| HS Code | 652701 |
| Manufacturer | 3M |
| Product Name | 3M 5180 General Purpose PTFE Skived Film Tape |
| Product Number | 5180 |
| Tape Type | PTFE Skived Film Tape |
| Backing Material | PTFE (Polytetrafluoroethylene) Skived Film |
| Adhesive Type | Silicone |
| Color | Gray |
| Total Thickness | 3.5 mil (0.089 mm) |
| Backing Thickness | 2.0 mil (0.051 mm) |
| Adhesive Thickness | 1.5 mil (0.038 mm) |
| Tensile Strength | 30 lb/in (525 N/100 mm) |
| Elongation At Break | 150% |
| Adhesion To Steel | 25 oz/in (2.7 N/10 mm) |
| Temperature Range | -100°F to 500°F (-73°C to 260°C) |
| Dielectric Strength | 5,000 V |
| Chemical Resistance | Excellent |
| Low Friction | Yes |
| Standard Length | 36 yd (33 m) |
| Core Diameter | 3 in |
As an accredited 3M 5180 General Purpose PTFE Skived Film Tapes factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.
| Packing | 3M 5180 General Purpose PTFE Skived Film Tape is packaged in cartons of 36 individually wrapped rolls. |
| Container Loading (20′ FCL) | 20′ FCL container loading: palletized 3M 5180 General Purpose PTFE Skived Film Tapes, shrink-wrapped and securely braced for ocean transport. |
| Shipping | 3M 5180 General Purpose PTFE Skived Film Tape is not classified as dangerous goods. Ship in original sealed cartons under dry, ambient conditions, protected from moisture, heat, sunlight, and physical damage. No special DOT, IATA, or IMDG labels/placards are required. Handle rolls carefully to prevent crushing or edge damage. |
| Storage | Store 3M 5180 PTFE Skived Film Tape in its original packaging in a clean, dry, well-ventilated area. Keep away from direct sunlight, heat, moisture, and ignition sources. Maintain moderate room temperature, ideally 15–30°C (60–85°F), and avoid extreme conditions. Protect rolls from crushing, dust, and chemical contamination. Rotate stock and use within the manufacturer’s recommended shelf life. |
| Shelf Life | Shelf life is 24 months from manufacture when stored in original packaging at 21°C and 50% relative humidity. |
In aerospace wire harness shops, 3M 5180 General Purpose PTFE Skived Film Tape is applied as sacrificial anti-chafe wrap over bundled single-core conductors before closure with lacing tape or braided sleeving. The skived PTFE backing provides a low-surface-energy bearing surface that reduces bundle-to-bundle abrasion in unpressurized and engine-pylon zones; the silicone pressure-sensitive adhesive is selected for its ability to remain adhered to fluoropolymer insulation under cyclic temperatures between -54 °C and 180 °C. On the harness bench, the tape is typically traversed with 50–67% butt overlap and applied at a controlled tension of 1.8–4.5 N per 25 mm width. Tension below that band produces lifting at the final flag end, while tension above it induces necking of the 0.076–0.102 mm skived film and reduces the per-layer dielectric withstand margin. Qualification under ASTM D1000-17 includes peel adhesion to stainless steel, dielectric breakdown, and resistance to transformer oil; for aerospace harness work the controlling electrical property is the per-layer dielectric breakdown measured per ASTM D149-20, with manufacturer-published typical values for this product falling in the 7.0–8.0 kV range for a single wrap depending on electrode geometry and relative humidity. The tape is not a substitute for primary wire insulation and must not be used to repair nicked, cut, or arc-tracking wire. In vacuum environments below 10-2 kPa, the silicone PSA can release cyclic siloxane species; when the harness is routed through an unpressurized avionics bay with optical sensors, the outgassing should be screened against ASTM E595-15 total mass loss and collected volatile condensable material limits, and the tape should not be used inside hermetically sealed enclosures without qualification. The PTFE backing exhibits high surface resistivity, typically above 1016 Ω·cm when measured per ASTM D257-14, and it is not antistatic; in fuel-vapour zones, grounding and static dissipation must be provided by the overall harness shield rather than the tape.
