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CHIMEI (Chi Mei) ABS D-1500

    • Product Name: CHIMEI (Chi Mei) ABS D-1500
    • Factroy Site: Yinchuan, Ningxia, China
    • Price Inquiry: sales8@ascent-chem.com
    • Manufacturer: Ascent Petrochem Holdings Co., Limited
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    VTB
    Specifications
    HS Code 485443
    Density 1.04 g/cm³
    Melt Flow Rate 2.0 g/10 min (220°C/10 kg)
    Molding Shrinkage 0.4–0.6%
    Water Absorption 24h 0.30%
    Tensile Strength Yield 44 MPa
    Tensile Elongation Break 30%
    Flexural Strength 70 MPa
    Flexural Modulus 2100 MPa
    Notched Izod Impact Strength 20 kJ/m²
    Rockwell Hardness 105 R
    Heat Deflection Temperature 0 45mpa 95°C
    Heat Deflection Temperature 1 82mpa 85°C
    Vicat Softening Temperature 100°C
    Volume Resistivity >1.0E+15 Ω·cm
    Dielectric Constant 1mhz 3.0
    Flammability Rating UL94 HB
    Drying Temperature 80–90°C
    Drying Time 2–4 h
    Processing Temperature 210–240°C
    Mold Temperature 50–80°C

    As an accredited CHIMEI (Chi Mei) ABS D-1500 factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.

    Packing & Storage
    Packing CHIMEI ABS D-1500 is supplied in 25 kg moisture-proof paper-plastic compound bags, palletized for industrial handling.
    Container Loading (20′ FCL) CHIMEI ABS D-1500 is loaded into a 20-foot FCL container with secure palletization, dry protection, and standard export packing for shipment.
    Shipping CHIMEI (Chi Mei) ABS D-1500 is acrylonitrile-butadiene-styrene copolymer resin supplied as solid pellets. It is non-hazardous and not regulated for transport; no UN number, hazard class, or packing group applies. Ship in sealed 25 kg bags or 1,000 kg jumbo bags, keep dry, and avoid heat and moisture.
    Storage Store CHIMEI (Chi Mei) ABS D-1500 resin in a cool, dry, well-ventilated area away from direct sunlight, heat, flames, and oxidizing materials. Keep original bags or containers tightly closed on pallets off the floor to prevent moisture pickup and contamination. Avoid prolonged high temperatures, control dust/static, inspect containers regularly, and follow local regulations and SDS guidance.
    Shelf Life Shelf life is typically 12 months when stored in a cool, dry, well-ventilated area, away from direct sunlight and moisture.
    Application of CHIMEI (Chi Mei) ABS D-1500

    Across passenger vehicle lower interior trim and glovebox assembly operations, CHIMEI ABS D-1500 is processed on high-cavitation injection molding lines where melt homogeneity, low internal stress, and consistent grain replication determine part acceptance. The grade is dried in a desiccant hopper at 80 °C for 3 h to 4 h; residual moisture above 0.03% produces surface splay at gate shear rates above 20,000 s⁻¹. A barrel profile of 215 °C/225 °C/230 °C/230 °C/225 °C and mold-face temperature of 50 °C to 60 °C are used for grained lower trim, and a flow length-to-wall thickness ratio up to 150:1 is achievable at injection pressures of 80 MPa to 100 MPa. Gates are kept at 1.0 mm to 1.5 mm in cold runner systems because sub-0.8 mm gates cause localized shear heating and impact loss. Holding pressure is profiled at 55 MPa for 4 s, 40 MPa for 6 s, and 20 MPa for 3 s to suppress sink marks at bosses, ribs, and snap features. Shrinkage after 24 h conditioning at 23 °C and 50% RH per ISO 291 is controlled below 0.5%; shifts above this value create assembly-stress concentrations at snap-fit insertion points. Grain replication is verified by surface roughness retention measured against the tool engraving, with Ra deviation held below 5 µm. Low-emission behavior is screened by VDA 278; total VOC acceptance for lower trim commonly falls between 100 µg/g and 300 µg/g, but OEM specifications may demand below 50 µg/g and require lot-specific verification. A 1,200 t toggle-clamp press with 80 mm to 100 mm screw diameter and 22:1 to 25:1 L/D ratio is typical for multi-cavity glovebox tools, with shot size maintained at 40% to 70% of barrel capacity. Ejection is permitted at 70 °C to 80 °C surface temperature; premature ejection produces visible rib read-through. Warpage is controlled by keeping cavity-half coolant temperature differential below 0.5 °C; a differential above 1.0 °C causes perimeter gaps exceeding 0.6 mm on glovebox assemblies. Mechanical response is measured by ISO 527-2, ISO 178, and ISO 180, with low-temperature impact monitored against approved lot limits because pigment masterbatches can reduce impact values by up to 15%.

