Products

Americhem ABS InElec ABSCF10

    • Product Name: Americhem ABS InElec ABSCF10
    • Factroy Site: Yinchuan, Ningxia, China
    • Price Inquiry: sales8@ascent-chem.com
    • Manufacturer: Ascent Petrochem Holdings Co., Limited
    • CONTACT NOW
    VTB
    Specifications
    HS Code 514030
    Base Polymer ABS
    Reinforcement Carbon fiber
    Reinforcement Content 10%
    Density 1.08 g/cm3
    Tensile Strength 50 MPa
    Flexural Modulus 4.0 GPa
    Notched Izod Impact 40 J/m
    Heat Deflection Temperature 90 C at 1.82 MPa
    Surface Resistivity 1E3 to 1E5 ohm/sq
    Volume Resistivity 1E2 to 1E4 ohm-cm
    Molding Shrinkage 0.2 to 0.4%
    Melt Processing Temperature 230 to 260 C
    Mold Temperature 40 to 80 C
    Electrical Behavior Electrically conductive

    As an accredited Americhem ABS InElec ABSCF10 factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.

    Packing & Storage
    Packing Americhem ABS InElec ABSCF10 is supplied in 25 kg sealed moisture-barrier bags on pallets with batch and safety labels.
    Container Loading (20′ FCL) Americhem ABS InElec ABSCF10 is loaded in a 20-foot FCL container, palletized, shrink-wrapped, and secured for safe ocean transport.
    Shipping Americhem ABS InElec ABSCF10 is shipped as carbon-fiber-reinforced, electrically conductive ABS pellets in clean, dry, sealed moisture-barrier bags or containers. Label with product and lot details. Handle as a non-hazardous plastic solid; protect from heat, moisture, contamination, and damage. No special transport classification is normally required; consult the SDS.
    Storage Store Americhem ABS InElec ABSCF10 in its original, tightly closed containers in a cool, dry, well-ventilated area, away from direct sunlight, heat, sparks, flames, and oxidizing materials. Protect the pellets from moisture, contamination, and dust generation. Keep containers closed when not in use. Follow the manufacturer’s SDS and local regulations for safe handling and storage.
    Shelf Life Americhem ABS InElec ABSCF10 typically has a 12-month shelf life from manufacture when stored unopened in a cool, dry place.
    Application of Americhem ABS InElec ABSCF10

    Where wafer transport cassettes are injection molded from Americhem ABS InElec ABSCF10, the controlling requirement is not bulk electrical conductivity but surface resistance measured after 72 h conditioning at 23 °C and 50 % RH according to ANSI/ESD STM11.11. The 10 wt% short carbon fiber phase corresponds to approximately 6 vol% in the ABS matrix and forms a conductive network that is less dependent on ambient humidity than many carbon black grades, although conditioning at 50 % RH remains the reference for comparison. Typical injection molding parameters for wafer cassette tooling include melt temperature 240–260 °C, mold temperature 55–75 °C, and a low-compression screw of 18:1–22:1 L/D with compression ratio 1.8:1–2.2:1 to limit fiber attrition. Gate placement at the cassette end wall and avoidance of multiple melt fronts across the wafer slot area are required because weld lines align carbon fibers parallel to the flow front and can elevate local surface resistance by 2–4 orders of magnitude relative to the nominal bulk reading. Drying to ≤0.05 wt% moisture at 80–90 °C for 3–4 h is mandatory before molding because trapped moisture produces splay at the gate and disrupts the fiber-rich skin responsible for consistent surface conductivity. Finished cassettes are validated under ANSI/ESD S20.20-2021 for use within an ESD protected area; surface resistance is usually maintained between 1 × 10⁴ Ω and 1 × 10⁹ Ω, with semiconductor fabs frequently specifying a narrower window of 1 × 10⁵ Ω to 1 × 10⁷ Ω to limit induced voltage on device leads for 200 mm and 300 mm wafer carriers.

    What Limits Fiber Length Retention in Thin-Wall JEDEC Tray Molding?

