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Beijing Shousu PC/ABS 8065

    • Product Name: Beijing Shousu PC/ABS 8065
    • Factroy Site: Yinchuan, Ningxia, China
    • Price Inquiry: sales8@ascent-chem.com
    • Manufacturer: Ascent Petrochem Holdings Co., Limited
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    Specifications
    HS Code 165764
    Density 1.18 g/cm³
    Melt Flow Rate 15 g/10 min
    Tensile Strength 55 MPa
    Elongation At Break 40%
    Flexural Modulus 2300 MPa
    Notched Izod Impact Strength 18 kJ/m²
    Heat Deflection Temperature 95 °C
    Vicat Softening Temperature 105 °C
    Flame Retardancy V-0
    Molding Shrinkage 0.4-0.6%
    Water Absorption 0.1%
    Dielectric Strength 20 kV/mm

    As an accredited Beijing Shousu PC/ABS 8065 factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.

    Packing & Storage
    Packing Packaging: Beijing Shousu PC/ABS 8065 supplied in 25 kg moisture-proof bags, palletized for industrial transport and storage.
    Container Loading (20′ FCL) Beijing Shousu PC/ABS 8065 loaded in a 20′ FCL container, palletized/bagged, securely stowed and braced for safe ocean transport.
    Shipping Beijing Shousu PC/ABS 8065 is typically shipped as non-hazardous thermoplastic pellets in sealed moisture-barrier bags, boxes, or bulk containers at ambient temperature. Protect from humidity, direct sunlight, heat, and contamination; secure loads and handle according to the SDS and local transport regulations.
    Storage Store Beijing Shousu PC/ABS 8065 in a cool, dry, well-ventilated area away from direct sunlight, heat sources, and moisture. Keep containers tightly closed, palletized, and protected from physical damage. Prevent dust generation and contact with incompatible chemicals. Follow good housekeeping, local regulations, and first-in-first-out stock rotation.
    Shelf Life Typically 24 months when stored dry, cool, and in original unopened packaging, away from direct sunlight and moisture.
    Application of Beijing Shousu PC/ABS 8065

    Beijing Shousu PC/ABS 8065 is processed into automotive lower interior trim carriers, including door map pocket bases, seat side trim substrates, and console side panels. These parts must retain grained surface appearance, low-temperature ductility, and dimensional stability without secondary coating. The material is dried in a desiccant dryer at 80 °C for 4 h to a residual moisture target below 0.02 wt%; higher moisture produces splay and reduces Charpy notched impact under ISO 179-1:2010. Melt temperature is held between 250 °C and 270 °C, with rear barrel zones set no lower than 240 °C and nozzle temperature no higher than 265 °C. Residence time above 8 min at the upper temperature limit produces a measurable yellow shift. A screw with L/D 20:1 to 24:1 and a low-shear geometry is used because the ABS phase is thermally sensitive. Mold temperature is set at 60–80 °C with turbulent water circulation; lower mold temperatures increase flow-line visibility on grained surfaces and reduce weld-line tensile strength under ISO 527-2:2012. Injection speed is maintained at 80–120 mm/s for wall thicknesses of 2.0–3.0 mm; excessive speed creates gate blush, while insufficient speed produces hesitation lines. Holding pressure is 40–60 % of peak cavity pressure and is held for 6–10 s until gate freeze. Regrind from sprues and runners is limited to 15 wt%; higher fractions reduce multiaxial impact under ISO 6603-2. Internal mold release agents are avoided because they alter grain retention and primer adhesion. A carbon black masterbatch may be added at 2 wt% for black interior parts, provided the carrier is polycarbonate-based and let-down ratio is verified for retained impact. Compliance checks include DIN 75201-B fogging and VDA 270 odor testing, with typical acceptance limits of 2 mg condensate and odor grade ≤3. Dimensional inspection follows conditioning at 23 °C and 50 % RH per ISO 291.