    What Limits the Injection Molding Cycle for High-Gloss Appliance Housings?

    For high-gloss appliance housings, the production constraint is not peak melt temperature but the coupling between mold surface temperature and polymer relaxation. Tooling polished to SPI-A2 or finer is required, and gloss is quantified with a 60° geometry per ISO 2813:2014; a 2 mm plaque can reach 90 GU or higher when mold temperature is raised to 70 °C, but fixed-temperature tooling then extends cooling time to 45 s to 60 s, which is 1.4 to 1.8 times longer than at 40 °C. Rapid heat-cycle molding systems cycle cavity steel between 60 °C and 95 °C to separate gloss from cycle time; temperature control units must maintain ±1 °C accuracy across the impression. Melt temperature measured by air shot is maintained below 245 °C, as higher values cause yellowing and reduce whiteness index below 85 per ASTM E313. Holding pressure is profiled at 55 MPa for 3 s, 40 MPa for 6 s, and 20 MPa for 4 s; sink depth at boss-to-wall intersections is kept below 0.02 mm on visible surfaces. At ventilation grille slots, weld lines are formed where melt fronts rejoin; when the melt front temperature is above 210 °C, weld tensile strength retains approximately 60% of the virgin value per ISO 527-2:2012, but below 210 °C the retained strength falls below 40%. Color stability is audited by ISO 11664-4:2008 with ΔE*ab below 0.8 over a 100-shot run; deviations generally track residence time beyond 5 min or inconsistent regrind use. Appliance safety is governed by IEC 60335-1; unfilled ABS D-1500 typically rates UL 94 HB, so live parts are not directly supported without a flame-retardant variant. Metal hinge inserts are installed by heat staking at 180 °C to 200 °C, with boss outer diameter to screw major diameter ratio of 2.0 to 2.5 to limit hoop stress cracking across 500 h thermal cycling from 5 °C to 70 °C.

    In telecommunication and data-acquisition enclosure molding, unfilled ABS D-1500 is selected only when the end-product standard permits UL 94 HB and when continuous service temperature remains below 65 °C. Snap-fit closure geometries are designed to keep flexural strain at insertion below 2.0%, measured by ISO 178, because higher strain induces stress whitening and long-term latch relaxation. PCB standoffs without molded-in inserts are tapped with thread-forming screws only when the pilot hole diameter is 55% to 65% of screw nominal diameter; this keeps radial hoop stress below the environmental stress-cracking threshold. Standoff height is restricted to 8 mm to 15 mm with a root radius of at least 0.5 mm; sharp notches reduce vibration fatigue life below 10,000 cycles. Because published random-vibration fatigue data specific to D-1500 are limited, validation follows IEC 60068-2-6 and IEC 60068-2-64 with prototype-level lot testing. The material is marked according to ISO 11469 as >ABS< when part mass exceeds 100 g. Chemical cleaning on the production line uses 70% isopropanol/water; ketone or ester-based cleaning agents are excluded because they cause solvent crazing within 5 min of contact. Amine-based antistatic masterbatches are also avoided because they produce plate-out and surface blush on ABS D-1500. The comparative tracking index of natural ABS D-1500 is usually above 400 V per IEC 60112, but pigmented and lubricated lots must be re-qualified. Glow-wire testing at 650 °C per IEC 60695-2-11 is limited to non-current-carrying parts; if the end-product requires 750 °C glow-wire pass without flame, a flame-retardant grade is required.

    PropertyTest methodTypical requirement for ABS D-1500 enclosure
    FlammabilityIEC 60695-11-10UL 94 HB
    Comparative tracking indexIEC 60112>400 V on unpigmented lot
    Glow-wire resistanceIEC 60695-2-11650 °C no flame for SELV housing
    Snap-fit flexural strainISO 178<2.0%
    Material markingISO 11469>ABS< for parts >100 g

