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Celanese GUR UHMWPE 1050E

    • Product Name: Celanese GUR UHMWPE 1050E
    • Factroy Site: Yudu County, Ganzhou, Jiangxi, China
    • Price Inquiry: sales8@sinochem-nanjing.com
    • Manufacturer: Ascent Petrochem Holdings Co., Limited
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    Specifications
    HS Code 108054
    Molecular Weight 5.0 x 10^6 g/mol
    Density 0.93 g/cm3
    Bulk Density 0.45 g/cm3
    Average Particle Size 120-150 µm
    Melting Temperature 130-135 °C
    Crystallinity 45-50%
    Tensile Modulus 680-700 MPa
    Tensile Strength At Yield 17 MPa
    Elongation At Break >300%
    Charpy Notched Impact Strength No break
    Shore D Hardness 60-65
    Water Absorption <0.01%
    Coefficient Of Friction 0.10-0.20
    Thermal Conductivity 0.42 W/m·K
    Thermal Expansion Coefficient 1.5 x 10^-4 /°C
    Dielectric Strength 900 kV/cm
    Volume Resistivity >10^15 Ω·cm
    Chemical Resistance Excellent
    Abrasion Resistance Very high

    As an accredited Celanese GUR UHMWPE 1050E factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.

    Packing & Storage
    Packing Celanese GUR UHMWPE 1050E is supplied in 25 kg PE-lined paper bags, 40 bags (1,000 kg) per pallet.
    Container Loading (20′ FCL) Celanese GUR UHMWPE 1050E loaded in a 20′ FCL container, palletized in dry, moisture-resistant bags at ambient temperature.
    Shipping Celanese GUR UHMWPE 1050E ships as a non-hazardous, non-regulated polymer powder: no UN number, hazard class, or packing group. Use sealed, labeled bags or containers; protect from moisture, contamination, static discharge, and prolonged heat/sunlight. Keep packaging intact and dry.
    Storage Store Celanese GUR UHMWPE 1050E in a cool, dry, well-ventilated area away from direct sunlight, heat, and ignition sources. Keep containers tightly closed in original packaging to prevent moisture and contamination. Avoid dust generation and static buildup. Protect from strong oxidizers and follow the SDS and local regulations.
    Shelf Life Celanese GUR UHMWPE 1050E has a typical shelf life of five years when stored dry, cool, and in unopened original packaging.
    Application of Celanese GUR UHMWPE 1050E

    In ram extrusion lines producing stock shapes from GUR 1050E, the absence of a measurable melt flow rate under ISO 1133-1:2022 is the defining process constraint: the resin powder is compacted and fused in a reciprocating plunger extruder rather than plastified by a rotating screw. Barrel heating zones are typically set between 190 °C and 220 °C, the die collar between 180 °C and 210 °C, and hydraulic ram pressure between 20 MPa and 40 MPa, with ram speed adjusted to the cross-section to avoid underfused particle boundaries. The formulation is 99.0–100 wt% GUR 1050E; where a longer profile or higher output demands lubricity, 0.05–0.5 wt% calcium stearate or 0.1–1.0 wt% antioxidant masterbatch is dry-blended, and feedstock is pre-dried at 80 °C for 4 h when storage RH exceeds 60%. Food-contact and industrial-grade compliance for stock shapes is anchored to FDA 21 CFR 177.1520, EU Commission Regulation No 10/2011, REACH SVHC screening, and RoHS Directive 2011/65/EU; mechanical conformance is tested under ASTM D638-14 for tensile strength, ASTM D790-17 for flexural modulus, and ISO 1183-1:2019 for density. Typical terminal forms are rods from 20 mm to 200 mm diameter, plates to 150 mm thickness, U-channels, rectangular bar, and custom profiles that are subsequently machined into chain guides, wear strips, guide rails, star wheels, scraper blades, and screw conveyor flight liners.

    On production machines, the transition from a free-flowing powder to a fused billet is sensitive to feedstock bulk density; when bulk density falls below 0.45 g/cm³, feed zone compaction can become uneven and the extruded surface exhibits periodic annular cracks. Regrind from post-industrial GUR 1050E stock is limited to 10 wt% in non-critical wear parts because repeated thermal history reduces the polymer chain length and lowers flatwise wear resistance. Silicone-based external release agents are avoided; if demolding aids are required, food-grade zinc stearate is kept below 0.05 wt% to prevent surface transfer defects on subsequent machined faces.

