bosses that are exposed to acid or detergent during service. Boss radius-to-wall-thickness ratio is kept at ≥ 0.6, and melt temperature is held between 215–235°C while mold surface temperature is controlled at 35–50°C. Cycle times of 35–60 s are typical for wall sections of 2.0–2.5 mm, with hold pressure of 45–60 MPa and screw back pressure of 0.4–0.8 MPa. Hot-runner valve gates are opened sequentially when volumetric filling reaches 95–98% to reduce pressure spike at the gate. Contact with sodium hypochlorite solution below 5% active chlorine is permissible for short wipe-down, but immersion at elevated temperature is not recommended because PA-736 develops surface microcrazes under retained stress, particularly near molded-in inserts or flow weld lines. The resin is not flame-retardant. End-product glow wire testing per IEC 60695-2-11 is required under IEC 60335-1 clause 30.2 when the final appliance standard imposes glow wire temperatures of 550°C, 650°C, or 750°C; pass/fail is determined on the thinnest wall and at rib intersections, not on uniform plaques. Terminal food-contact adjacent components exclude direct food contact because PA-736 is not specified as a food-contact grade under EC 10/2011 or FDA 21 CFR 177.1020. Finished appliance parts include hand blender body shells, vacuum cleaner upper shrouds, food processor top covers, and appliance base plates.
PA-736 is selected for ultrasound cart side covers and diagnostic monitor rear shells only when no skin contact exceeds 30 s and the part functions as an enclosure rather than a body-contact device; the resin is not a dedicated ISO 10993 biocompatible grade. Cleaning protocols in diagnostic facilities frequently use quaternary ammonium compounds diluted to 0.5–2% in water. These cationic surfactants can initiate environmental stress cracking in PA-736 if wiped repeatedly over stressed bosses, snap hooks, or hot-staked inserts. To reduce such failure, molded diagnostic cart panels are annealed at 70–80°C for 2–3 h after ejection, then allowed to normalize at 23°C±2°C for 24 h before chemical wipe testing. Annealing shifts dimensional stability and must be completed before conformity checks on critical hole-to-hole distances. Hydrogen peroxide vapor at low concentrations is less aggressive but is not accepted as a universal substitute without lot-specific ESC validation. Mechanical performance of the finished housing is evaluated under device-level enclosure requirements of IEC 60601-1, including impact, drop, and accessibility tests on the thinnest configured wall. The base resin lot acceptance includes melt flow rate per ISO 1133-1 at 220°C/10.0 kg and notched Izod impact per ISO 180/A on dry specimens, with control limits defined by the molder rather than by generic ABS datasheets. Published data for this specific PA-736 configuration in repeated quaternary ammonium disinfection is limited; end-use screening should include a bent-specimen ESC test at 0.5–1.0% strain in the actual cleaning solution. Terminal devices include ultrasound cart side covers, diagnostic monitor rear shells, cart cable management panels, and non-patient-contact molded brackets.
Because EN 71-3 compliance is evaluated on the final colored part, the choice of masterbatch is inseparable from PA-736 lot acceptance for toy applications. For PA-736 snap-fit toy frames, the natural pellet must be free of heavy metals above trace background, but the final colored part determines migration limits. Color masterbatch loading is typically 1–3 wt%; if recycled or effect pigments are used, migration testing per EN 71-3:2019+A1:2021 is required on crushed final parts, not on natural resin plaques. The mold fill strategy uses wall thickness of 1.8–3.0 mm, with gate thickness at 60–70% of nominal wall and minimum corner radius of 1.2 mm in load-bearing snap arms. Notched Izod impact per ISO 180/A is measured at 23°C and -20°C on dry specimens. If cold-temperature impact falls below the toy end-use requirement, a higher rubber-content ABS or PA-736 lot with documented impact retention must be substituted; PA-736 should not be assumed to maintain room-temperature Izod values at freezer conditions. Injection speed is profiled at 140–220 mm/s, and hold pressure is kept at 40–60 MPa to avoid sink marks on visible flat surfaces of doll furniture and building block base plates. Phthalate restrictions under REACH Annex XVII entries 51 and 52 apply to plasticized parts or overmolded soft components, not to rigid PA-736 itself, but Tier-1 toy suppliers nevertheless require full formulation disclosure from color concentrate suppliers. Terminal toy parts include interlocking brick base plates, doll furniture structural frames, ride-on vehicle wheel covers, and push-toy body housings.