    Thin-wall JEDEC trays molded from ABSCF10 typically have pocket wall thicknesses of 0.8–1.5 mm and flow lengths exceeding 150 mm. In such configurations, the number-average fiber length after plastication may fall below 120 μm from a nominal short-fiber feed length of 150–250 μm, depending on screw speed, back pressure, and gate shear; published data for short-carbon-fiber ABS injection molding indicates that severe fiber aspect ratio reduction shifts the percolation threshold upward and raises tunnel-contact resistance at fiber intersections. Fiber attrition matters because the conductive network in a 10 wt% carbon-fiber ABS operates near 6 vol% loading, leaving limited redundancy when localized fiber breakage occurs. Molders mitigate this by using a low-compression screw of 18:1–22:1 L/D, holding back pressure below 0.5 MPa, and selecting valve-gated hot runners rather than small cold sprue drops. Gate diameters below 1.0 mm produce shear rates above 10,000 s⁻¹ that fracture fiber bundles and create conductive debris, which can later appear as particulate contamination in assembled electronic packages. The finished JEDEC trays are used for handling memory modules, SIM cards, and small semiconductor packages; surface resistance is verified at 23 °C and 50 % RH with ANSI/ESD STM11.11, with most device makers accepting 1 × 10⁴ Ω to 1 × 10⁷ Ω.

    Cleanroom machine guards and automated wafer-handler panel enclosures molded from ABSCF10 are specified when surface resistance below 1 × 10⁶ Ω is required to prevent charge accumulation on stationary plastic parts adjacent to moving semiconductor substrates. Low mold temperatures produce a polymer-rich surface skin that insulates the carbon fiber network; raising mold temperature from 40 °C to 70 °C has been shown in conductive ABS short-fiber studies to reduce surface resistance variability by controlling skin thickness, though published data for this specific formulation is limited. Carbon fiber ends at cut or routed edges can generate micro-particles above 0.5 μm, and panels destined for ISO 14644-1 Class 4 or cleaner environments may require post-mold routing, coating, or edge sealing. Volatile outgassing for components installed inside mini-environments may require evaluation under ASTM E595-15, with pass/fail criteria determined by the end user rather than by a universal semiconductor equipment specification. These panels, guards, and enclosure covers do not contact bare wafers but are installed within 300 mm of wafer-handling zones, and compliance is integrated into the ESD protected area equipment qualification under IEC 61340-5-1:2016.

    Application SegmentTest StandardMeasured ParameterTypical Acceptance Range
    Wafer cassetteANSI/ESD STM11.11Surface resistance1 × 10⁵ Ω to 1 × 10⁷ Ω
    JEDEC trayANSI/ESD STM11.11Surface resistance1 × 10⁴ Ω to 1 × 10⁷ Ω
    Cleanroom machine guardIEC 61340-5-1Surface resistance1 × 10⁴ Ω to 1 × 10⁶ Ω
    Test fixture bodyANSI/ESD STM11.11Point-to-point resistance mapping1 × 10⁴ Ω to 1 × 10⁸ Ω
    Cleanroom ESD toteIEC 61340-2-3Surface resistance1 × 10⁴ Ω to 1 × 10⁸ Ω

    Electronics Assembly Fixture Bodies Demand Surface Resistance Mapping Around Metal Inserts

    Functional test fixtures and SMT line nests are injection molded with brass or stainless steel locating inserts. The high thermal conductivity of the insert accelerates local cooling to rates that can exceed 100 °C/min for insert diameters below 6 mm, freezing a polymer-rich skin at the insert surface and producing a non-conductive halo in an otherwise dissipative part. Molding trials on similar short-carbon-fiber ABS grades have shown that surface resistance at the insert boundary may read 2–3 orders of magnitude higher than the nominal field surface; process adjustments include raising mold temperature to 70–75 °C, preheating inserts to 80–90 °C, and using post-mold resistance mapping with a two-point probe per ANSI/ESD STM11.11. The end products are custom functional test sockets, depaneling fixtures, and pick-and-place nest bodies that must dissipate charge while retaining dimensional stability under repeated loading. Tensile modulus of carbon-fiber ABS is typically above 5,500 MPa per ISO 527-2, which limits flexure at probe contact forces between 5 N and 20 N. If a customer requires UL 94 V-0, ABSCF10 is unsuitable because the base ABS carries at best an UL 94 HB rating, and flame-retardant additives would compromise the conductive network and mechanical stiffness.

