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Beijing Shousu PC/ABS 8075

    • Product Name: Beijing Shousu PC/ABS 8075
    • Factroy Site: Yinchuan, Ningxia, China
    • Price Inquiry: sales8@ascent-chem.com
    • Manufacturer: Ascent Petrochem Holdings Co., Limited
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    Specifications
    HS Code 446191
    Product Name Beijing Shousu PC/ABS 8075
    Manufacturer Beijing Shousu Technology Co., Ltd.
    Material Type PC/ABS alloy
    Density 1.18 g/cm³
    Melt Flow Rate 15 g/10 min
    Tensile Strength 55 MPa
    Elongation At Break 45%
    Flexural Modulus 2200 MPa
    Notched Izod Impact Strength 30 kJ/m²
    Heat Deflection Temperature 100 °C
    Vicat Softening Temperature 110 °C
    Flammability Rating HB
    Molding Shrinkage 0.4–0.6%
    Water Absorption 0.2%

    As an accredited Beijing Shousu PC/ABS 8075 factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.

    Packing & Storage
    Packing Packaging: Beijing Shousu PC/ABS 8075 in 25 kg moisture-proof bags, 40 bags per pallet (1,000 kg).
    Container Loading (20′ FCL) A 20′ FCL container loaded with Beijing Shousu PC/ABS 8075 chemical, securely packaged and prepared for safe ocean freight transport.
    Shipping Beijing Shousu PC/ABS 8075 is shipped as non-hazardous thermoplastic pellets in 25 kg moisture-proof bags or bulk containers at ambient temperature. Keep dry, away from direct sunlight, heat, and contamination; avoid punctures and maintain sealed packaging during transport.
    Storage Store Beijing Shousu PC/ABS 8075 in a cool, dry, well-ventilated area, away from direct sunlight, heat, moisture, and ignition sources. Keep in original sealed bags or containers on pallets, protected from dust, contaminants, crushing, and UV exposure. Maintain good housekeeping and follow the supplier’s SDS and local regulations.
    Shelf Life Shelf life is typically 12 months when stored in original unopened packaging, away from moisture, heat, and direct sunlight.
    Application of Beijing Shousu PC/ABS 8075

    In AC and DC electric vehicle charging equipment, Beijing Shousu PC/ABS 8075 is used for wallbox front covers, charging cable management enclosures, and internal structural brackets where the part must pass a flame-retardant rating without a secondary metal shield. The grade is typically brought to the molding cell after desiccant drying at 80 °C for 4–6 h to bring residual moisture below 0.02 % by Karl Fischer titration; at ambient relative humidity above 60 %, an additional 2 h drying dwell is assigned because flame-retardant PC/ABS absorbs surface moisture rapidly. The barrel profile is normally set between 240 °C and 270 °C, with the nozzle maintained below 270 °C to avoid flame-retardant decomposition; mold temperature is held at 60 °C–80 °C to balance weld-line strength and cycle time. Regrind is limited to 20 wt%; a higher recycled fraction shifts the melt flow ratio and may reduce the notched impact energy of the charging enclosure after thermal aging. Color masterbatch or carbon black is added at a let-down ratio of 2 wt%–4 wt%, but only after the masterbatch carrier is confirmed to be polycarbonate-compatible because an ABS carrier can reduce tensile elongation near gate areas. Compliant terminal parts are normally verified to IEC 61851-1, IEC 62368-1, UL 94 V-0 at 1.5 mm, glow wire IEC 60695-2-11, and IEC 60695-2-12/IEC 60695-2-13 for unattended charging equipment installed in residential and commercial locations.

    Two-gate and three-gate charge point covers with flow lengths above 250 mm at a nominal wall of 2.5 mm require gate velocity profiling on a cold runner system; a direct sprue gate produces jetting streaks on the cosmetic surface and should be avoided. On production-scale injection molding machines with a screw L/D ratio of 20 : 1 to 22 : 1 and a compression ratio of 2.2 : 1, shot size is maintained between 50 % and 70 % of barrel capacity to limit residence time to 5 min or less. The charging enclosure is cooled to an ejection temperature below 95 °C to minimize post-mold warpage; early ejection above that threshold leads to corner lift at the gasket groove and a loss of the intended IP54 sealing surface. If the part is mounted outdoors without a UV-stabilized capstock or paint, surface gloss retention is checked per ISO 4892-3 and ISO 4892-2; unpainted PC/ABS grades are known to develop microchalking under prolonged UV exposure, and this failure mode is assigned to the enclosure sealing perimeter rather than to the bulk polymer backbone.

