Products

3M CN-4190 EMI Shielding Tape

    • Product Name: 3M CN-4190 EMI Shielding Tape
    • Factroy Site: Yinchuan, Ningxia, China
    • Price Inquiry: sales8@ascent-chem.com
    • Manufacturer: Ascent Petrochem Holdings Co., Limited
    • CONTACT NOW
    VTB
    Specifications
    HS Code 480046
    Manufacturer 3M
    Product Name 3M CN-4190 EMI Shielding Tape
    Product Type EMI Shielding Tape
    Backing Material Copper Foil
    Adhesive Type Conductive Acrylic
    Shielding Frequency Range 30 MHz to 1 GHz
    Color Copper
    Flammability Rating UL 510

    As an accredited 3M CN-4190 EMI Shielding Tape factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.

    Packing & Storage
    Packing Package contains one roll of 3M CN-4190 EMI Shielding Tape, sealed in plastic and packed inside a labeled cardboard box.
    Container Loading (20′ FCL) 20′ FCL: non-hazardous 3M CN-4190 EMI Shielding Tape, palletized, evenly distributed, moisture-protected, and fully secured inside a clean dry container.
    Shipping 3M CN-4190 EMI Shielding Tape is generally not classified as hazardous for transportation. It ships as a non-regulated article under DOT, IATA, and IMDG rules, requiring no dangerous-goods labels or placards. Use standard protective packaging, keep dry, avoid extreme temperatures, and follow the current SDS for safe handling.
    Storage Store 3M CN-4190 EMI Shielding Tape in its original sealed packaging in a clean, dry, well-ventilated area. Keep at moderate room temperature, away from direct sunlight, moisture, heat, sparks, and ignition sources. Avoid extreme temperatures, strong acids, oxidizing agents, and chemical exposure. Rotate stock and use within the manufacturer’s recommended shelf life.
    Shelf Life Shelf life is 24 months from date of manufacture when stored in original packaging at 20°C and 50% relative humidity.
    Application of 3M CN-4190 EMI Shielding Tape

    3M CN-4190 is a copper-foil-backed pressure-sensitive tape with a conductive acrylic adhesive layer. It is supplied in roll form with a release liner and is converted by slitting, die-cutting, or automated lamination into seam-shielding, grounding, and cable-shield termination components. The downstream applications below are limited to sectors where enclosure seam closure, aperture shielding, and low-impedance grounding are documented production requirements. The tape is not a replacement for environmental sealing; in humid, salt-laden, or high-temperature service conditions, additional edge sealing, conformal coating, or a separate gasket is required. Manufacturer technical data identify the total tape thickness as 0.09 mm, comprising 0.035 mm copper foil and 0.055 mm conductive acrylic adhesive. Each application section specifies the installed coverage ratio, process boundary, and relevant compliance anchor.

    In handheld device assembly, the tape is not compounded into a resin but introduced as a pre-formed converted component in the cover-glass-to-mid-frame grounding path and across stamped magnesium-lithium or aluminum alloy seams. The installed addition proportion is defined by the fixed construction ratio—35 µm copper foil to 55 µm conductive acrylic adhesive—and by a minimum 3 mm overlap at die-cut joints and a 1.5 mm clearance from board-compression features. On production lines, roll-fed flat-bed laminators with 55–65 Shore A silicone pressure rollers and 0.2–0.4 MPa nip pressure are used to apply strips to frame pockets; line speed is typically limited to 3–7 m/min to maintain wet-out without entrapping air. The dominant failure mode observed in high-volume assembly is bridge-lifting at screw bosses where tape tension above 1.2 N/10 mm causes the foil to snap back after cutting; rework stations use heated vacuum debonding rather than solvent release because ketone-based cleaning agents attack the acrylic adhesive. Compliance verification relies on CISPR 32:2015 and FCC 47 CFR Part 15 Subpart B radiated emission scans, with enclosure continuity checked before placement through ASTM D257 surface-resistance measurements and after installation by four-point probe measurements across the tape seam. Restricted-substance conformance is verified to RoHS 2011/65/EU Annex II and REACH SVHC obligations. Finished terminal devices in this application include ultra-thin notebook base covers, tablet mid-frames, and high-density smartphone mainboards where the tape provides both EMI seam closure and a conductive grounding return to the display chassis.

    Why Does 5G Remote Radio Unit Shielding Require Seam Conductivity Below 10 mΩ?