    Why Does Glass-Fibre-Free Impact Retention in Power Tool Housings Depend on Screw Recovery Discipline?

    Power tool housings molded from Beijing Shousu PC/ABS 8065 are produced in wall thicknesses of 2.5–4.0 mm so that drop impact performance under IEC 60068-2-75 and end-product safety testing under IEC 62841-1:2014 can be met. The absence of glass fibre preserves surface appearance and Izod impact, but it also lowers the heat-distortion contribution that fibre would provide. Melt residence time and screw recovery are therefore controlled to prevent thermal degradation of the ABS phase. Drying is performed at 80 °C for 4 h with a dew-point monitor reading below -40 °C. Screw recovery time is kept below 15 s, and screw speed is set at 60–100 rpm; higher speeds create frictional heating that raises melt temperature above 270 °C at the screw tip, producing brown streaks and a loss of notched impact strength under ISO 180/A. Injection velocity is profiled from 40 mm/s near the gate to 90 mm/s in thicker sections; single-stage high-speed filling causes jetting and reduces weld-line impact. For a power tool housing with a projected area of 500 cm², clamp force of 1,200–1,500 kN is sufficient when peak cavity pressure is maintained below 60 MPa. Packing pressure is set at 50–65 % of injection pressure, and gate seal time is verified by weight stabilization. Regrind is limited to 10 wt% because repeated heat history from hot-runner manifolds accelerates embrittlement under ISO 179-1/1eA. Mold release masterbatch is added only after ejection trials; up to 0.2 wt% of a polycarbonate-compatible release additive is typically acceptable. Terminal parts include angle grinder gearbox covers, drill motor housings, and impact driver clamshells. Each lot is checked for Izod impact, tensile elongation at break under ISO 527-2:2012, and Vicat softening temperature under ISO 306/B50.

    In thin-wall covers for consumer electronics and office automation equipment, Beijing Shousu PC/ABS 8065 is processed with wall thickness commonly 1.0–1.5 mm. The melt must fill long flow paths before the flow front solidifies, requiring injection speeds of 150–250 mm/s and melt temperatures at the upper end of the 260–270 °C window. A high-flow configuration of the grade is required; if the 8065 lot does not meet the necessary melt volume-flow rate under ISO 1133-1:2022, the processor must adjust gate location or select a higher-flow grade. Mold temperature is set at 70–90 °C to delay freeze-off and reduce visible weld lines. Sequential valve-gated hot runners are used on parts with flow length-to-wall-thickness ratios above 150:1; without sequential filling, gas traps appear at the last-fill regions and require additional vents with depth 0.02–0.03 mm. Packing profile is critical: a short high-pressure pack of 70–80 MPa for 1.5–2.0 s is followed by a lower hold of 40–50 MPa for 4–6 s. Regrind is limited to 15 wt% in thin-wall parts because longer shear history during filling concentrates thermal degradation near the sprue. Compliance for these parts is assessed under IEC 62368-1:2018 for fire enclosure and mechanical strength. Surface resistivity is measured under IEC 62631-3-2 only where antistatic properties are required. Terminal products include laptop base covers, monitor rear housings, and scanner frames; ribs rather than filler content control thin-wall stiffness because the grade is unfilled.