Office equipment covers, printer side panels, and scanner lids are molded in multicavity hot-runner tools with shot volumes of 250–600 g; adding 20–30 wt% post-industrial regrind demands that the melt flow rate per ISO 1133-1 at 220°C/10.0 kg be checked on the dried blend after pellet mixing. Deviation from the virgin lot melt flow rate should be limited to ±15% to avoid short shots in thin bosses and warpage at long unsupported spans. Regrind is dried at 80°C for 4 h, with moisture below 0.05 wt% before feeding into the hopper blender. Tensile modulus per ISO 527-2/1A and notched Izod impact per ISO 180/A are re-characterized on the blend because repeated heat history shifts rubber-phase morphology and reduces notched impact. Shrinkage data per ISO 294-4 should be obtained on the recycled blend before cutting new cavity dimensions; otherwise the printer cover bosses may shift by more than the assembly tolerance of ±0.15 mm. Color shift is measured per ISO 11664-4 in CIELAB coordinates, with a maximum ΔE of 1.0–2.0 depending on the OEM decorative specification. Flammability classification under UL 94 HB at 3.0 mm is re-confirmed if regrind exceeds 30 wt%; PA-736 is not flame-retardant, and higher regrind ratios plus dusty particle contamination can alter horizontal burning behavior. Marking is placed in a hidden face per ISO 11469 as >ABS< with recycling content, and no PVC purge material is run through the same barrel because residual HCl dehydrochlorination degrades ABS molecular weight. Terminal office equipment covers include multifunction printer exterior panels, scanner lids, document feeder trays, and monitor rear housings.
| Application segment | Standard or regulation | Test/property | Acceptance criterion |
|---|---|---|---|
| Electronics enclosures | RoHS Recast 2011/65/EU Annex II | XRF homogenized plaque screening | Pb < 1000 mg/kg; Cd < 100 mg/kg; Hg < 1000 mg/kg; Cr VI < 1000 mg/kg |
| Automotive interior trim | FMVSS 302 | Horizontal burning rate on molded, grained, painted part sections | OEM part-level max burn rate; validate on PA-736 configuration |
| Appliance housings | IEC 60695-2-11 | Glow wire end-product test | Per IEC 60335-1 clause 30.2; no ignition or extinguishing within specified time |
| Toys | EN 71-3:2019+A1:2021 | 19-element migration on crushed final part | Category limits in standard; verify colored and overmolded parts |
| Diagnostic enclosures | IEC 60601-1 | Enclosure mechanical strength and accessibility on finished device | Device-level pass; no hazardous access |
| Office equipment | ISO 11469 | Polymer identification marking | >ABS< plus recycling content as applicable |
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CHIMEI Polylac ABS PA-736 is an unfilled, natural-color acrylonitrile-butadiene-styrene injection-molding resin positioned for general-purpose applications in which surface gloss, medium melt viscosity, and reproducible thin-wall fill are weighted more heavily than elevated heat resistance or flame retardance. The grade is manufactured by Chi Mei Corporation as a rigid pellet and is commonly specified for consumer-electronics housings, telephone handsets, small-appliance covers, toys, and business-machine enclosures. In the manufacturer’s technical literature, PA-736 is listed among general-purpose styrenics rather than specialty plating, extrusion, or flame-retardant grades. Its principal differentiation within the Polylac series is the combination of controlled polybutadiene modification and a melt-flow index suited to class-A molded surfaces without the longer cycle times associated with high-impact extrusion ABS grades.