    Seam conductivity below 10 mΩ is a production test limit on remote radio unit cavities because higher junction impedance at 3.5 GHz and 26 GHz can convert a continuous enclosure into a slot radiator. 3M CN-4190 is applied to the mating surfaces of die-cast aluminum filter cavities and power-amplifier trays before lid closure; the tape is converted into 12–25 mm wide rolls, and the addition proportion at corner transitions is set at 50% of tape width overlap, while liner removal and placement are performed with an automated six-axis gantry end-effector equipped with a spring-loaded polyurethane conforming roller at 1.5–2.0 N/cm wiper pressure. The copper foil thickness of 0.035 mm provides a calculated shielding effectiveness greater than 80 dB above 100 MHz under plane-wave incidence; the conductive acrylic adhesive reduces contact resistance at mating surfaces but does not fill gaps larger than 0.25 mm. For gap heights above 0.25 mm, the tape must be combined with a compressible conductive foam or spring-finger gasket; otherwise, the seam becomes the limiting leak path. Compliance is governed by ETSI EN 301 489-1, IEC 61000-4-3, and applicable portions of FCC Part 15; module-level spurious emission verification is often performed to 3GPP TS 38.113.

    Production bottleneck data from RRU assembly lines indicate that seam contact resistance is less influenced by tape thickness than by the flatness of die-cast flanges; when flange waviness exceeds 0.15 mm across a 100 mm span, measured seam impedance rises above 10 mΩ even with full adhesive wet-out. Incoming die-casting flatness is therefore inspected with a profilometer or coordinate measuring machine before tape placement; flanges outside 0.15 mm are re-machined or assigned to gasketed sealing rather than tape-only closure. The tape is applied with a spring-loaded polyurethane roller at 1.5–2.0 N/cm wiper pressure and a traverse speed below 50 mm/s; higher traverse speeds generate micro-air entrapment along the adhesive–metal interface, which increases local contact resistance. Published data for the exact composite shielding effectiveness of CN-4190 across angled-incidence cavity environments is limited; plane-wave skin-depth calculations for 0.035 mm copper foil should not substitute for system-level EMI validation in an accredited chamber. Terminal finished product types include 5G active antenna units, remote radio units, and carrier-grade small-cell enclosures.

    Automotive ECU Housing Seams and Conducted Immunity

    In high-vibration engine-compartment locations, automotive engine control modules and ADAS controllers use metal housings with multiple seams and connector flanges; the tape is introduced as a die-cut EMI seam gasket rather than as a bulk formulation additive. The addition proportion on the line is defined by strip width chosen as 6–10 mm and a nominal 20% overlap around connector corners; on die-cast aluminum ECU base plates, the tape is applied after chromate conversion coating has fully dried and before lid fastener torqueing. Pre-application surface preparation uses lint-free wipes with 70:30 isopropanol/water; the aluminum alloy surface should have a conversion coating per MIL-DTL-5541 Type II or an approved commercial equivalent, because direct application of copper foil to bare aluminum creates a galvanic couple under salt-fog exposure. Production processes include rotary die-cutting with ±0.15 mm placement tolerance and closed-loop vision inspection at 12–20 ppm camera frame rates to detect exposed liner fragments, foil wrinkles, and edge lift. The table below summarizes the main compliance matrix for this scenario.

    Standard or test methodFunctionApplication in ECU verification
    CISPR 25:2016Component emissionsAbsorber-lined shielded enclosure scans from 150 kHz to 2.5 GHz
    ISO 11452-2:2019Radiated immunity200 V/m CW and pulse-modulated field exposure
    ISO 7637-2:2011Transient conducted immunity12 V and 24 V board-net transient injection
    ASTM D3330Peel adhesion180° peel after 20 min dwell on stainless steel

    The tape is not a primary environmental seal; in engine-compartment-adjacent ECU installations, an RTV silicone gasket over the seam or a secondary lid seal is required when exposure to continuous 85 °C and 85% RH exceeds 500 h, consistent with ISO 16750-4 thermal/humidity cycling. Adhesive bond strength under thermal cycling tends to degrade first at foil edges where differential expansion between copper and aluminum causes shear stress concentration; edge lifting is reduced by specifying minimum 1.0 mm rounded corner radii on die-cut geometry. Surface temperature should remain at least 3 °C above the dew point before application, because microcondensation on the substrate can lower initial tack and create unpredictable contact resistance after insertion into the housing. Terminal finished product types include engine control modules, transmission control units, ADAS sensor processing modules, and telematics control units.