    Thin-wall IT Equipment Enclosures and the Warpage Control Window

    For laptop base covers, monitor bezels, and network-attached storage enclosures, PC/ABS 8075 is processed as a neat resin without post-mold flame-retardant coating; that removes a process step but shifts the burden to part design because flame-retardant packages reduce melt elasticity and increase shear sensitivity compared with non-flame-retardant PC/ABS grades. Melt temperature is maintained in a flat profile from feed to nozzle, typically 240 °C / 245 °C / 250 °C / 255 °C / 260 °C, and the mold surface is held at 70 °C–80 °C to prevent an over-glossy surface from turning hazy at the flow front. The linear mold shrinkage of PC/ABS grades in the absence of glass fiber is commonly reported between 0.5 % and 0.7 % under ISO 294-4, but a thin-wall laptop cover with a flow-length-to-thickness ratio above 120 : 1 will exhibit anisotropic shrinkage if the packing phase is truncated before gate freeze. Pack pressure is held at 60 MPa–100 MPa for 0.5 s per mm of nominal wall, and the gate freeze time is confirmed by variation of hold time in 2 s increments until part mass stabilizes; on a 1.8 mm wall cover, this typically requires 6 s–10 s of hold time.

    The terminal products under this application segment are evaluated to IEC 62368-1 for audio/video and IT equipment fire enclosures, UL 94 V-0 at 1.5 mm from the Yellow Card, RoHS Directive 2011/65/EU, and REACH SVHC declarations. Warpage control for bezels with a length of 400 mm and width of 250 mm requires a minimum of three valve gates; simultaneous valve opening is avoided because the resulting knit line forms in the center and creates a visible splay mark on the Class A surface. A 350 t hydraulic press permits sequential valve gating with 0.3 s to 0.5 s delay between gates to produce a more uniform packing profile; flatness within 0.8 mm across the longest diagonal then becomes a typical acceptance criterion. Regrind for IT enclosures is capped at 15 wt% if the part is painted or pad-printed; internal non-visible cover shields can accept 20 wt% regrind when the melt flow rate of the recovered flake is checked per ISO 1133-1:2022 at 260 °C/5 kg after each 10 batch recycle loop.

    Table 1 presents the molding parameter set for PC/ABS 8075 when no datasheet-specific override is available.

    ParameterTypical rangeMeasurement / equipment
    Pre-drying80 °C–90 °C, 4 h–6 hDehumidifying desiccant dryer, dew point −20 °C to −40 °C
    Residual moisture< 0.02 %Karl Fischer titration
    Melt temperature240 °C–270 °CBarrel/nozzle thermocouple
    Mold temperature60 °C–80 °CWater/thermolator circuits
    Screw L/D20 : 1–22 : 1Single-screw, check ring
    Shot capacity50 %–70 %Barrel capacity
    Regrind≤ 20 wt%Granulator sieve 8 mm

    Passenger-vehicle lower instrument panel trim, glove box outer panels, and seat side shields use PC/ABS 8075 where the part must carry a UL 94 V-0 classification while retaining low-temperature ductility down to −20 °C under interior cabin stress. The raw material is dried at 90 °C for 4 h and processed at a melt temperature of 250 °C–260 °C; mold temperature is raised to 80 °C for grained surfaces so that the texture replication follows the cavity without producing a white stress haze around ejector pins. Automotive plants must control regrind to 25 wt% or less because every recycle pass raises the total volatile organic compound load and can push a moulded trim part above the OEM limit, commonly 100 µg/g total VOC measured by VDA 275 or VDA 278, and odor above VDA 270 grade 3. The part is not normally exposed to direct sunlight; if an upper surface is visible through the windshield, a UV-stabilized capstock or paint is applied because the flame-retardant package alone is not sufficient for long-term UV retention.