| Property | Test method | Value |
|---|---|---|
| Density, 23 °C | ASTM D792 | 1.04 g/cm³ |
| Melt flow index, 200 °C/5.0 kg | ASTM D1238 | 4.0 g/10 min |
| Tensile stress at yield, 50 mm/min | ASTM D638 | 43 MPa |
| Tensile elongation at break | ASTM D638 | 15% |
| Flexural modulus | ASTM D790 | 2100 MPa |
| Flexural strength | ASTM D790 | 67 MPa |
| Notched Izod impact, 23 °C, 3.2 mm | ASTM D256 | 20 kJ/m² |
| Heat deflection temperature, 1.82 MPa | ASTM D648 | 88 °C |
| Vicat softening temperature, 50 °C/h, 10 N | ASTM D1525 | 103 °C |
| Rockwell hardness, R scale | ASTM D785 | 110 |
| Flammability rating, 1.5 mm | UL 94 | HB |
The single-point values in the table are generated on standard test specimens under laboratory conditions. They are not design minima. For notch-sensitive structural parts, the Izod value at 23 °C should be derated when the geometry includes sharp corners, knit lines, or molded-in inserts. Published data for PA-736 in sub-zero impact applications and for fatigue-loaded structural components is limited; converted data from general-purpose ABS test programs should not be substituted without part-level validation on the production tool.
Moisture control is the first process boundary for PA-736. At equilibrium with 23 °C/50% RH air, unfilled ABS can absorb roughly 0.2–0.4% moisture by weight. For PA-736, the melt-processing moisture target is below 0.05%. Pellets exposed to ambient air above 60% RH for more than 8 h should be pre-dried in a desiccant dryer at 80 °C for 2–4 h; the drying-air dew point should be no higher than -30 °C. Drying temperatures above 90 °C are not recommended because prolonged residence in a heated hopper can cause yellowing of the styrene-acrylonitrile matrix.
The cylinder temperature profile for PA-736 is usually set from 180–200 °C in the rear zone to 200–220 °C in the center zone, 220–240 °C in the front zone, and 230–250 °C at the nozzle. Melt temperature measured by an air-shot pyrometer should remain between 210 °C and 250 °C. At melt temperatures above 260 °C, thermal decomposition of the butadiene phase accelerates, producing discoloration and a measurable drop in impact strength. Mold temperature is normally held between 40 °C and 70 °C; for high-gloss show surfaces, the upper half of this range is preferred. Back pressure of 0.4–0.7 MPa and screw rotation speeds of 40–80 min⁻¹ are adequate for homogenization without excessive frictional heating.
On production-scale hydraulic injection machines, PA-736 performs predictably when the screw has an L/D ratio of 20:1 to 24:1 and a compression ratio of 2.0:1 to 2.8:1. Jetting and gate blush are more likely when the gate diameter is below 30% of the nominal wall or when melt temperature falls below 210 °C. In multi-cavity hot-runner tools, the transfer from injection velocity to packing pressure should occur before the cavity is volumetrically full, typically at 95–98% of fill. This reduces overpacking at the gate and prevents sink marks opposite thick bosses.
Within the Polylac range, PA-736 is not a direct substitute for plating grades such as PA-727. Plating-grade ABS is formulated with a polybutadiene domain distribution and gel content that survive chromic-acid etching and produce adhesion sites for electroless copper/nickel deposition. PA-736’s general-purpose morphology is not optimized for that surface treatment, and electroplating specifications should not be written around PA-736 without adhesion trials based on ISO 2177 or ASTM B533 measurement of coating thickness and peel-strength verification. Conversely, PA-736 offers broader colorability and simpler regrind handling than conventional plating grades because there is no requirement to preserve an etch-sensitive rubber-particle surface through multiple heat histories.