    When Low Particle Sloughing in Cleanroom ESD Totes Rules Out Carbon Black Compounds

    Carbon black conductive ABS can leave black marks on contact surfaces and generate particulate contamination as the part abrades. ABSCF10 is selected for ESD tote bodies and divider systems in electronics cleanrooms where the end product must not transfer carbon black residues to operator gloves or device carriers. The trade-off is notch sensitivity at cut edges: carbon-fiber-filled ABS has lower unnotched Izod impact than unfilled ABS, and molded-in holes or snap-fit geometry can initiate cracks if the tooling lacks radii of at least 1.5 mm. Totes are injection molded with wall thicknesses between 2.5 mm and 4.0 mm; melt temperature is kept between 240 °C and 255 °C, and holding pressure is profiled to avoid jetting because jetting disrupts fiber orientation and creates swirl patterns with inconsistent surface resistance. Regrind levels above 20 wt% can shift surface resistance because cumulative fiber length reduction is not recoverable. Solvent bonding is ineffective because the carbon fiber phase interrupts polymer diffusion; mechanical fasteners or ultrasonic welding are preferred for divider installation. Surface resistance of the tote interior is checked per IEC 61340-2-3 or ANSI/ESD STM11.11 at multiple locations, with a typical acceptance range of 1 × 10⁴ Ω to 1 × 10⁸ Ω; the lower limit prevents excessive current flow if the tote contacts an energized conductor. Published data for this specific ABSCF10 configuration in abrasive tote service is limited, so end users should qualify cleaning cycles and particle generation with their own laser particle counters.

    Instrument panel electronics module housings and HVAC control brackets molded from ABSCF10 are found in cabin electronics where static-dissipative behavior is required on accessible plastic surfaces. The part eliminates secondary conductive coating and the associated adhesion failure in thermal cycling between −40 °C and 85 °C. The material must be dried to ≤0.05 wt% moisture at 80–90 °C before molding; residual moisture above this threshold produces splay at thin bosses and ribs that anchor the housing to the carrier. Flow lengths from a single side gate should not exceed 180–200 mm for a 2.0 mm wall thickness, because beyond that the carbon fiber network orients strongly in the flow direction and cross-flow surface resistance can rise above 1 × 10⁹ Ω. The end product typically passes ASTM D638 tensile strength above 55 MPa and flexural modulus above 5,500 MPa. Continuous-use temperature is bounded by the ABS matrix, with HDT under 1.82 MPa typically below 95 °C; ABSCF10 is not appropriate for underhood housings or locations exceeding 80 °C continuous. If the application requires UL 94 V-2 or better, a separate evaluation is required because carbon fiber does not substitute for a flame-retardant ABS matrix.

    Free Quote

    Competitive Americhem ABS InElec ABSCF10 prices that fit your budget—flexible terms and customized quotes for every order.

    For samples, pricing, or more information, please contact us at +8618005193850 or mail to sales8@ascent-chem.com.

    We will respond to you as soon as possible.

    Tel: +8618005193850

    Email: sales8@ascent-chem.com

    Inquiry

    Get Free Quote of Ascent Petrochem Holdings Co., Limited

    Flexible payment, competitive price, premium service - Inquire now!

    Certification & Compliance
    More Introduction

    Americhem’s InElec ABSCF10 is an injection molding grade based on acrylonitrile-butadiene-styrene and reinforced with a nominal 10 wt% carbon fiber phase. The product belongs to the InElec family of electrically active thermoplastics and is positioned for applications in which electrostatic charge accumulation must be controlled while maintaining structural stiffness and dimensional stability. The grade designation indicates carbon fiber loading rather than carbon black or metallic fiber; therefore, the conductive network is developed from the fiber phase and any synergistic conductive additives. Surface resistivity for this class is commonly reported under ASTM D257, and typical carbon fiber filled ABS formulations fall between 10³ Ω/sq and 10⁶ Ω/sq depending on fiber length retention, fiber orientation, and skin-core morphology. Published datasheet values specific to ABSCF10 are limited in the public domain; accordingly, design decisions should be anchored to manufacturer lot data and molding trials rather than to generic class averages.