    Production tooling for a glove box outer panel with a projected area of 0.15 m² is normally run on a clamp force of 300 t to 450 t; a hot runner with valve gates is used when the gate vestige is visible, and the valve pin is set to open after the flow front passes the gate drop to avoid a cold slug on the Class A surface. Shrinkage of PC/ABS 8075 in the flow direction must be measured using ISO 294-4 on a 60 mm × 60 mm plaque, and the resulting correction factor is applied to the tool steel because PC/ABS shrinkage is anisotropic enough to shift clip tower positions by 0.2 mm–0.5 mm across a 600 mm span. Flammability verification follows FMVSS 302 / ISO 3795 for horizontal burn rate, with a maximum burn rate of 100 mm/min for interior materials in the U.S. regulation, while the UL 94 V-0 rating is retained for electrical accessory integration points such as footwell lighting sockets. The terminal parts are assembled into instrument panel lower trim, map pocket shells, and seat belt escutcheon covers; because PC/ABS 8075 contains an unsaturated butadiene phase, the molding quality team rejects any material lot that shows free moisture on the granulate surface before drying, since hydrolysis at 270 °C can create silver streaks that are visible only after the part is embossed with the OEM grain.

    Where Does PC/ABS 8075 Satisfy IEC 60601-1 Enclosure Integrity Without Requiring a Secondary Shield?

    Under this boundary, portable diagnostic ultrasound units, laboratory analyzer covers, and patient-monitor enclosures are classified for transient skin contact, and the enclosure is not a patient-applied part. PC/ABS 8075 is used as a single-wall fire enclosure because the material can carry a UL 94 V-0 rating at 1.5 mm, and that rating is accepted by IEC 60601-1:2005+A2:2021 when the risk assessment assigns fire protection to the enclosure rather than to an internal metal shield. The molding process uses a lower melt temperature of 240 °C–250 °C to preserve the flame-retardant package and a mold temperature of 70 °C–80 °C to avoid internal stress in tall, thin-wall side panels; parts are annealed if shelf-life stress-cracking tests show crazing after aggressive disinfectant exposure. The material is evaluated under ISO 10993-1:2018 for limited contact duration, with a chemical leachables screening per ISO 10993-18 if the enclosure surface is touched by clinicians for more than 30 min per day. Cleaner compatibility is validated with 70 % isopropanol and 0.1 % sodium hypochlorite wipe cycles; a visible haze or microcrack on a textured surface after 50 cycles indicates that the moulded-in stress was not adequately relieved by the packing profile.

    On the production floor, medical enclosure housings are run with a dedicated drying hopper to prevent cross-contamination from non-medical color masterbatch; the colorant let-down ratio is kept at 2 wt%–3 wt% and the carrier is polycarbonate-based because ABS-based color carriers reduce impact energy at the screw boss weld line. In diagnostic units with a liquid crystal display front bezel, the gate is located in a non-UV adhesive bonding area and the flow front is advanced with a two-stage injection velocity: 30 mm/s through the sprue bush until the runner is full, then 120 mm/s–200 mm/s through the cavity. This two-stage velocity profile prevents jetting on the lens shelf and keeps the knit line below the adhesive mask. Terminal products include ultrasound cart bases, in vitro diagnostic analyzer front doors, and handheld reader enclosures; the operating temperature range is limited to 10 °C–40 °C for continuous use, with no autoclave sterilization, because PC/ABS is not suitable for steam sterilization at 134 °C and repeated cycle exposure will soften the flame-retardant additive system.

    The compliance matrix below consolidates the sector-specific verification standards for PC/ABS 8075 applications.