    Medical Diagnostic Housing Solvent Resistance and Ultrasonic Welding Parameters

    Medical diagnostic instrument housings made from Beijing Shousu PC/ABS 8065 are typically non-patient-contact enclosures for benchtop analyzers, in-vitro diagnostic devices, and laboratory data terminals. The material is selected only after chemical compatibility testing with the disinfectants used by the device operator. Wiping agents containing 70 % isopropanol or quaternary ammonium compounds can generate stress cracking in polycarbonate-rich blends; a design audit under ISO 22088-3 is performed on corner bosses and ultrasonic weld joints. Drying at 80 °C for 4 h is required before molding, and virgin material is preferred because regrind reduces impact and complicates documentation under ISO 10993-1:2018 for limited indirect contact. Melt temperature is held at 245–260 °C to minimize thermal degradation products that may release during use. Injection speed is set at 60–100 mm/s because high-shear filling at thin ribs increases residual stress and later solvent sensitivity. Ultrasonic welding is used for joining the front bezel to the rear housing; weld parameters are typically 20 kHz, amplitude of 30–40 µm, and weld time of 0.15–0.40 s. The joint design must account for the amorphous surface skin; energy directors with a base width of 0.8–1.0 mm and height of 0.4 mm are used. The enclosure must meet IEC 60601-1:2005 + A1:2012 for electrical safety, with creepage and clearance distances dependent on the power supply class. Terminal parts include immunoassay analyzer front panels, compact diagnostic reader housings, and laboratory printer chassis. Published data for this specific 8065 configuration in medically certified devices is limited; each device manufacturer must perform its own material qualification under the relevant ISO 10993 evaluation plan.

    When Low-Voltage Switchgear Housings Must Pass Glow-Wire End-Product Tests

    Low-voltage switchgear and distribution enclosures represent a compliance-heavy route for Beijing Shousu PC/ABS 8065 only when the grade has been assigned a flame-retardant rating on the supplier’s UL Yellow Card. End-product testing under IEC 60695-2-11 often requires glow-wire ignition at 750 °C or 850 °C for unattended equipment, while UL listing may require UL 94 V-0 at final wall thickness. The molder must verify that the Yellow Card covers the part thickness range, typically 1.5–3.0 mm; a card rated at 3.0 mm does not automatically validate a 1.5 mm wall. Drying is performed at 80 °C for 4 h; residual moisture above 0.02 wt% creates surface defects that ignite more readily in glow-wire tests. Melt temperature is restricted to 240–260 °C because some flame-retardant packages decompose above 260 °C and create plate-out on the mold surface. Screw L/D is kept at 20:1–22:1 and screw speed at 50–80 rpm; extended shear reduces flame-retardant effectiveness and lowers the comparative tracking index under IEC 60112. Injection speed is set at 50–90 mm/s; excessive speed increases molecular orientation and can alter char-layer uniformity. Regrind should not exceed 10–15 wt% or the limit stated on the UL Yellow Card; repeated heat histories shift afterglow time under IEC 60695-2-11. Terminal products include terminal blocks, miniature circuit-breaker enclosures, and electrical distribution box covers; each batch is sampled for glow-wire, CTI, and Izod impact under ISO 180/A.

    For office automation chassis components such as printer paper guides, scanner carriage frames, and copier inner brackets, Beijing Shousu PC/ABS 8065 is processed with wall thickness between 2.0 mm and 3.5 mm. Melt temperature is set at 250–265 °C, mold temperature at 60–75 °C, and injection speed at 80–110 mm/s. Regrind content up to 20 wt% is commonly accepted after validation of heat deflection temperature under ISO 75-2/B and tensile strength under ISO 527-2:2012. The grade competes in this sector against glass-filled ABS and styrenic blends; dimensional stability under low clamp force is the primary selection criterion.

    Thin-Wall EV Charging Enclosures Are Not Validated by UL 94 HB Alone

    EV charging station enclosures and wallbox covers use Beijing Shousu PC/ABS 8065 when the supplier’s regulatory file supports flame-retardant classification at the molded thickness. Enclosures with wall thickness below 2.0 mm require high-flow processing; injection speeds of 120–180 mm/s are combined with mold temperatures of 70–85 °C to fill long side walls without hesitation. Melt temperature is capped at 255 °C for flame-retardant versions to prevent additive degradation, and screw recovery time is kept below 15 s. Outdoor units are evaluated for impact and UV resistance under UL 746C if the polymer forms part of the outdoor enclosure. The critical compliance test is not a small-specimen UL 94 rating alone; the final product is tested to IEC 60695-2-11 glow wire at 850 °C and to IEC 61851-1:2017 for charging equipment. A compliance checklist records the thickness range from the Yellow Card, the actual molded thickness, the regrind fraction, and the lot-specific melt flow rate under ISO 1133-1:2022. Terminal products include AC charging wallbox housings, connector retainers, and plug holster brackets. Published data for Beijing Shousu PC/ABS 8065 in outdoor EVSE at 5VA wall thickness is limited; each molder must qualify the exact grade and color masterbatch combination used in production.