    Sanitary Pipe Fittings: Solvent Cement Joint Integrity and Dimensional Stability

    Within solvent-cemented sanitary drainage systems, ABS D-1500 is injected into fittings such as couplings, tees, elbows, and P-traps that must satisfy ASTM D2661-21 and CSA B181.1 dimensions. Socket wall thickness at the base is not less than 1.5 times the minimum corresponding pipe wall, and socket taper is 1° to 2° to balance assembly force against solvent cement retention. The resin is pre-dried at 80 °C for 3 h to 4 h; leaving moisture above 0.04% creates steam voids at the gate where melt temperature peaks at 240 °C. Barrel set points are maintained from 205 °C to 230 °C, mold temperature at 35 °C to 55 °C, and packing pressure at 50 MPa to 65 MPa for 8 s to 12 s on a 350 t to 500 t injection molding machine. Fill time below 1.8 s is necessary when the gate is located at the socket base; slower filling allows the melt front to cool and produces a weak weld line at the fitting shoulder. Solvent-cemented assemblies are burst-tested at 23 °C per ASTM D1598; the fitting assembly must withstand not less than 2.5 times the pipe pressure rating. Environmental stress cracking resistance is evaluated in a soap solution at 60 °C under constant strain per ISO 22088-3; surface crazing tends to propagate along the gate-to-socket weld when end-of-fill melt temperature is below 215 °C. Post-mold annealing at 85 °C for 4 h is used to stabilize socket dimensions, with linear shrinkage below 0.8%; higher shrinkage causes field-assembly interference or cement-starved joints. On-site solvent cement should contain MEK and cyclohexanone with viscosity between 800 cP and 2000 cP at 25 °C; lower viscosity causes excessive run-off, and higher viscosity limits solvent diffusion into the ABS surface.

    Before thermoforming luggage shells, ABS D-1500 sheet is extruded on a single-screw barrier line with 30:1 to 36:1 L/D ratio and barrel zones of 200 °C, 210 °C, 220 °C, 225 °C, and 220 °C; breaker-plate pressure is held below 35 MPa. The melt passes through a three-roll polish stack at 85 °C to 95 °C, and sheet thickness is controlled to ±0.05 mm by roll gap adjustment. Extruded sheet is conditioned at 23 °C for 24 h before forming; residual moisture above 0.04% generates microvoids that reduce corner impact strength. Thermoforming is conducted at sheet surface temperatures between 150 °C and 170 °C, and sag over a 500 mm span is held below 12 mm by outer oven zone adjustment. At draw ratios above 2.0:1, aluminum plug assists at 110 °C are required; without the plug, corner thinning exceeds 35%, and the shell fails drop testing. Starting sheet of 2.0 mm yields final wall thickness of 1.2 mm to 1.8 mm in the shell body and 0.8 mm to 1.0 mm at corner pinch-off zones. Dry heat distortion is measured at 90 °C for 2 h per ISO 75-2; ABS D-1500 shows localized deformation under a 1.8 MPa flexural load if forming residual stress is not annealed. Drop-weight impact at -20 °C is measured by ASTM D3763; crack initiation energy is reduced by 25% to 35% when the sheet contains 0.04% or more moisture. After forming, a two-component polyurethane coating is applied, and adhesion is rated 0 to 1 per ISO 2409; the ABS substrate does not require flame treatment before coating if surface tension is above 38 mN/m.

    When D-1500 Replaces Die-Cast Zinc in Cosmetic Handles and Knobs

    When D-1500 is substituted for die-cast zinc in cosmetic handles, electroplating performance becomes the controlling design variable. The ABS surface is prepared by chromic acid etching at 60 °C to 68 °C for 5 min to 10 min, selectively oxidizing butadiene domains and producing microcavities for electroless nickel anchorage. After neutralization and Pd/Sn activation, the part enters an electroless nickel bath; surface resistivity before electrolytic deposition is 0.1 Ω/sq to 0.5 Ω/sq. The electrolytic stack is Cu 25 µm, Ni 10 µm, and Cr 0.3 µm, as specified for decorative hardware in ISO 4525. Adhesion is validated by thermal cycling per ISO 4525 Annex A, with no blistering after 3 cycles from -40 °C to 75 °C. Molding parameters are altered for plateability: melt temperature 235 °C to 245 °C, mold temperature 60 °C to 70 °C, and holding pressure below 45 MPa reduce residual stress that can cause etching non-uniformity. Gate freeze time is extended to 8 s to 12 s to eliminate sink marks that disrupt plating thickness. The tensile modulus of D-1500 is approximately 2.0 GPa to 2.4 GPa, compared with 90 GPa for die-cast zinc; therefore, load-bearing threads use brass inserts installed by ultrasonic insertion. Corrosion resistance after plating is tested by CASS exposure for 48 h per ISO 9227, with a rating of 9 or higher per ISO 10289. Pretreatment solution temperature above 70 °C must be avoided because surface etching can collapse and reduce adhesion. Regrind from plated parts is not reintroduced unless copper is fully stripped; residual copper accelerates thermal degradation during subsequent molding.