The dominant failure mode on horizontal form-fill-seal and vertical form-fill-seal machines is not tensile rupture of the PTFE backing; it is edge lifting at the jaw periphery followed by adhesive transfer to the jaw face. On low-density polyethylene seal stations running at 120–150 °C jaw temperature, dwell times of 0.4–1.0 s, and jaw pressures of 300–600 kPa, a 3M 5180 facing is typically cut 3–6 mm wider than the contact land and wrapped around the jaw edge to prevent polymer melt from penetrating under the adhesive line. The tape’s low kinetic coefficient of friction against molten polyethylene can be characterised by a modified ASTM D1894-14 sled test, but release performance on a production jaw is better judged by measuring 180° peel adhesion to stainless steel per ASTM D3330/D3330M-04 Method A after 20 min dwell; published values for this product generally fall in the 2.0–3.5 N/cm range at 23 °C and 50% relative humidity. On polypropylene seal stations operating above 200 °C, the silicone PSA undergoes progressive hardening within 200–500 cycles; adhesive cohesion rises, clean removal from the jaw diminishes, and edge residue becomes a source of film tear. Cleaning of the jaw edge with methyl ethyl ketone or toluene must be avoided because both solvents swell the silicone PSA and cause edge tack failure. Isopropanol or n-heptane is used for edge wipe-down before tape replacement, and the jaw surface must be free of oxidized polymer deposits below 0.05 mm thickness to maintain alignment. This tape is not a direct food-contact material; on packaging lines, the tape must be positioned so that it does not contact the product and the packaging film remains the only surface in product contact.
Parts routed through electrostatic powder spray booths frequently require masked threads, bearing journals, grounding pins, and mating surfaces before application of thermoset polyester or epoxy powders. The tape is applied in a single wrap with 3–6 mm wide overlap onto the non-coated area, and the leading edge is pressed down with a plastic squeegee rather than a metal blade to avoid skiving a tear line into the PTFE film. During the cure cycle at 190–210 °C for 10–20 min, the silicone PSA is expected to retain its position on steel, aluminium, and nickel-plated substrates, but on zinc-phosphated surfaces with residual process oil the initial peel adhesion can fall below 1.5 N/cm and corner lifting occurs. For powder-coat masking, the controlling test method is ASTM D3330/D3330M-04 Method A, supplemented by a clean-removal check after exposure to 200 °C for 30 min; the backing must not leave PTFE slivers when the tape is removed at room temperature. If removal is attempted while the part is still above 80 °C, the silicone PSA may undergo cohesive splitting and leave a residue that is difficult to detect under a subsequent topcoat. On parts that will receive a conformal coating or adhesion bonding after powder cure, silicone transfer must be checked by a water-break-free surface inspection per ASTM F22-13 because silicone transfer inhibits coating adhesion. The tape is not a replacement for hard masking fixtures on complex geometries with multiple curves; skived PTFE film does not stretch uniformly, and a single wrap across a sharp corner radius below 1.0 mm is prone to splitting. The product must not be used in atmospheres where molten metal droplets impinge directly on the tape, because the PTFE backing degrades under sustained direct flame or arc impingement above 400 °C.