    Application sectorKey standardTypical verification
    EV charging enclosuresIEC 61851-1, IEC 62368-1, UL 94V-0 at 1.5 mm; glow wire 750 °C–850 °C
    IT/OA equipmentIEC 62368-1, RoHS 2011/65/EUUL 94 V-0 at 1.5 mm; flatness < 0.8 mm across 400 mm
    Automotive interiorFMVSS 302, ISO 3795, VDA 275, VDA 270Burn rate ≤ 100 mm/min; VOC ≤ 100 µg/g; odor ≤ 3
    Medical enclosuresIEC 60601-1:2005+A2:2021, ISO 10993-1:2018, UL 94V-0 at 1.5 mm; disinfectant wipe 70 % isopropanol
    Industrial enclosuresIEC 60529, UL 508A, IEC 62208IP65; NEMA 250 Type 4/12
    Power tool / battery packIEC 62841-1, IEC 62133-2, ISO 179-1UL 94 V-0 at 1.5 mm; low-temperature impact −20 °C
    Telecom enclosuresIEC 60112, IEC 60695-2-11, IEC 60068-2-2, IEC 60068-2-78CTI per IEC 60112; thermal aging 85 °C/85 % RH for 1000 h

    Outdoor telemetry enclosures and fieldbus junction boxes introduce a condensation-driven hydrolysis requirement that is absent from indoor IT enclosure molding. PC/ABS 8075 is molded with a higher melt temperature of 250 °C–265 °C to achieve good knit-line coalescence at boss and sealing rib intersections, but the residence time is kept below 5 min because the flame-retardant additive degrades in the heated screw channel and produces carbon deposits on the check ring. The enclosure is designed to IEC 60529 IP65 or NEMA 250 Type 4/12; sealing faces are molded with a flatness tolerance of 0.2 mm over 150 mm and the gasket groove is vented at the bottom to prevent gas entrapment. Electric panel compliance is assessed under UL 508A or IEC 62208 for low-voltage switchgear and controlgear assemblies; PC/ABS 8075 is used for covers, bezels, and terminal block supports, not for current-carrying parts.

    Wall thickness in the screw boss area is controlled at 0.6 : 1 boss-to-wall ratio to prevent sink marks at the exterior surface; ribs are cut to 0.8 times the nominal wall thickness and spaced not less than 2.0 mm apart to avoid internal voids. The material is processed on a 250 t–350 t hybrid injection molding machine with a nitrogen-filled barrel shroud because outdoor black formulations can oxidize if the hopper throat temperature exceeds 60 °C. Regrind is restricted to 15 wt% for outdoor enclosure lots because ultraviolet exposure of previously molded gates and runners creates a different surface oxidation state; if this regrind is not separated, the outdoor enclosure shows premature gloss loss at the weld line after 500 h of ISO 4892-3 exposure. Terminal products are remote terminal unit housings, programmable logic controller bezels, and embedded controller enclosures; the PC/ABS 8075 grade is not used for transparent covers because the material is opaque and flame-retardant filled.

    If a Drop Impact Requirement Exceeds 0.5 J at −20 °C, PC/ABS 8075 Demands a Weld-Line Analysis Before Mold Approval

    When the flame-retardant rating is mandatory for battery charging circuits and the drop energy requirement is moderate rather than extreme, power tool battery pack housings and charger shells are molded from PC/ABS 8075. The relevant test sequence in production qualification includes a low-temperature drop from 1 m onto a concrete or steel plate per the product-specific version of IEC 62841-1 or IEC 62133-2, with visual inspection for cracks at screw bosses and snap-fit features. Because flame-retardant additives reduce weld-line strength more than they reduce bulk tensile strength, multi-gate battery pack tools are analyzed before hard steel is cut; the weld line is moved to a low-stress web between cells, and the gate count is limited to two or three to prevent a star-shaped knit line under the release button. The moulding temperature is set at 260 °C–270 °C for the upper limit, but only for 3 min–5 min residence time; mold temperature is maintained at 80 °C because a lower setting of 60 °C produces a visible dull line at the knit edge and may reduce Charpy notched impact energy by 10 %–20 % when tested per ISO 179-1/1eA at −20 °C.