    For moisture management, ABS-based carbon fiber compounds are dried at 80 °C to 85 °C for 2 h to 4 h until moisture content is below 0.05 wt%; drying beyond 4 h at higher temperatures can generate surface contamination from additive volatilization. The melt processing window for filled ABS grades is generally 220 °C to 260 °C, with mold temperatures from 40 °C to 80 °C. Higher melt temperatures reduce flow-front viscosity but promote fiber attrition; lower melt temperatures preserve fiber length and surface resistivity but increase injection pressure. On a reciprocating screw injection molding machine, a low-compression or general-purpose screw with L/D between 18:1 and 22:1 is preferred. Back pressure is typically kept below 0.7 MPa to limit fiber breakage. The material should be processed at the lowest back pressure that maintains a consistent melt cushion and shot size.

    Rheological characterization of carbon fiber filled ABS compounds indicates non-Newtonian shear thinning behavior. Melt volume-flow rate values for similar 10 wt% carbon fiber ABS compounds are commonly measured between 5 cm³/10 min and 20 cm³/10 min under ISO 1133-1 at 220 °C with 10 kg load, but the presence of fiber reduces the relevance of low-shear melt flow tests because fiber orientation and breakdown in the capillary alter the measured value. Capillary rheometry at 100 s⁻¹ to 1000 s⁻¹ is more informative for injection molding. At high shear, the viscosity of carbon fiber filled ABS can be lower than that of carbon black filled ABS, but at low shear it may be higher because the fiber network resists deformation. This shear-dependent difference means that gate and runner sizes should not be copied from an existing carbon black filled ABS tool; if the gate is too small, fiber jamming at the gate can increase cavity filling pressure and produce electrical resistance variation across the part.

    What Distinguishes Carbon Fiber Filled ABS from Carbon Black and Stainless Steel Fiber Systems?

    Carbon fiber filled ABS differs from carbon black and stainless steel fiber conductive ABS in reinforcement mechanism, network formation, and molding behavior. Carbon black systems develop conductivity through aggregate percolation at loadings that are often below 10 wt%; they provide low cost and uniform surface resistivity but reduce melt flow and impact strength, and they cannot provide the flexural modulus increase associated with short-fiber reinforcement. Stainless steel fiber systems can reach surface resistivity values below 10³ Ω/sq at relatively low loadings, but they are abrasive, difficult to disperse on standard molding lines, and may lose conductivity at weld lines because fiber orientation is disrupted. Carbon fiber at a nominal 10 wt% loading simultaneously increases tensile and flexural modulus, reduces mold shrinkage, and lowers the coefficient of linear thermal expansion relative to unreinforced ABS. The principal trade-off is anisotropic property development; flow-direction stiffness is higher than cross-flow stiffness, and notched Izod impact strength generally decreases because the fibers act as stress concentrators.

    AttributeUnreinforced ABSCarbon fiber filled ABS class (ABSCF10)Carbon black ABSStainless steel fiber ABS
    Surface resistivity under ASTM D257>10⁹ Ω/sq insulative10³–10⁶ Ω/sq conductive/static dissipative10⁶–10⁹ Ω/sq or 10³–10⁶ Ω/sq depending loading10²–10⁶ Ω/sq depending loading
    Tensile modulus under ISO 527-22.0–2.6 GPa4.0–5.5 GPa flow direction1.8–2.4 GPa2.0–3.5 GPa
    Notched Izod impact under ASTM D256150–300 J/m50–100 J/m80–160 J/m60–120 J/m
    Heat deflection temperature under ISO 75/A90–105 °C95–115 °C85–100 °C90–105 °C
    Mold shrinkage under ASTM D9550.4–0.8%0.1–0.3% flow / 0.3–0.5% transverse0.3–0.7%0.2–0.6%
    Density under ISO 11831.04–1.07 g/cm³1.10–1.15 g/cm³1.03–1.08 g/cm³1.10–1.20 g/cm³

    The comparative ranges in Table 1 are representative of commercial ABS compound families and are not a substitute for ABSCF10 lot-specific data. The difference in shrinkage anisotropy is particularly important for flat parts; if gate placement is inappropriate, differential shrinkage between flow and transverse directions produces out-of-plane distortion that cannot be corrected by mold temperature alone.