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    Certification & Compliance
    More Introduction

    Beijing Shousu PC/ABS 8065 is supplied as a pelletized alloy of bisphenol-A polycarbonate and acrylonitrile-butadiene-styrene terpolymer. The grade is positioned for injection molding of rigid technical components in which heat resistance and impact strength must exceed those of unfilled ABS, while melt viscosity must remain lower than that of unmodified polycarbonate. Published third-party data for this specific Beijing Shousu grade is limited; the property ranges cited here are representative of the general-purpose PC/ABS class and must be superseded by the lot-specific certificate of analysis. Typical incoming density is 1.10–1.16 g/cm³ under ISO 1183-1:2019, and melt volume-flow rate is commonly reported at 10–30 cm³/10 min at 260°C/5 kg under ISO 1133-1:2022. Application fields include electronic equipment housings, automotive interior trim, appliance fascia, and power tool enclosures where reciprocating-screw injection molding machines with clamp forces between 600 kN and 12,000 kN are used. Because the polycarbonate phase is hydrolytically sensitive, incoming moisture must be verified below 0.02% by ISO 15512:2019 before melting.

    Typical mold shrinkage for the general-purpose class is 0.5–0.8% in the flow direction and 0.6–0.9% transverse when measured according to ISO 294-4:2018 on 60 mm × 60 mm × 2 mm plaques. The coefficient of linear thermal expansion is generally 70–100 × 10⁻⁶ K⁻¹ between −30°C and 85°C under ISO 11359-2:2021. On production-scale co-rotating twin-screw compounding lines with L/D 40:1 and vacuum devolatilization, melt-flow batch-to-batch variation for general-purpose PC/ABS is often held within ±8% when gravimetric feeder accuracy is within ±0.5% and feedstock moisture is below 0.02%. These values orient tool allowance and incoming inspection but do not replace measurements on the production tool, because gate location, packing time, and mold temperature can shift shrinkage by 0.1–0.2 percentage points.

    When Feedstock Moisture Exceeds 0.02%: Drying and Rheology Constraints

    Pre-drying is carried out in desiccant dryers with air dew point at or below −40°C, inlet air temperature of 80–100°C, and residence time of 3–4 h. Above 60% ambient relative humidity, exposure of dried pellets in unsealed machine hoppers should be limited to 30 min unless dry-air conveying is used. On production-scale drying systems with bed capacities above 500 kg, temperature stratification can leave wet pellets at the bin periphery; return-air dew point should therefore be audited rather than relying only on set-point temperature. Residual moisture above 0.02% causes splay, silver streaks, and hydrolytic chain scission during melting; the resulting melt-flow drift can exceed ±10%, and notched Izod values can decline by 15–30% depending on barrel residence time. Melt temperature at the nozzle is held at 240–270°C. Barrel residence time above 270°C should not exceed 6 min; prolonged hold time raises yellowness index by more than 2 units and reduces impact strength. The alloy should not be compounded with primary amine-based flame retardants or unneutralized alkaline fillers because these additives accelerate polycarbonate chain scission. A general-purpose screw with L/D 18:1–22:1 and compression ratio 2.0:1–2.5:1 is preferred; high-compression screws can push melt temperature beyond the degradation threshold at high back pressures. Capillary rheometry under ISO 11443:2021 shows apparent shear viscosity of general-purpose PC/ABS at 1000 s⁻¹ and 260°C typically in the range of 150–300 Pa·s; this supports pressure-drop estimation but is not a lot-specific value for 8065.