Flame-retardant ABS grades in the portfolio, such as PA-765, incorporate brominated flame-retardant systems and often antimony synergists to achieve UL 94 V-0 at 1.5 mm or 2.0 mm. PA-736 is rated HB at 1.5 mm. It should not be specified for electrical enclosures, power-supply housings, or battery-containing devices where the product safety standard requires a minimum V-2 or V-0 classification. If the application falls under IEC 62368-1 or IEC 60335-1, the flammability requirement and glow-wire test severity are imposed by end-product testing, not by the resin data sheet alone.
Against high-impact injection and extrusion grades such as PA-747, PA-736 has a higher melt-flow index and a lower notched Izod impact at 23 °C. This makes PA-736 easier to fill in thin-wall tools but gives it less resistance to crack propagation in thick sections and at low temperature. A part designed for PA-747 should not be converted to PA-736 solely on flow grounds; bosses, snap-fits, and weld lines should be analyzed because the impact difference can shift fracture from ductile tearing to brittle failure at similar geometry. Relative to PC/ABS blends, PA-736 has lower heat resistance and lower multiaxial impact but easier flow and lower density. Compared with ASA, PA-736 has lower ultraviolet weathering resistance and is not normally specified for unpainted outdoor enclosures without UV stabilization.
In enclosures subject to IEC 62368-1, PA-736 is used for accessible surfaces where the material must meet the end-product provisions for resistance to fire, mechanical strength, and dimensional stability after shipping and aging. The heat deflection temperature of 88 °C at 1.82 MPa means that continuous-use temperature should not exceed approximately 80 °C in service. Parts adjacent to power semiconductors, transformers, or heating elements are better suited to heat-resistant ABS, PC/ABS, or filled PBT grades. The molded enclosure should also be evaluated for creep after insertion of threaded fasteners, because localized strain near bosses can relax over time and reduce clamping force.
Mold shrinkage for unfilled PA-736 is generally reported in the 0.4–0.6% range parallel to flow. Tooling should be cut on the basis of measured shrinkage from a trial mold rather than a single literature value. Rib thickness should not exceed 60% of adjacent wall stock, and gate land lengths below 0.5 mm are avoided because they amplify gate blush. For a housing with a projected area of 250 cm² and an assumed cavity pressure of 40 MPa, the theoretical clamp requirement is approximately 1,000 kN, or 100 tonnes. Machines in the 800–1500 kN clamp range are commonly used for single-cavity sheaths; multi-cavity tools may require 2500 kN or more depending on runner volume and gate drop.
Regrind usage with PA-736 is technically feasible when the regrind is clean, dried, and generated from the same grade. In non-appearance internal parts, regrind levels up to 20 wt% are common. In high-gloss external housings, regrind content above 10 wt% may reduce surface gloss, increase yellowing tendency, or introduce trace contamination that disrupts paint adhesion and plating. PA-736 regrind should not be mixed with flame-retardant ABS, polycarbonate, PVC, or electroplating-grade ABS; incompatibility can cause delamination, gas marking, or plate-out on the mold surface.
Like most unfilled ABS grades, PA-736 is sensitive to environmental stress cracking when a molded-in stress field is exposed to certain chemicals. Aromatic hydrocarbons, ketones, esters, and chlorinated solvents are aggressive. Compatibility should be screened using ISO 175 immersion tests or ISO 4607 environmental stress-cracking methods before PA-736 is specified for painted, solvent-welded, or adhesive-bonded assemblies. Isopropyl alcohol is commonly used as a wipe solvent in electronics assembly but should be removed immediately; retained solvent in molded-in bosses or blind holes can cause cracking after several hours. For supplier compliance documentation, PA-736 is normally available with statements covering EU RoHS Directive 2011/65/EU and REACH Regulation EC 1907/2006 SVHC content as updated by the European Chemicals Agency. These statements apply to the uncolored resin as sold; added color masterbatches or processing aids may introduce substances that require separate assessment.