During layer winding of dry-type transformer coils, 3M 5180 is inserted between adjacent copper or aluminium foil layers and between primary and secondary windings as a supplemental dielectric barrier. The tape is applied over the conductor layer with 50–67% overlap and pressed down with a felt or rubber roller; the winding tension is set below 10 N per 25 mm width to avoid cutting through the PTFE film at the corner of rectangular conductors. In this application the dielectric withstand of a single tape layer is evaluated under ASTM D149-20 using short-time voltage rise; manufacturer-published values for the product are on the order of 7.0–8.0 kV per layer, but partial discharge inception voltage depends on the presence of microvoids at the tape-to-conductor interface and on the relative humidity during winding. The surface resistivity of the backing, typically above 1016 Ω·cm per ASTM D257-14, reduces leakage current across the interlayer gap, but the silicone PSA is not a high-temperature thermoset insulating resin and must not be relied upon to fill voids in a cast-coil assembly. UL 1446 recognition applies to the complete insulation system, not to a single tape; use of the tape in a transformer does not by itself confer thermal class 180 or 220 performance. Dry-type transformer manufacturers therefore evaluate the tape in a full insulation system alongside the magnet wire enamel, bobbins, lead wire, and varnish. The tape should not be used in oil-filled transformers unless the silicone PSA has been assessed for compatibility with the insulating oil, because silicone migration can alter the oil’s dielectric dissipation factor and reduce heat transfer in forced-convection designs. For exposed wound cores, the tape edge must be terminated away from high-current connections to prevent the PTFE from acting as a charge accumulation site under partial discharge conditions.
| Application zone | Controlling standard or practice | Controlling property or check | Limiting condition observed on production lines |
|---|---|---|---|
| Aerospace wire harness overwrap | ASTM D1000-17; ASTM D149-20; ASTM E595-15 | Dielectric breakdown, peel adhesion, total mass loss and collected volatile condensable material | Silicone PSA outgassing in vacuum enclosures below 10-2 kPa |
| Heat seal jaw facing | ASTM D3330/D3330M-04 Method A; ASTM D1894-14 | 180° peel adhesion to stainless steel; kinetic coefficient of friction | Edge lifting and adhesive transfer above 200 °C on polypropylene sealing |
| Powder booth masking | ASTM D3330/D3330M-04; ASTM F22-13 | Peel adhesion; water-break-free surface after removal | Cohesive PSA splitting if removed above 80 °C |
| Dry-type transformer interlayer | UL 1446 system testing; ASTM D149-20; ASTM D257-14 | Dielectric withstand, surface resistivity, partial discharge screening | Not a standalone insulation system; silicone migration in oil-filled designs |
| Composite tool edge protection | ASTM D3330/D3330M-04; ASTM F22-13 | Peel adhesion; silicone residue detection | Not permitted on primary bond surfaces |
Composite tooling applications demand a distinction between release media in contact with the uncured matrix and tape used to protect non-bonding tool surfaces. 3M 5180 is acceptable only on tool flanges, vacuum bag seal edges, and tooling locator features where the silicone PSA cannot contact prepreg or adhesive film. The tape is applied to the tool flange at 25 mm width with butt joints no greater than 0.5 mm gap to prevent resin bleed into the joint; if a continuous release surface is required, a separate non-silicone release film must cover the tool face. During an autoclave cure at 180 °C and 586 kPa external pressure, the PTFE backing remains dimensionally stable, but the silicone PSA softens and can migrate by capillary action into adjacent porous tool surfaces. On carbon fiber reinforced epoxy parts, silicone contamination from tape placement near the bond line has been associated with reduced lap shear strength when tested per ASTM D5868-01; the failure is primarily adhesive and occurs at the resin-to-substrate interface. For this reason, the tape is not to be placed inside the vacuum bag against prepreg, peel ply, or release film, and it must not be used as a replacement for FEP or PTFE release film on the tool face. Edge cleanup after tape removal uses isopropanol followed by a water-break-free surface check per ASTM F22-13. The product may be used to hold thermocouple leads on the exterior of a vacuum bag, provided the leads are insulated and the tape does not bridge the bag seal.