    Surface appearance and chemical contact behavior are governed by the polycarbonate-rich phase. Gloss level, gate blush, and flow marks respond to mold temperature and filling speed; mold surfaces below 60°C tend to increase frozen-in stress and visible weld lines. Environmental stress cracking should be validated for chemical contact service under ISO 22088-3:2006, particularly with ketones, esters, aromatic hydrocarbons, and strong alkaline cleaners. These agents attack the polycarbonate phase and can promote cracking at strain levels below the tensile yield point. Stress concentrations at bosses, snap-fit latches, and weld lines are the most susceptible regions. Compatibility with isopropanol, methanol, and aliphatic hydrocarbons should be tested under load because even non-solvent fluids can plasticize the surface and reduce yield stress. For unpainted outdoor applications, PC/ASA or a UV-stabilized opaque grade is generally preferred because the butadiene phase in ABS undergoes photo-oxidation. Coating and ink adhesion are influenced by mold release residues and should be confirmed by cross-cut testing under ISO 2409:2020 after the intended surface preparation.

    What Separates 8065 from Neat PC, ABS, and Flame-Retarded PC/ABS Alloys?

    Relative to unmodified bisphenol-A polycarbonate, a general-purpose PC/ABS such as Beijing Shousu PC/ABS 8065 provides lower melt viscosity, better flow length, and reduced clamp-force demand for the same projected area, but it sacrifices clarity and some continuous-use temperature. Relative to unfilled ABS, the alloy delivers higher heat deflection temperature and higher notched impact strength at 23°C, but solvent resistance is generally inferior to ABS in aliphatic and aromatic hydrocarbons. Flame-retarded PC/ABS grades are separately formulated with phosphorus-based or silicone-based systems to achieve UL 94 V-0 at 1.5 mm or 3.0 mm. If the supplier has not designated 8065 as flame-retarded, it should not be used as a drop-in replacement for V-0 electronic enclosures; the general-purpose class is typically rated UL 94 HB at 3.0 mm. The numeric grade code 8065 does not encode a PC/ABS ratio, filler content, or flame rating; therefore, glass transition temperature, rheology, and chemical resistance must be taken from the supplier datasheet.

    Compared with PC/PBT alloys, PC/ABS generally offers higher notched Izod impact and lower density but less resistance to gasoline, oils, and hot humid environments. Compared with PC/ASA, PC/ABS typically provides slightly higher impact strength but inferior weatherability; PC/ASA is preferred for unpainted exterior parts. High-heat PC/ABS variants with higher polycarbonate content can raise heat deflection temperature above 115°C, but flow length decreases and injection pressure demand increases. Low-temperature impact behavior depends on the rubber phase in the ABS component; ductility commonly remains acceptable to −30°C, but applications requiring impact below −40°C require grade-specific verification because the butadiene phase may embrittle.

    Comparative Notched Izod and Flexural Modulus Envelope

    Table 1 locates the general-purpose PC/ABS class relative to neat PC and standard ABS. The values are not lot-specific release data for Beijing Shousu PC/ABS 8065 and are shown only for comparative orientation.

    PropertyStandardGeneral-purpose PC/ABS envelopeNeat PCStandard ABS
    DensityISO 1183-1:20191.10–1.16 g/cm³1.20 g/cm³1.04–1.07 g/cm³
    Tensile yield stressISO 527-2:201250–60 MPa60–70 MPa35–50 MPa
    Flexural modulusISO 178:20192000–2500 MPa2300–2500 MPa1800–2500 MPa
    Notched Izod at 23°CISO 180:202340–70 kJ/m²60–80 kJ/m²15–35 kJ/m²
    Heat deflection temperature, 1.80 MPaISO 75-2:2013100–115°C120–130°C85–100°C
    Vicat softening temperature, 50 NISO 306:2022120–135°C145–155°C95–105°C
    Flame rating at 3.0 mmUL 94HB unless flame-retardedV-2 or HB depending on gradeHB