    LayerMinimum thicknessFunction
    Copper25 µmLeveling and ductility
    Nickel10 µmCorrosion resistance
    Chromium0.3 µmTarnish and scratch resistance
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    Certification & Compliance
    More Introduction

    CHIMEI (Chi Mei) ABS D-1500 is a pelletized acrylonitrile-butadiene-styrene terpolymer used for injection-molded rigid parts that require controlled melt filling, moderate impact resistance, and post-mold surface finishing for electroplating or vacuum metallization. The grade is produced by Chi Mei Corporation and is supplied in natural, black, and custom color-matched lots; natural resin is specified when electroplating is intended because colorants can alter etch pit uniformity. The chemical composition combines a continuous styrene-acrylonitrile matrix with dispersed polybutadiene particles. Acrylonitrile contributes polar nitrile groups that raise surface energy after oxidative etch and improve adhesive bonding; butadiene provides impact absorption through rubber-phase cavitation; styrene contributes rigidity and gloss. Supplier-published typical values for D-1500 are shown in Table 1 under ISO and ASTM test conditions. These values are single-point reference data, not design allowables.

    Table 1. Typical physical, rheological, thermal, and mechanical data for CHIMEI ABS D-1500
    PropertyTest conditionTypical valueStandard designation
    Density23 °C1.05 g/cm³ISO 1183-1:2019
    Melt mass-flow rate220 °C / 10 kg18 g/10 minISO 1133-1:2022
    Tensile stress at yield23 °C, 50 mm/min44 MPaISO 527-2/1A/50
    Tensile elongation at break23 °C, 50 mm/min15 %ISO 527-2/1A/50
    Flexural stress at 3.5 % strain23 °C, 2 mm/min69 MPaISO 178
    Flexural modulus23 °C, 2 mm/min2300 MPaISO 178
    Charpy notched impact strength23 °C18 kJ/m²ISO 179/1eA
    IZOD notched impact strength23 °C24 kJ/m²ISO 180/1A
    Vicat softening temperature50 °C/h, 10 N105 °CISO 306/B50
    Deflection temperature under load1.80 MPa88 °CISO 75-2:2013 Method A
    Rockwell hardnessR scale110ASTM D785-08
    Mold shrinkageparallel and normal flow0.4–0.7 %ISO 294-4
    Flammability rating1.5 mm thicknessHBUL 94

    On production-scale dryers, D-1500 requires closed-loop desiccant drying before injection molding because humid storage above 60 % RH raises residual moisture above the processing limit. Pellets are dried at 80–90 °C for 3–4 h with a dew point below -40 °C to achieve a moisture target below 0.02 wt%. Hot-air hopper dryers are unsuitable because equilibrium moisture regain can exceed 0.05 wt% within 30 min of discharge into a humid plant environment. Melt moisture at that level produces splay, gate blush, and worm-track streaks on electroplated surfaces because hydrolytic degradation of the SAN matrix creates microvoids that are enlarged during chromic acid etching and become visible after copper or nickel deposition.

    What Limits the Butadiene Etch-Window During Chromic Acid Pretreatment?

    For electroplating adhesion, D-1500 relies on selective oxidation of surface polybutadiene domains in a chromic acid–sulfuric acid etch solution. ASTM B727 practice describes etching of ABS at 65–70 °C for 5–15 min followed by neutralization, catalyst activation, and electroless metal deposition. The etch creates submicroscopic anchor pits whose depth and spacing depend on rubber particle size distribution, graft SAN coverage, crosslink density, and molded-in stress. D-1500 is specified for electroplated trim when moldings are produced at mold temperatures between 40 °C and 60 °C; lower mold temperatures increase residual stress and may create elongated etch pits along flow lines, which appear as haze after copper build. Production etch lines running 400–450 g/L CrO₃ and 200–220 g/L H₂SO₄ at 68 °C typically process D-1500 within 8–12 min, but the exact window is part-dependent because rib, boss, and knit-line regions etch faster than planar surfaces. Process audits on 130 tonne injection presses molding grille frames have shown that gate blush and high shear zones must be minimized through gate position and melt temperature control; otherwise electroless nickel adhesion at gate areas can be inconsistent. Published data for this specific configuration is limited to supplier technical bulletins and should be verified by plate adhesion peel testing in a production electrolyte before tooling release.