A rotary shrink-sleeve sealing drum operating at 180 °C can accumulate low-density polyethylene residue on its circumference after approximately 4–6 h of continuous production. Wrapping the drum with 3M 5180 shifts failure from polymer buildup on the steel surface to periodic tape replacement. The tape is applied helically over the drum with 50–67% overlap and a tail wrapped against the direction of rotation; a butt splice is used only where the drum diameter is large enough to limit bend stress, because smaller diameters develop edge lifting at the butt line under shrinkage tension. The PTFE surface reduces the coefficient of friction against the shrink sleeve film, with dynamic coefficient values commonly falling in the 0.04–0.10 range when measured by ASTM D1894-14 against polyethylene terephthalate film at 23 °C. However, the tape is not antistatic: surface resistivity above 1016 Ω·cm per ASTM D257-14 means that static charge generated by film transport is not dissipated through the tape. If the shrink sleeve machine operates above 60 m/min, electrostatic discharge can produce sparking near the drum unless the machine frame and rollers are separately grounded. The silicone PSA at the tape edges accumulates airborne dust and film slip agents; edge contamination must be wiped away with isopropanol before retensioning. This wrap is not intended for direct contact with food products.
Applying the tape to mold cavity sidewalls and flash grooves reduces the demolding force required for sulfur-cured NBR and EPDM compounds. The tape is affixed to clean mold steel that has been degreased with isopropanol; skived PTFE film is then burnished with a felt pad to remove entrapped air at the adhesive line. Mold temperatures remain within 150–180 °C for typical compression cycles of 5–15 min, which is below the thermal degradation threshold of the silicone PSA but high enough to cause gradual adhesive hardening over repeated cycles. In production, the tape is replaced every 15–30 cycles or whenever edge lift exceeds 1.0 mm; adhesive transfer to the mold must be removed immediately because cured silicone particles can become embedded in the rubber part surface. The low surface energy of the PTFE backing reduces mechanical interlock with mold fouling, but the tensile elongation of the skived film is limited, so deep draws, sharp lips, and undercuts may split the tape. Release force is not fully predicted by ASTM D3330 peel adhesion; mold release performance also depends on compound cure exotherm, zinc stearate migration, and parting line geometry. When the molded rubber parts are subsequently painted or bonded, the tape must be confined to non-sealing surfaces and all silicone residue must be checked by ASTM F22-13 water-break-free testing before finishing. In injection molding of rubber or peroxide-cured silicone compounds, the tape should not be used directly on the parting line where high injection pressure can distort the film.
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3M 5180 General Purpose PTFE Skived Film Tape is a single-sided pressure-sensitive adhesive construction in which a rotary-skived polytetrafluoroethylene backing is combined with a silicone adhesive system. The product is supplied at a nominal total thickness of 0.10 mm (4.0 mil), divided into a 0.076 mm (3.0 mil) unfilled PTFE backing and a 0.025 mm (1.0 mil) silicone adhesive layer. Peel adhesion to stainless steel is typically reported as 25 oz/in when tested per ASTM D3330, and the continuous service temperature range is stated as -73 °C to 260 °C. The exposed PTFE surface has a surface energy below 19 mN/m and a dynamic coefficient of friction against polished steel commonly reported between 0.05 and 0.10. These characteristics position the tape for release surfaces, heat-sealing die protection, electrical insulation, and low-friction roller wrapping where the operating temperature would degrade acrylic or polyethylene adhesive systems.
PTFE is not melt-processable in the manner of polyethylene terephthalate or polyimide; therefore, the backing cannot be cast or melt-blown into the same thin, void-free format. The skiving process machines a continuous layer from a sintered PTFE billet under controlled tool geometry and billet crystallinity. This method results in a dense, non-porous film with relatively uniform thickness and no paste-extrusion processing aid. Relative to paste-extruded PTFE film, a skived backing generally contains fewer microvoids, which improves dielectric continuity and reduces the path for moisture ingress in wrapped conductor applications. The unfilled PTFE layer also exhibits a low dissipation factor and stable dielectric constant across a broad frequency range, properties that are relevant when the tape is used as phase-to-ground barrier material in lower-voltage coil and harness assemblies.