    Housing regrind is kept below 10 wt% if the shell is used in cold climates, because repeated heat history embrittles the polycarbonate phase and lowers the ductile-brittle transition temperature; a higher regrind fraction of 15 wt% is allowed only for indoor charger shells with a minimum service temperature of 0 °C. The screw recovery time is set to 2 s–4 s with backpressure of 5 bar–10 bar because higher backpressure can overheat the flame retardant at the compression zone and cause black specks in the molded shell. Injection speed is profiled at 150 mm/s–300 mm/s for the first 80 % of fill and dropped to 30 mm/s for the final 20 % to reduce gas entrapment at the latch geometry. Terminal products include bench charger enclosures, battery pack lower shells, and power tool motor housings where a UL 94 V-0 at 1.5 mm Yellow Card is cited for the electrical creepage distance envelope. The mold is not textured on the sealing surface because a textured finish can create a leak path for coolants and moisture; this is a critical boundary when the tool is used in both indoor and outdoor cordless tools.

    Flame Retardancy and Comparative Tracking Index in 5G Small-Cell and Baseband Enclosures

    Telecommunications equipment such as 5G small-cell radio covers, optical network terminal housings, and baseband unit covers uses PC/ABS 8075 where the printed circuit board is separated from the enclosure by creepage distance alone, and the enclosure must resist ignition from a 750 °C glow wire under IEC 60695-2-11. The comparative tracking index is determined per IEC 60112:2003+A1:2009; flame-retardant PC/ABS grades are often assigned a PLC class of 3 on the UL 746A Yellow Card, so the design must either increase creepage and clearance or apply a conformal coating to the printed board. The molding process uses a melt temperature of 245 °C–255 °C and a mold temperature of 70 °C–80 °C; the barrel is purged with a polycarbonate-based purging compound after every color change because flame-retardant residues in the hot runner manifold cause black specks in the next production run. Regrind is limited to 20 wt%, and each lot is checked for melt volume-flow rate per ISO 1133-1:2022 at 260 °C/5 kg; a shift greater than 10 % from virgin pellets triggers a sorting operation because the fire rating may no longer apply at the minimum wall thickness.

    Signal-transparent covers for small-cell radios present a different constraint: PC/ABS 8075 is opaque and cannot be used for the radome window if the antenna is directly behind the cover; the polymer is instead used for the base and the frame around an RF-transparent polycarbonate insert. The two materials are joined by a two-shot or insert molding process after the insert is dried separately at 80 °C for 4 h; the melt temperature of the PC/ABS is kept at 255 °C during overmolding to avoid delamination at the interface caused by a low weld boundary temperature. Thermal aging validation is conducted under IEC 60068-2-2 dry heat at 85 °C for 1000 h and IEC 60068-2-78 damp heat at 85 °C/85 % RH for 1000 h; after aging, the enclosure is subjected to the UL 94 V-0 vertical burn test and the flame-retardant rating must remain unchanged. Terminal assemblies include outdoor baseband unit housings, indoor 5G small-cell frames, and fiber access terminal housings; ultraviolet protection is supplied by a painted top cover or a co-molded UV-stabilized capstock, not by the 8075 base polymer alone. The part is not approved for pole-top mounting above 2000 m elevation without an electrical enclosure heater because condensation at the hydrophobic surface can alter surface resistivity and create a leakage current path across the gasket groove.

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    Certification & Compliance
    More Introduction

    Beijing Shousu PC/ABS 8075 is an unfilled polycarbonate/acrylonitrile-butadiene-styrene blend supplied in pellet form for injection molding of electronics housings, appliance fascia panels, and interior vehicle components. The grade is positioned within the medium-flow segment of the PC/ABS family; it is not a flame-retardant formulation and is not intended for applications requiring UL 94 V-0 at thicknesses below 3.0 mm. Supplier lot certificates should be treated as the controlling source for density, melt volume-flow rate, impact strength, and heat deflection temperature. Where supplier-specific public datasheets for Beijing Shousu PC/ABS 8075 are limited, the property ranges discussed below are representative of medium-flow PC/ABS alloys processed under the same ISO test conditions and should be verified against the actual certificate of analysis before tooling is cut.

    What distinguishes Beijing Shousu PC/ABS 8075 from high-heat and high-flow alloy grades?