    Powder-coated steel and galvanized sheet metal enclosures used in medical diagnostic analyzers require an internal seam shield that does not become an unintended secondary ground for patient-applied parts. The tape is applied after paint curing and before printed circuit board insertion. The fixed construction ratio remains 35 µm copper foil to 55 µm conductive acrylic adhesive; the installed addition proportion is expressed as a seam coverage ratio of 85–100% of metal-to-metal contact length, with 3 mm minimum tape extension beyond fastener bosses and a 4 mm grounding tab folded over the mating edge. Application is performed with manual rollers in lower-volume diagnostic instrument assembly or with semi-automated flat-bed laminators at 0.2–0.3 MPa for higher-volume ultrasound cart lines; lamination paths are restricted to flat, stiffened sheet metal flanges because unsupported flexures produce adhesive creep and eventual edge lift. Compliance is anchored to IEC 60601-1-2:2014/AMD1:2020 electromagnetic compatibility for medical electrical equipment, with radiated and conducted emissions limits referenced to CISPR 11:2015 class A or B depending on the intended use environment. The tape may be used in equipment with reinforced insulation barriers only if creepage and clearance distances are maintained; the copper foil must not bridge an isolation barrier between mains-connected circuitry and patient-applied accessible surfaces. Solvent compatibility is limited: cleaning with ketones, aromatic hydrocarbons, or terpene-based cleaners can soften the conductive acrylic adhesive and increase contact resistance. Terminal finished product types include hematology analyzers, automated immunoassay systems, ultrasound imaging carts, and molecular diagnostic thermal cyclers.

    When Avionics Line Replaceable Units Use Conductive Tape in Place of Form-in-Place Gaskets

    When avionics LRUs replace form-in-place conductive gaskets with pre-formed copper foil tape, the change introduces process advantages but also imposes stricter edge-seal inspection. The tape is supplied as 0.09 mm total thickness and is die-cut into frames that match the module cover footprint; the addition proportion at module seams is set at 25% overlap of tape width at corners and 2–4 linear metres of installed tape per enclosure depending on access panel geometry. Placement follows nickel-aluminum chem-film surfaces prepared to MIL-DTL-5541 Type II Class 3; the tape is applied after fastener installation torque has been verified, so that tape compression is not used as a soft-seal load path. Clamps and cover screws apply bearing pressure through the tape, but the adhesive alone is not relied upon for electrical bonding under vibration; RTCA DO-160G Section 8 vibration profiles and Section 20 radio-frequency emission tests verify performance. The dominant production failure occurs when the release liner is removed too quickly, causing copper foil to curl and reducing adhesive transfer on re-entrant corners; automated liner removal at 30–60 mm/s with 0.5 N hold-down force minimizes curl. Compliance verification for military applications is performed to MIL-STD-461G, particularly conducted susceptibility CS114 and radiated emissions RE102; for civil avionics, verification follows RTCA DO-160G Section 21. The tape is not qualified as a sole environmental seal; moisture, salt fog, and cleaning fluid ingress require a separate conductive gasket or conformal coating. Terminal finished product types include flight control computers, radar processing units, navigation receivers, and cabin network interface LRUs.

    Grounding Return Integrity Decreases When Surface Roughness Exceeds 0.2 mm

    Variable-frequency drive and servo drive cabinets introduce high dV/dt pulse-width modulation noise, so conductive tape is used at enclosure door seams, cable-shield to connector backshell transitions, and filter partition seams. The addition proportion is specified as 50% overlap when wrapping braided cable shields to connector bodies and 5 mm flat overlap on sheet-metal flanges; on fabricated steel panels with texture depth above 0.2 mm, the tape adhesive alone does not conform fully into surface roughness, so the process includes a hardened roller pass at 0.3–0.5 MPa to force adhesive wet-out. Production lines use slitting stations to convert rolls into 8–15 mm widths for cable wrap and 25 mm widths for enclosure seams; slit edges are inspected for foil burrs because burrs can migrate into power converter cooling channels or break away as conductive debris. Compliance for finished equipment is addressed through IEC 61800-3:2017 adjustable-speed electrical power drive systems EMC limits, CISPR 11:2015 Class A radiated and conducted emission tests, and IEC 61000-4-6:2013 conducted immunity for signal and power lines. The tape is not rated for direct immersion in oil-mist environments; in heavily contaminated enclosures, additional edge sealing or an oil-resistant overlamination is required. Terminal finished product types include standalone variable-frequency drive cabinets, integrated servo drive modules, regenerative power conversion units, and uninterruptible power supply power modules.