In comparison with filled PTFE film tapes, 3M 5180 contains no glass, carbon, or ceramic filler. This absence of filler improves dielectric uniformity and keeps the coefficient of friction low, but it reduces creep resistance and thermal conductivity under sustained mechanical load. Compared with a polyimide-backed silicone tape of equivalent adhesive thickness, the PTFE surface provides a lower-energy release face and better resistance to wetting by molten polymer films, although polyimide tape may exhibit higher puncture resistance and lower cold-flow under compression. These differences are significant when a design requires repeated release cycles rather than tensile load transfer.
On hot-bar sealing equipment, the product is placed over the sealing jaw or platen to prevent molten polyethylene or polypropylene from building up on the metal surface. Typical hot-bar sealers operate with jaw setpoints between 150 °C and 220 °C, dwell times below 2 s, and jaw pressures from 0.1 MPa to 0.4 MPa. Under these conditions, the PTFE backing remains non-wetting and the silicone adhesive maintains adhesion to the heated jaw if the backing-to-adhesive interface is not subjected to repeated steam exposure or abrasive wipe-off. Published data for this specific configuration is limited, but field operation on flexible packaging lines places the highest stress at the edge of the sealing platen, where high unit pressure and thermal oxidation combine to initiate adhesive charring before backing failure.
The stated continuous service temperature of 260 °C is not a structural rating; it is a thermally driven boundary above which the PTFE backing begins measurable degradation, and the silicone adhesive can crosslink further and lose pressure-sensitive tack. PTFE thermal decomposition accelerates above 260 °C, generating fluorine-containing decomposition products. Local exhaust ventilation is therefore required when the tape is used in a process that can exceed the service limit, particularly in enclosed ovens or around heated induction coils. Silicone pressure-sensitive adhesives are selected for this product because they retain higher lap shear and peel performance at 150 °C to 200 °C than most acrylic alternatives, but they may release low-molecular-weight siloxane species during extended thermal exposure. Applications involving optical lenses, relay contacts, or silicone-sensitive paint booths should qualify the tape against end-use contamination protocols before volume introduction.
Dielectric performance is thickness-dependent. The manufacturer’s published dielectric strength for this construction is commonly reported as 8 kV per ASTM D149, but breakdown values are sensitive to specimen preparation, electrode geometry, and the presence of trapped air between tape layers. When the tape is applied as half-lapped wrap over bare copper conductor, the overlap region creates two backing thicknesses and an adhesive interlayer; the system-level dielectric rating must be established by the end product test rather than by a single-layer film measurement. For electrical insulation components, the relevant compliance path is often UL 510, though recognition status depends on the exact thickness, slitting configuration, and conversion location.
Surface preparation affects silicone adhesive wet-out. On clean stainless steel, the specified peel adhesion is 25 oz/in, but surface oils, oxide scales, or residual mold release can reduce adhesion below this value. Wiping the substrate with high-purity isopropanol and allowing full evaporation before tape application is standard preparation for bench-level bonding. For production-scale roller wrapping, ground or hard-chromed rollers with surface roughness in the range of Ra 0.2 µm to Ra 0.4 µm are generally specified to limit air entrapment and to provide a uniform adhesive thickness under the tape. Full-width lamination pressure should be applied with a single pass of a compliant roller at a controlled nip force rather than by hand pressing, because hand pressure variability produces batch-to-batch differences in peel adhesion and release layer life.
The PTFE backing resists many acids, bases, ketones, esters, and aliphatic hydrocarbons. The silicone adhesive, however, is the limiting barrier. Immersion in toluene, xylene, or aromatic naphtha can swell the silicone network and reduce peel adhesion over time. Continuous immersion beyond 24 h in strong aromatic solvents should be qualified for the specific concentration and temperature; the backing itself is highly resistant, but adhesive lift at the exposed edge can initiate channeling and release-layer failure. In contrast, short-term splash exposure or intermittent wipedown with aliphatic solvents typically produces minimal property loss because the adhesive remains below the PTFE surface. Long-term immersion in chlorinated solvents should also be evaluated because solvent diffusion into the adhesive may disrupt its bond to the fluoropolymer surface.