    What Press Pressure and Cooling Ramp Prevent Void Formation in 1050E Compression-Molded Slabs?

    Void formation in compression-molded GUR 1050E slabs is governed by charge mass, platen pressure during fusion, and the cooling rate under load. Hydraulic presses for slab formats from 500 mm × 500 mm to 1,000 mm × 2,000 mm are operated at mold cavity pressures of 3 MPa to 15 MPa, with heating platen set-points of 200 °C to 230 °C; charge mass is controlled to ±1.0 wt% because UHMWPE does not flash-flow to compensate for overcharging. The resin fraction is 100 wt% GUR 1050E, or 99.7–99.95 wt% GUR 1050E with 0.05–0.3 wt% hindered phenolic antioxidant masterbatch where oxidative service is expected; mineral fillers and glass fibers are excluded because they disrupt particle fusion and reduce Izod impact under ISO 180:2023. A typical production cycle heats the powder at 10 °C/min to 210 °C, soaks for 20–40 min depending on thickness, then cools at 5–15 °C/min under full pressure to below 60 °C before demolding; faster cooling creates centerline voids and density values below 0.925 g/cm³, while cooling without pressure allows warpage greater than 2 mm/m in plates above 40 mm thickness. Compliance for industrial components is verified through ASTM D4020-18 for UHMWPE shapes, FDA 21 CFR 177.1520 where direct food substance contact occurs, and EU 10/2011 for migration limits; surface texture and dimensional acceptance follow ISO 286-1 tolerance grades selected for machined stock. The downstream product types include pump wear rings, bearing blocks, flanged bushings, sprockets, idler wheels, feed screws, and impact pads for hoppers and silo discharge zones.

    Actual molding lines observe elevated scrap rates when the cooling water temperature to platens exceeds 20 °C because internal heat extraction is insufficient for thick sections, leading to residual crystallinity gradients. Molds without insulated side walls produce edge-to-center density differences of up to 0.005 g/cm³; therefore insulated chase blocks are specified for slabs above 80 mm.

    Porous Sintered GUR 1050E Filter Elements and Air Sparger Plates

    The pore network in sintered GUR 1050E filter plates is not developed by chemical blowing agents or by burning out organic carriers; it is the result of interstitial void retention between partially fused powder particles. The powder is charged into a mold cavity and heated under controlled compacting pressure from 0.5 MPa to 5 MPa at 160 °C to 200 °C. The formulation is 100 wt% GUR 1050E for standard grades because combustible organic binders result in carbonaceous residues and pore collapse; when mean flow pore diameters above 15 μm are needed, 10–30 vol% sieved sodium chloride is used as a leachable porogen and removed with water after sintering, although published data for the salt-leached combination with 1050E is limited. Higher compacting pressure reduces average pore size and increases flexural strength, while pressure below 0.5 MPa produces weak particle bonding and dusting. Compliance for potable water contact and food-contact porous parts references FDA 21 CFR 177.1520, EU 10/2011, and NSF/ANSI 61 for materials in contact with drinking water; extractables are evaluated according to the end-user specification for cold and hot water exposure. Terminal product types include filter plates, filter tubes, aeration discs, vacuum chuck plates, silencer discs, and fluidizing bed plates for powder conveying. Processing excursions above 220 °C cause viscoelastic flow and pore closure, while temperatures below 150 °C leave particle fusion incomplete and lower crush strength.