    Free Quote

    Competitive 3M CN-4190 EMI Shielding Tape prices that fit your budget—flexible terms and customized quotes for every order.

    For samples, pricing, or more information, please contact us at +8618005193850 or mail to sales8@ascent-chem.com.

    We will respond to you as soon as possible.

    Tel: +8618005193850

    Email: sales8@ascent-chem.com

    Inquiry

    Get Free Quote of Ascent Petrochem Holdings Co., Limited

    Flexible payment, competitive price, premium service - Inquire now!

    Certification & Compliance
    More Introduction

    3M CN-4190 EMI Shielding Tape is documented in supplier technical literature as an electrically conductive, conformable pressure-sensitive tape configured for EMI shielding and grounding in electronic enclosures. The tape consists of a metallized nonwoven carrier and a conductive acrylic adhesive; the liner is removed immediately before lamination or die-cut part placement. The nonwoven carrier is intended to provide a continuous X-Y conductive path while permitting elongation and recovery along ribs, bosses, and enclosure seams that would cause work-hardening cracks in foil-backed constructions. The material is not a structural fastener or environmental seal; it is a conductive interface layer whose performance depends on substrate cleanliness, applied pressure, and the presence of a continuous grounding return path.

    Representative values from supplier data sheets are summarized below. Acceptable lot-to-lot ranges should be obtained from the current 3M technical data sheet because thickness and adhesion are measured on conditioned samples at 23 ± 2°C and 50 ± 5% RH per ASTM D3652 and ASTM D3330. The table below consolidates typical published values applicable to CN-4190.

    Representative published specifications for 3M CN-4190
    Total tape thickness0.10 mm typicalASTM D3652-16
    Surface resistivity≤ 0.05 Ω/sqASTM D257
    Peel adhesion to stainless steel8–12 N/25 mm after short dwellASTM D3330 / PSTC-101
    Shielding effectiveness60–80 dB from 30 MHz–1 GHzASTM D4935-18 planar fixture
    Continuous service temperature−40°C to 85°C; short-term excursion requires validationSupplier TDS; end-product validation

    Shielding effectiveness is a fixture-dependent measurement.

    Electrical performance is not solely an intrinsic property of the tape; it is a function of fixture geometry, return-path impedance, and clamping force. The surface resistivity measurement under ASTM D257 uses a four-point probe and applies a direct-current excitation that may not represent radio-frequency current distribution in a production enclosure. Shielding effectiveness values generated under ASTM D4935-18 are referenced to planar material samples and do not account for aperture radiation, cable penetrations, or gasket compression set. Product-level verification under IEEE Std 299-2006 is therefore required before a design is released. In addition, published data for CN-4190 shielding effectiveness above 1 GHz in non-planar configurations is limited; designers may need to evaluate installed parts using a reverberation chamber or a cell conforming to IEC 61000-4-21.

    What Governs Adhesive Wet-Out on Textured Nickel-Plated and Passivated Surfaces?

    The conductive acrylic is pressure-sensitive, so bond formation is a viscoelastic flow process. On a cast-aluminum housing with a surface roughness of Ra 1.6–3.2 µm, wet-out requires a dwell time of 24–48 h to reach stable peel values; initial tack may be as low as 60% of final adhesion. Lamination pressure from a 60 Shore A silicone nip roll at 0.2–0.4 MPa improves adhesive penetration into surface microvoids but does not compensate for contamination. Alkaline cleaning residues, silane conversion coatings, and amide-based mold release agents reduce peel adhesion by up to 50% in production trials; adhesion coupons should be pulled after 20 min and 72 h to detect slow wet-out failures. Substrates with low surface energy or heavy passivation should be pre-tested with the actual production lot because conductive acrylic adhesion is sensitive to oxidation and surface mobile species.