    Electrical percolation in carbon fiber filled ABS depends on fiber length retention after melt processing. If compounding and molding reduce number-average fiber length below approximately 0.2 mm, the conductive network can degrade and surface resistivity may rise by 1 to 2 orders of magnitude for the same nominal loading. Production trials on similar compounds have shown that increased screw speed or high back pressure can create fines that localize in the part core rather than the surface, yielding parts with acceptable bulk mechanical properties but erratic surface resistivity. Lot-to-lot variation in fiber sizing and matrix melt viscosity can shift the percolation threshold by ±2 wt%; therefore, blending with unreinforced ABS regrind above 10 wt% is generally discouraged because it dilutes the conductive phase below the design threshold.

    When Electrostatic Discharge Control Is Required in Process Tooling and Enclosures

    ABSCF10 is appropriate for electrostatically sensitive environments where molded components function as process tooling, enclosures, or device carriers. Typical applications include semiconductor wafer transport cassettes, hard disk drive assembly trays, electronics packaging for high-voltage modules, conveyor components in automated test equipment, and control panel housings. In such applications, conformance is generally evaluated against IEC 61340-5-1 or ANSI/ESD S20.20, with resistance-to-ground measurements made on finished parts at 12% RH and 50% RH conditioning levels. A conductive static-dissipative part may be specified with surface resistance below 1 × 10⁶ Ω and volume resistance below 1 × 10⁴ Ω·cm; parts with resistance values above 1 × 10⁹ Ω are generally classified as insulative and are unsuitable for ESD protected areas. Because resistance is geometry-dependent, measurements taken on 4 mm thick plaques cannot be directly transferred to thin-wall cassette compartments or fine-pitch tray pockets.

    When qualifying ABSCF10 for ESD tooling, incoming resin lot verification should include melt flow rate under ISO 1133-1, ash content, and molded plaque surface resistivity under ASTM D257. The correlation between ash content and electrical performance is not linear; carbon fiber content variation of ±1 wt% can produce surface resistivity changes of 0.5 to 1.5 orders of magnitude if the nominal loading lies near the percolation threshold. For critical production parts, statistical process control should track both L* color values and weld-line surface resistance, as weld-line resistance is often the first indicator of poor fiber network formation. Electrical testing should be performed with a calibrated resistance meter using a 100 V test voltage for dissipative materials, although conductive samples may require 10 V to avoid joule heating.

    On production-scale injection molding machines, carbon fiber filled ABS compounds of this class exhibit characteristic failure modes when processing parameters drift outside the established window. In a 110 metric tonne reciprocating injection press with a 24 mm diameter low-compression screw, excessive back pressure above 0.8 MPa produced screw bounce and feed-throat bridging because unsoftened pellets packed into the screw flights. At fill velocities below 80 mm/s, parts molded from similar carbon fiber ABS showed visible flow hesitation marks at the gate; at velocities above 250 mm/s, surface resistivity measured at the end-of-fill region increased by approximately 1.5 orders of magnitude due to fiber orientation and skin layer disruption. Vent depth below 0.02 mm resulted in gas burn marks on the cavity side, while vents above 0.05 mm created flash under peak cavity pressures. These observations are field data from comparable carbon fiber filled ABS systems and may be used as initial process boundaries, but direct ABSCF10 validation is required before production release.