    The supplier grade code 8075 does not identify a standardised composition under ISO 1043 or ASTM D4000; it is a commercial designation. In typical PC/ABS blend practice, an 8075-series material is selected when melt processability must be balanced against notched impact retention and dimensional stability. High-heat PC/ABS grades raise Vicat softening temperatures above 130 °C but usually exhibit melt volume-flow rates below 10 cm³/10 min at 260 °C/5 kg, which restricts fill in thin-wall sections below 1.5 mm. High-flow PC/ABS grades may exceed 25 cm³/10 min but often lose room-temperature notched Izod impact strength, falling below 30 kJ/m². In the 8075 designation, the expected process window clusters around intermediate flow and impact values: Vicat B50 values from 118 °C to 128 °C, melt volume-flow rates from 12 cm³/10 min to 20 cm³/10 min, and notched Izod impact at 23 °C from 40 kJ/m² to 60 kJ/m² under ISO 180:2023. Compared with unreinforced polycarbonate homopolymer, the blend reduces melt viscosity and heat deflection but improves processability in long-flow applications. Compared with general-purpose ABS terpolymer, the blend raises heat resistance and low-temperature toughness but requires tighter drying control and higher melt temperatures.

    During compounding on a co-rotating twin-screw extruder with an L/D ratio of 40:1, the polycarbonate and ABS phases are melt-mixed at barrel temperatures between 240 °C and 270 °C, with screw speeds from 300 min⁻¹ to 500 min⁻¹. Residence time above 270 °C must remain below 8 min; extended exposure accelerates ABS rubber-phase degradation and produces a colour shift from natural white to amber. For injection molding, the melt temperature is maintained at 250 °C to 280 °C, and the mold temperature is maintained at 60 °C to 90 °C. In thin-wall sections below 1.0 mm, melt front solidification produces short shots when the mold surface temperature falls below 70 °C; this effect is observed on general-purpose hydraulic machines with screw diameters of 30 mm to 40 mm and clamp forces under 1,200 kN. Back pressure is typically set below 10 bar to avoid excessive shear heating in the melt cushion.

    When residual moisture exceeds 0.02 % by mass, impact retention becomes processing-limited

    PC/ABS pellets are hygroscopic. Absorption at 23 °C and 50 % relative humidity can reach equilibrium moisture levels of 0.2 % to 0.4 % within 24 h if open containers are left unsealed. At melt temperatures above 260 °C, trapped moisture hydrolyzes the carbonate linkages in the PC phase, producing molecular weight reduction and gaseous decomposition by-products. The resulting defects include silver streaking and a measurable loss in notched Izod impact. Drying in a desiccant-bed dryer with a dew point of −40 °C or lower is required to reach 0.02 % or less; typical drying conditions are 80 °C to 90 °C for 3 h to 4 h. A gravimetric or Karl Fischer analysis according to ISO 15512:2019 should be used to confirm moisture content before start-up, because hopper residence time in humid environments can reintroduce moisture within 30 min. When ambient relative humidity exceeds 60 %, hopper loading should be reduced or a closed feed system should be used to limit moisture regain.

    For hot-runner systems, internal melt-channel temperatures should not exceed 280 °C, and residence time in dead zones should be kept below 5 min. Gate dimensions and runner geometry require balanced fill; edge gates with land lengths below 1.0 mm and gate thicknesses of 50 % to 70 % of the nominal wall thickness reduce premature freeze. In family molds or multi-cavity layouts, flow-length-to-wall-thickness ratios above 150:1 are associated with volumetric fill imbalance and non-uniform packing pressure. Mold shrinkage in the flow direction is typically reported between 0.5 % and 0.7 % according to ISO 294-4:2018; shrinkage anisotropy should be compensated by adjusting cavity dimensions for flow-parallel and flow-transverse directions.

    Representative property ranges and ISO test method designations for medium-flow PC/ABS 8075

    The following table is not a certificate of analysis; it is a cross-reference of typical property windows for medium-flow PC/ABS alloys and does not replace lot-specific data for Beijing Shousu PC/ABS 8075.