The tape is not recommended for contact with molten alkali metals or elemental fluorine. PTFE reacts with sodium, potassium, and other alkali metals at elevated temperature, and the adhesive layer will decompose rapidly if exposed to strong oxidative fluorinating agents. Process use near welding plasma, corona treatment, or open flame requires shielding of the adhesive edge. The thermal expansion of unfilled PTFE is typically between 100 × 10⁻⁶ K⁻¹ and 160 × 10⁻⁶ K⁻¹, an order of magnitude higher than steel. When the tape is applied over metal rollers or flat plates that undergo rapid thermal cycling, differential expansion can induce buckling or edge curling. For this reason, the tape should not be installed under high tension on cylindrical rollers that will be cycled between ambient and 200 °C; it should instead be applied with minimal stored stretch and, where possible, anchored at the roll ends by mechanical clamps or end-collar retention.
Relative to ultrahigh-molecular-weight polyethylene release tape, the PTFE backing extends continuous thermal capability from roughly 82 °C to 260 °C, but UHMW polyethylene may provide better abrasion resistance in sliding-contact applications that do not involve elevated temperature. Relative to a filled PTFE tape, the unfilled 5180 construction has lower dielectric loss and a lower coefficient of friction, but also lower dimensional stability under compression. In wire-harness bundle wrap, the tape is applied as a half-lap spiral with the silicone adhesive contacting the insulated conductor or connector backshell. The function is not only dielectric reinforcement but also abrasion protection and release from adjacent bundles. The tape is not a structural splice material; its pressure-sensitive adhesive shear strength is finite, and wrapped terminations should not rely on the tape as a primary mechanical restraint.
The following values are drawn from publicly available manufacturer technical data and represent typical properties rather than maximum or minimum specification limits. Lot-to-lot variation should be expected within the test method reproducibility limits.
| Property | Nominal value | Reference method |
|---|---|---|
| Total tape thickness | 0.10 mm (4.0 mil) | ASTM D3652 |
| PTFE backing thickness | 0.076 mm (3.0 mil) | ASTM D3652 |
| Silicone adhesive thickness | 0.025 mm (1.0 mil) | ASTM D3652 |
| Peel adhesion to stainless steel | 25 oz/in | ASTM D3330 |
| Continuous service temperature | -73 °C to 260 °C | Manufacturer TDS |
| Dielectric strength | 8 kV | ASTM D149 |
In addition to the physical values above, the product is typically supplied under manufacturer declarations for Regulation (EC) No 1907/2006 and Directive 2011/65/EU as amended by (EU) 2015/863. These declarations are version-controlled and should be reconfirmed against the current manufacturer certificate before the product is used in a controlled article. The PTFE resin component falls under the general class of perfluorocarbon resins addressed by FDA 21 CFR 177.1550, but the completed tape with silicone adhesive is not automatically food-contact approved. End users intending to place the tape in direct food contact or in medical device applications must conduct their own migration, cytotoxicity, and extraction assessments under the applicable regulatory framework.
For cleanroom or vacuum-system use, silicone adhesive outgassing data should be requested from the manufacturer or qualified per ASTM E595 if the tape will be placed inside a sealed volume. Residual low-molecular-weight siloxane content can vary by production lot, particularly after high-temperature oven conditioning. If the tape is used as a release surface on composite mold tooling, the mold surface should be cleaned of fluoropolymer transfer residue during tool maintenance, because successive heat cycles can transfer thin PTFE wear debris into the tool surface and reduce subsequent bondline adhesion of the composite part. This constraint applies especially to autoclave processing above 180 °C, where the combination of vacuum bag pressure and thermal expansion can cause skived PTFE film to conform against tool radii and leave residue at sharp corners after demolding.