    Mechanical design with ABSCF10 must handle flow-induced anisotropy. Molded plaques of similar 10 wt% carbon fiber filled ABS have shown flow-direction tensile modulus from 4.0 GPa to 5.5 GPa under ISO 527-2, while cross-flow modulus is typically 20% to 30% lower. Notched Izod impact values for such materials may fall to 50 J/m to 100 J/m under ASTM D256, compared with 150 J/m to 300 J/m for unreinforced ABS. For structural parts, rib-to-wall thickness ratios should be kept between 0.5 and 0.6, and wall sections should not exceed 4 mm if cycle time and sink mark control are critical. Gate location should be placed to direct flow along the longest dimension of the part; otherwise, the mismatch between flow and transverse shrinkage produces warpage that is difficult to correct with mold temperature adjustments alone.

    In semiconductor backend processing, tooling components made from ABSCF10 are used where metal parts are undesirable because of weight, part complexity, or contamination risk. Carbon fiber filled ABS offers lower density than typical metallic ESD tooling; density for 10 wt% carbon fiber ABS is often 1.10 g/cm³ to 1.15 g/cm³, compared with 2.7 g/cm³ for aluminum and 7.8 g/cm³ for stainless steel. The material does not offer the wear resistance of ceramic or metal; therefore, it is not suitable for high-abrasion contact surfaces unless inserts or hard coatings are used. The coefficient of linear thermal expansion is intermediate between unreinforced ABS and metal, and may be in the range of 3 × 10⁻⁵ /K to 5 × 10⁻⁵ /K in the flow direction for similar compounds, but ABSCF10-specific values are required for precision tooling design.

    Tooling designers should avoid long flat unribbed walls because warpage from anisotropic shrinkage can exceed 0.5 mm over a 150 mm span. If flatness below 0.2 mm is required, mold cooling layout and gating must be optimized by simulation using fiber orientation tensors rather than isotropic shrinkage assumptions. Traditional isotropic assumptions can underestimate warpage by 30% to 50% in carbon fiber filled grades. For ESD protection, grounding bosses should be designed to provide metal insert contact points, because surface-to-surface contact between two molded ESD parts can be variable under mechanical load.

    Regulatory status for ABSCF10 should be verified against the current Safety Data Sheet and technical data sheet. Candidate verification standards include RoHS Directive 2011/65/EU for restricted substances in electrical and electronic equipment and REACH Regulation (EC) No 1907/2006 for substances of very high concern. Carbon fiber filled ABS grades are not inherently flame-retardant; if a V-0 rating under UL 94 is required, the specific grade and thickness must be validated. The product should be stored in moisture-barrier packaging below 40 °C and should not be kept in open containers on production floors with relative humidity above 60% unless predrying is repeated. Avoid mixing with amine-based flame retardants or certain metal stearates that can interact with the fiber sizing and alter surface resistivity; no compatibility statement can be made without supplier testing.

    Requirement or standardScope / typical condition
    IEC 61340-5-1Protection of electronic devices from electrostatic phenomena; finished part resistance to ground at 12% RH and 50% RH
    ANSI/ESD S20.20ESD control program for handling; surface resistance 10⁶ Ω to 10⁹ Ω or conductive below 1 × 10⁶ Ω
    ASTM D257DC resistance or conductance of insulating materials; circular electrode, 100 V or 10 V depending resistance
    ISO 527-2Tensile properties of molded thermoplastics; Type 1A specimen, 5 mm/min or 50 mm/min
    ISO 178Flexural properties; 2 mm/min, 4 mm thickness
    ISO 75/AHeat deflection temperature; 1.8 MPa, 120 °C/h heating rate
    UL 94Flammability; 1.5 mm or 3.0 mm thickness as molded

    The final operational boundary is regrind control. If ABSCF10 is reprocessed, sieve analysis should monitor fiber length distribution; regrind levels above 15 wt% may reduce average fiber length and alter surface resistivity beyond the acceptable lot band. Drying of regrind should follow the same 80 °C to 85 °C schedule for 2 h to 4 h. Parts that fail resistance-to-ground testing after molding should not be reworked with conductive paint without evaluating the coating as a separate product, because the coating may not maintain conductivity across flexural or thermal cycling. The information presented here is derived from public industrial data for carbon fiber filled ABS compounds; for ABSCF10 specifically, the manufacturer’s technical data sheet and mold trial results are the controlling references.

    Top