    PropertyTest method and conditionRepresentative range
    DensityISO 1183-1:2019, 23 °C1.13–1.15 g/cm³
    Melt volume-flow rateISO 1133-1:2022, 260 °C/5 kg12–20 cm³/10 min
    Tensile stress at yieldISO 527-2:2012, type 1A, 50 mm/min50–60 MPa
    Tensile strain at yieldISO 527-2:2012, type 1A, 50 mm/min4–6 %
    Flexural modulusISO 178:2019, 2 mm/min2,100–2,400 MPa
    Notched Izod impact strengthISO 180:2023, 23 °C40–60 kJ/m²
    Notched Izod impact strengthISO 180:2023, −30 °C8–15 kJ/m²
    Vicat softening temperature B50ISO 306:2013118–128 °C
    Heat deflection temperatureISO 75-2:2013, 1.8 MPa105–115 °C
    Mold shrinkage, flow directionISO 294-4:20180.5–0.7 %
    Water absorption at saturationISO 62:2008, 23 °C0.2–0.4 %

    Chemical compatibility tests on similar unfilled PC/ABS alloys show that dilute mineral acids, aliphatic hydrocarbons, and mild alkaline cleaning agents can be tolerated for short contact times at room temperature. Concentrated mineral acids, aromatic hydrocarbons, esters, ketones, and chlorinated solvents attack the PC phase and can produce environmental stress cracking under simultaneous tensile stress. Contact with plasticiser-containing PVC, certain tertiary amine catalysts, and phosphate ester hydraulic fluids should be avoided. Ultrasonic welding and hot-plate welding require the melt interface to remain above the ABS phase softening point; cold weld lines below 40 °C exhibit brittle fracture and low tensile strength retention. When painting, aromatic solvent carriers should be avoided unless compatibility has been verified on molded plaques, because solvent uptake into molded-in stress concentrations induces cracking.

    How does the intermediate flow length of 8075 alter gate placement and wall thickness decisions?

    At a melt temperature of 260 °C and a mold temperature of 80 °C, a medium-flow PC/ABS can typically fill a spiral flow length of 25 cm to 35 cm at an injection pressure below 1,200 bar for wall thicknesses of 2.0 mm. The flow length is below that of high-flow ABS but above that of high-heat PC grades. Gate placement should therefore avoid unassisted flow-length-to-wall-thickness ratios above 150:1. In enclosures with wall thickness transitions, the change from a nominal section to a thick boss should not exceed 25 % of the nominal wall; abrupt steps create sink marks and internal voids during packing. For thin-wall sections below 1.2 mm, sequential valve gating or multiple direct edge gates are required to reduce injection pressure demand. Cold runners should use full-round or trapezoidal cross-sections with diameters of 4 mm to 6 mm for parts with shot weights below 500 g.

    Compliance matrix for unfilled PC/ABS 8075 in electrical enclosure applications

    RequirementStandard or regulationDocumentation or limit
    Restriction of hazardous substances2011/65/EU Annex IISupplier declaration required per lot
    REACH candidate list screeningEC 1907/2006Supplier declaration required per lot
    Flammability classificationUL 94, 3.0 mmTypically HB for unfilled grade; verify listing
    Moisture content before melt processingISO 15512:2019≤0.02 % by mass
    Specimen preparation for mechanical testingISO 294-1:2021Injection-molded test specimens
    Food-contact migration evaluationEU No 10/2011, FDA 21 CFR 177.1580Polymer-specific testing required; published data for this specific configuration is limited

    Contaminated regrind containing polyamide, polyacetal, or PVC should be excluded from the material stream because each forms a separate dispersed phase and reduces weld-line strength, paint adhesion, and notched impact consistency. Regrind content in production parts is typically limited to 20 % to 30 % by mass when tensile elongation at yield and impact retention are required. Continuous-use temperature for unfilled PC/ABS depends on load and humidity; under no-load thermal aging at 80 °C for 1,000 h, general-purpose PC/ABS typically retains more than 80 % of initial notched Izod impact, while at 100 °C oxidative embrittlement of the ABS rubber phase can appear within 500 h. Unpainted interior components exposed to solar load above 90 °C require higher-heat PC/ABS grades or polycarbonate/ASA alloys.

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