    Because D-1500 is not a self-adhesive thermoplastic, mechanical interlock from etched rubber pits is the primary adhesion mechanism. The grade’s stabilizer and lubricant package must remain free of external mold release contamination. Silicone or amine-based mold releases are incompatible with electroless nickel activation; silicone residues mask pit formation and amine residues poison palladium-tin catalyst adsorption. If ejection difficulty requires release assistance, a non-silicone, non-amine mold release should be selected, and parts should be alkaline-cleaned in a 60–65 °C bath for 5–10 min immediately after demolding. Batch release certificates for electroplating runs typically include melt mass-flow rate by ISO 1133-1:2022, IZOD notched impact by ISO 180/1A, tensile stress at yield by ISO 527-2/1A/50, and CIE Lab color coordinates to detect lot-to-lot drift in thermal history.

    Injection-Melt Thermal History and Gate Freeze Constraints

    Across the barrel profile from feed to nozzle, D-1500 is usually processed with set temperatures of 190 °C, 200 °C, 210 °C, 220 °C and nozzle temperature 210–220 °C. Melt temperature measured by an insertion pyrometer should remain between 190 °C and 230 °C; exposure above 250 °C must be avoided because the polybutadiene phase undergoes thermal oxidation, producing yellowing and a drop in notched impact strength. For hot-runner tools, manifold and drop temperatures should not exceed 230 °C, and residence time should be limited to <5 min at that temperature. A standard injection molding machine with a 25 mm diameter screw and 21:1 L/D, using back pressure 0.5–1.5 MPa and screw rotation 70–120 rpm, provides homogeneous melt with moderate shear heating. Hold pressure is set to maintain a screw cushion of 3–6 mm; inadequate cushion causes shot-to-shot variation in melt density and increases sink-mark risk. For a 1.5 mm diameter pin gate, gate freeze time is approximately 2–4 s, and hold-pressure time should be maintained beyond gate freeze to compensate for shrinkage of 0.4–0.7 % measured by ISO 294-4.

    Thin-wall sections below 1.0 mm require a higher melt temperature near 230 °C but with reduced residence time. In multi-cavity tools with unbalanced runner systems, the viscosity of D-1500 at low shear rate can produce cavity-to-cavity fill variation above 5 % if runner sizing is not adjusted from general-purpose ABS grades. Mold-flow simulation inputs should account for the low-pressure shear-thinning character of D-1500 rather than using generic ABS viscosity curves.

    When Compared with General-Purpose and High-Impact ABS Grades

    Compared with general-purpose and high-impact ABS grades, D-1500 exhibits a deliberately narrower melt and rubber-phase balance for plated rigid parts. Table 2 gives a directional comparison with two reference Chi Mei ABS grades using supplier-published typical values; actual values shift with color concentrate loading, regrind content, and part test conditions by more than 5 %. D-1500 provides lower notched impact than high-rubber plating grades, but its stiffer SAN matrix reduces cold-flow deformation under plating jig pressure and improves dimensional stability during thermal cycling between -20 °C and 80 °C. In contrast, high-impact ABS grades with IZOD exceeding 30 kJ/m² are preferred for sheet thermoforming and for parts requiring high-speed puncture resistance below -20 °C. General-purpose high-gloss ABS grades may offer lower melt viscosity for thin-wall electronics housings, but they may not maintain consistent etch pit density after plating because their stabilizer and lubricant packages are not formulated for palladium-tin catalyst adsorption during electroless metal deposition.

    Table 2. Directional property comparison for CHIMEI ABS D-1500 and reference grades
    GradeMelt mass-flow rate, 220 °C/10 kgIZOD notched impact, 23 °CFlexural modulusVicat softening temperature
    D-150018 g/10 min24 kJ/m²2300 MPa105 °C
    PA-757 general-purpose ABS14 g/10 min29 kJ/m²2200 MPa104 °C
    PA-765 electroplating ABS12 g/10 min30 kJ/m²2200 MPa102 °C

    From a regulatory standpoint, D-1500 is documented as compliant with Directive 2011/65/EU Annex II as amended by (EU) 2015/863 for restricted substances and with Regulation (EC) No 1907/2006 for SVHC declaration in articles. The flammability rating is HB at 1.5 mm thickness under UL 94, meaning the grade is not a candidate for enclosures requiring V-2 or better. D-1500 should not be specified for continuous immersion in strong oxidizing acids, ketones, esters, or chlorinated solvents because SAN-phase stress cracking can occur under molded-in stress. It is also not recommended for unpainted outdoor weatherability because unmodified ABS undergoes significant gloss loss and impact reduction after 500–1000 h of xenon-arc exposure under ISO 4892-2; painted, plated, or UV-capped systems are required for exterior components. These operational boundaries define the selection envelope for D-1500 in automotive interior trim, appliance bezels, sanitary fittings, and consumer-hardware applications where electroplating adhesion and dimensional stability under plate jig loading are primary requirements.

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