    When 1050E Is Consolidated for ISO 5834-2 Implant Bearing Stock

    Consolidation of 1050E for ISO 5834-2 implant bearing stock begins with cleanroom powder handling and excludes internal lubricants, plasticizers, and fillers; the resin fraction is 100 wt%, and if vitamin E stabilization is specified, alpha-tocopherol is blended at 0.05–0.3 wt% before molding, with the final concentration verified by HPLC. Compression molding for implant preforms uses platen temperatures of 180 °C to 220 °C, mold pressures of 4 MPa to 15 MPa, and controlled cooling under pressure to below 80 °C; ram-extruded bar stock is generally not used for high-stress arthroplasty bearings unless subsequently remolded or machined from fusion-defect-free sections verified by ultrasonic C-scan. The consolidated forms are tested under ASTM F648-21, ISO 5834-1:2019, and ISO 5834-2:2019; biological evaluation follows ISO 10993-1:2018, while final device validation remains the manufacturer's responsibility under ISO 14971. Sterilization and crosslinking are process-specific: gamma sterilization in air is known to oxidize UHMWPE, so inert-nitrogen or vacuum packaging is required, and radiation crosslinking for wear resistance is typically performed at 50–105 kGy under vacuum or inert gas, with the exact dose validated by the device manufacturer. Terminal product types include acetabular liners, tibial inserts, patellar components, and machined bearing preforms for total joint replacement.

    Standard designationScope relevant to 1050E implant bearing stock
    ASTM F648-21UHMWPE powder and fabricated forms for surgical implant applications
    ISO 5834-1:2019Material requirements for UHMWPE powder and consolidated forms
    ISO 5834-2:2019Requirements for molded forms, including density, ash, tensile, elongation, abrasion
    ISO 10993-1:2018Biological evaluation planning for medical devices

    Published data for this specific grade under every irradiation configuration is limited; raw resin properties do not replace implant manufacturer validation under ISO 14971 and applicable national medical device regulations.

    In dry-stretch and solvent-extraction lithium-ion separator lines, UHMWPE of the GUR 1050E molecular weight class is used as a high-melt-strength modifier in HDPE blends to stabilize the crystalline row-nucleated morphology during uniaxial and biaxial stretching. Formulation ranges published for UHMWPE/HDPE separator membranes typically place the UHMWPE fraction at 10–40 wt%, with GUR 1050E as the UHMWPE component; however, published data for this specific 1050E configuration is limited, and the exact ratio is validated on the line through gelation torque, melt pressure at the die, and solvent retention after extraction. The blend is mixed with paraffinic oil in a co-rotating twin-screw extruder at 180 °C to 220 °C, cast through a slit die, cooled on a chill roll, and then stretched at 90 °C to 120 °C; the oil is extracted with methylene chloride or n-hexane, and the membrane is heat-set between 120 °C and 140 °C to lock orientation. Terminal products are microporous monolayer separators from 5 μm to 25 μm thickness; relevant cell-level testing includes IEC 62660-2:2018 and UN Manual of Tests and Criteria Part III Section 38.3, while material purity is screened under REACH SVHC and residual solvent limits specified by the cell manufacturer. Process boundaries are narrow: at UHMWPE loadings above 40 wt%, melt-phase gelation raises extruder torque and die melt temperature unevenly, while below 10 wt% the stretched film may lack sufficient tie-chain interconnects in the amorphous regions, reducing puncture strength measured under ASTM F1306-21.

    Machining 1050E Stock Shapes for Semiconductor Wet Bench and CMP Handling

    Semiconductor wet bench and CMP handling components machined from 1050E stock shapes are specified only when ultrapure water extractables, wafer-contact friction, and dimensional stability after annealing are jointly controlled. The source stock is 100 wt% GUR 1050E; the addition of antistatic fillers or carbon black is excluded in these applications because filler extraction can elevate metal ion contamination. Components are produced by CNC machining from stress-relieved plate or rod; the production route includes rough machining, a recrystallization annealing step at 100 °C to 120 °C for dimensionally stable thin sections, and final machining to tolerances of ±0.05 mm or tighter for wafer contact features. Compliance is assessed under SEMI F57-0301 for polymer materials in ultrapure water and liquid chemical systems, with additional extractables data generated according to the equipment builder's leachate protocol; RoHS Directive 2011/65/EU screening applies to the finished component. Terminal product types include 150 mm and 300 mm wafer transport rollers, guide rails, tank liners, gear racks, valve bodies, and wet bench splash covers. Published data for ion extraction levels in GUR 1050E machined stock is limited; equipment builders typically require site-specific leachate testing under SEMI F57-0301 before qualification.

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