    Rotary die-cutting of CN-4190 is performed with a semi-rotary press using a kiss-cut depth that penetrates the tape and adhesive but leaves the release liner intact. Tooling wear is lower than with foil-backed shielding tapes because the nonwoven carrier abrades steel rule dies less aggressively; however, liner nicks remain a leading cause of web breaks on roll-fed placements. In contract-converting operations, reducing die strike depth from 100 µm to 85–90 µm on a 0.10 mm tape stack has eliminated liner fracture while maintaining clean part ejection. Parts are then transferred by cassettes or tape-and-reel to pick-and-place heads with vacuum grippers; delamination from the liner is controlled by adjusting peel angle to 140–160° and by using dual-lane liners for narrow parts. This is an area where process data generated on the actual CN-4190 liner grade is critical, because liner adhesion is affected by die-cut edge quality and by dwell time in humid assembly areas.

    When the Enclosure Joint Must Carry Return Current Across a Split Ground Plane

    In split-ground designs, the tape is positioned between the module shroud and the main printed circuit board ground pad; the joint is then compressed by screws or spring contacts. The contact resistance of the tape is below the surface resistivity of the carrier only when clamping pressure exceeds the threshold needed to collapse the nonwoven porosity. For a compression pad of 5 mm × 5 mm, a load of 15–25 N is generally in the useful range; below that, Z-axis conduction may be dominated by the adhesive layer and not by the carrier. Thermal cycling from −40°C to 85°C can reduce compression stress through adhesive creep; thermoplastic enclosure bosses lose preload and the joint resistance can rise in as few as 500–1,000 cycles. Published data for this specific configuration is limited, so production validation should include contact-resistance measurement before and after thermal shock per IEC 60068-2-14. A joint that cannot maintain the minimum clamping load should be redesigned with a higher-compliance conductive gasket rather than relying on CN-4190.

    Comparative Position Against Foil-Backed and Transfer-Tape Constructions

    CN-4190 differs from copper-foil shielding tapes such as 3M 1181 in the way the carrier distributes current and mechanical strain. Foil-backed tapes provide a continuous low-impedance conductor, but they have limited elongation and can crease on non-planar geometry; once the foil work-hardens and fractures, shielding effectiveness drops at high frequencies where current concentrates at the crack edges. The nonwoven carrier of CN-4190 tolerates compound curvature and die-cut part handling but has higher surface resistivity than a wrought copper foil. It is therefore selected where moderate shielding and reliable conformability outrank maximum shielding.

    Electrically conductive transfer tapes are substantially different: they contain no metalized carrier and provide grounding through the adhesive thickness, often with lower sheet conductivity and limited in-plane shielding. CN-4190 may be used as the ground-plane bridge where a transfer tape would compress into the adhesive without maintaining the shield across a seam.

    Selection factors for CN-4190 relative to alternative shielding-tape families
    AttributeCN-4190Copper foil tapeConductive transfer tape
    Carrier typeCu/Ni metalized nonwovenWrought or embossed copper foilNone
    ConformabilityHigh; suitable for ribs and drafted wallsLow to moderate; crease riskHigh but no in-plane shielding
    Typical surface resistivity≤ 0.05 Ω/sq≤ 0.01 Ω/sq for wrought foilAdhesive-dependent; often higher
    Typical shielding roleModerate broadband shielding and groundingMaximum shielding on flat seamsGround-pad bonding, not shielding
    Process behaviorLow tool wear, liner-sensitive kiss-cuttingHigher tool wear; thin foil may require polished diesLiner transfer, no carrier to cut

    Operational boundaries are specific. The tape is not formulated as a weather seal; exposure to condensing humidity, salt spray, or continuous outdoor UV will degrade the nonwoven carrier and can accelerate galvanic corrosion where it contacts dissimilar metals. When used with aluminum substrates in high-humidity environments, the joint should be protected by a conformal coating or an elastomeric gasket that prevents direct moisture ingress. Do not combine the conductive acrylic with solvent-based cleaners containing methyl ethyl ketone or toluene prior to bonding; these solvents can plasticize the pressure-sensitive adhesive and lower peel adhesion. Storage conditions are typically 10–30°C and 35–65% RH in the original sealed liner; shelf-life after opening is shortened by liner curl and moisture uptake.

    From the regulatory matrix, supplier documentation generally declares compliance with RoHS Directive 2011/65/EU as amended by (EU) 2015/863 and with REACH Regulation (EC) No 1907/2006; customer-specific SVHC disclosure should be requested from the manufacturer. Flammability classification is not a substitute for end-product approval; enclosure-level testing per IEC 62368-1 or EN 62368-1 is normally required. The tape is not a primary EMC gasket and should not replace a compressible conductive elastomer in seams that require more than 25% closure force retention after environmental cycling.

    Top