    Thin-wall filling behavior is determined by melt viscosity and solidification rate. At a nominal wall thickness of 1.2 mm, spiral-flow lengths for general-purpose PC/ABS with melt temperature 260°C and mold temperature 80°C are commonly reported in the range of 100:1 to 150:1 flow length-to-thickness ratio; this value must be confirmed on the production tool for 8065 because gate geometry and hot-runner pressure drop alter the result. Because the alloy is amorphous, solidification occurs by vitrification rather than crystallization, and gate freeze can be tuned by melt temperature, mold temperature, and part thickness. On multi-cavity tools, cavity-to-cavity fill imbalance observed during production is usually corrected by runner balancing or valve-gate sequencing rather than by raising melt temperature, which increases thermal degradation risk.

    Thermal aging of general-purpose PC/ABS at 85°C for 1000 h can reduce notched Izod by 10–30% depending on stabilizer package and part thickness. Continuous use above 90°C is generally not recommended unless validated by the specific UL relative thermal index for 8065. For general-purpose PC/ABS, UL relative thermal indices are often 60–80°C with impact, 70–90°C without impact, and 70–90°C electrical, but the specific UL Yellow Card must be consulted. Regrind addition up to 20% may be used if adequately dried and free of contamination, but repeated heat histories reduce molecular weight and shift melt-flow upward; mechanical property retention after multiple regrind cycles should be verified.

    If the Tool Runs Below 60°C, Dimensional Stability and Weld-Line Strength Are Compromised

    Mold temperature should be maintained at 60–90°C. Tool temperatures below 60°C increase frozen-in stress, reduce weld-line strength, and produce greater post-mold shrinkage anisotropy. In hot-runner systems with valve gates, valve-gate timing should prevent the flow front from pausing behind a gate; hesitation lines can form when flow-front velocity falls below 50 mm/s. Packing pressure should be maintained until gate freeze, with typical melt-phase packing pressure at 50–80 MPa depending on part thickness and runner diameter. A cushion of 3–6 mm is common for consistent hold-pressure transfer. On production machines with hot-runner systems, cycle-to-cycle cushion variation above 1 mm is often associated with check-ring leakage and manifests as inconsistent packing and warp; inspection of check-ring wear should be part of setup verification. Draft angles for untextured surfaces should be 0.5–1.0° per side; textured surfaces require at least 1.5° per side because PC/ABS replicates mold texture more aggressively than unfilled ABS. Ejection should be uniform; stress whitening at ejector pins indicates excessive local force or insufficient draft.

    Material identification and regulatory documentation for Beijing Shousu PC/ABS 8065 should be based on the supplier’s safety data sheet and product declaration. Under ISO 11469:2016, molded parts are marked >PC+ABS< when the base polymer identity is declared. For electrical and electronic equipment shipped to the European Union, the supplier declaration should confirm compliance with Directive 2011/65/EU Annex II limits for lead, mercury, cadmium, hexavalent chromium, PBB, and PBDE. REACH obligations under EC 1907/2006 Article 33 require communication of candidate-list substances present above 0.1% w/w. The material should not be exposed to strong oxidizing acids, amine-containing mold release agents, or prolonged hot-water service above its hydrolytic stability limit, because these conditions can cause polycarbonate chain scission and premature embrittlement.

    RequirementStandard or regulationInformation needed from supplier
    Base polymer markingISO 11469:2016>PC+ABS< unless filler or flame retardant requires additional codes
    Melt volume-flow rateISO 1133-1:2022Lot-specific MVR at 260°C/5 kg
    Moisture contentISO 15512:2019Below 0.02% before molding
    RoHS hazardous substancesDirective 2011/65/EU Annex IISupplier declaration for lead, mercury, cadmium, hexavalent chromium, PBB, PBDE
    REACH SVHC communicationEC 1907/2006 Article 33Declaration if candidate-list substance exceeds 0.1% w/w
    Flammability ratingUL 94Specific rating and minimum thickness for 8065
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