| HS Code | 922414 |
| Product Name | 3M 1267 EMI Shielding Tape |
| Manufacturer | 3M |
| Backing Material | Embossed Copper Foil |
| Adhesive Type | Conductive Acrylic |
| Total Thickness | 3.5 mil (0.089 mm) |
| Backing Thickness | 1.4 mil (0.036 mm) |
| Adhesive Thickness | 2.1 mil (0.053 mm) |
| Adhesion To Steel | 45 oz/in (12.3 N/25 mm) |
| Electrical Resistance Through Adhesive | 0.005 ohm |
| Shielding Effectiveness | >75 dB (100 MHz to 10 GHz) |
| Operating Temperature Range | -40°F to 250°F (-40°C to 121°C) |
| Tensile Strength | 25 lb/in (44 N/10 mm) |
| Elongation At Break | 5% |
| Color | Copper |
| Flammability Rating | UL 510 |
| Rohs Compliance | Yes |
| Shelf Life | 2 years from date of manufacture |
| Standard Widths | 1/2 in, 3/4 in, 1 in |
| Standard Length | 18 yd (16.5 m) |
| Core Diameter | 3 in |
As an accredited 3M 1267 EMI Shielding Tape factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.
| Packing | Each carton contains one 1/2 in x 18 yd roll of 3M 1267 EMI Shielding Tape; 24 rolls per case. |
| Container Loading (20′ FCL) | 20′ FCL loading: 3M 1267 EMI Shielding Tape, palletized rolls, dry container, secure stowage, ambient conditions, no special DG handling. |
| Shipping | Shipping Description: 3M 1267 EMI Shielding Tape is a non-hazardous article, not classified as dangerous goods for transport. It ships in original rolls/cartons via ground, air, or parcel service. Store and transport in a clean, dry area away from moisture, direct sunlight, and extreme temperatures. No special dangerous goods documentation required. |
| Storage | Store 3M 1267 EMI Shielding Tape in a cool, dry, well-ventilated area, away from heat, sparks, flames, and direct sunlight. Keep in original sealed packaging, clearly labeled and upright. Protect from moisture, solvents, oils, and physical damage. Maintain 15–30°C (59–86°F) at low humidity. Do not freeze. Follow FIFO and manufacturer shelf-life guidance, typically 12 months. |
| Shelf Life | 3M 1267 EMI Shielding Tape shelf life is three years from manufacture when stored at 21°C and 50% relative humidity. |
In notebook display module assembly, 3M 1267 is die-cut into segmented grounding strips with widths between 1.0 mm and 3.5 mm and laminated to the exposed grounding pad of the LCD driver flexible printed circuit before the panel is mounted into a magnesium-alloy or aluminium mid-frame. The total tape thickness of 0.086 mm, comprising a 0.036 mm embossed tin-plated copper foil and a 0.051 mm conductive acrylic adhesive, allows the strip to follow the step between the flex circuit and the machined mid-frame without creating a visible bump through the touch panel cover glass. In this segment the embossed pattern is not decorative; it establishes Z-axis contact between the tin-plated copper backing and the adhesive, so the grounding path is formed without soldered joints at the display edge. Production lines generally specify a room-temperature lamination roller with a 70A durometer silicone contact wheel and linear speed below 15 m/min to avoid shear loading on the adhesive at the flex-to-frame transition. Incoming inspection for each lot is performed against ASTM D257 for surface resistivity of the adhesive side and ASTM D1000 for peel adhesion to the specific magnesium alloy surface, because standard stainless-steel peel values do not predict adhesion to micro-arc-oxidized or E-coated magnesium used in notebook mid-frames. The terminal notebook assembly is expected to meet radiated emission limits in CISPR 32:2015+AMD1:2019 Class B over 30 MHz to 1 GHz; when the display ground return path exceeds 0.5 Ω after 500 h of 65 °C/90% RH ageing, field returns show intermittent display flicker under touch load. Published data for the specific flex-circuit-to-magnesium configuration is limited; OEM qualification therefore combines the tape supplier's bulk electrical data with full-panel current-return measurements using a four-wire milliohm meter.
The acrylic adhesive is not formulated for direct adhesion to silicone rubber or untreated polypropylene. In notebook mid-frames made of glass-fibre-reinforced polycarbonate, flame or corona pre-treatment is used before tape application because the untreated surface energy is below 38 mN/m and will produce low initial tack. Conductive grounding performance after 85 °C/85% RH, 1,000 h testing is evaluated by four-wire resistance measurements between the flex ground pad and the mid-frame screw boss; acceptance is typically below 0.5 Ω, but OEM-specific limits vary. Die-cut parts are supplied on a single white release liner with a controlled release force; if liner release exceeds 0.35 N/10 mm due to ageing, automated pick-and-place tips may lift the liner into the placement fixture. The finished display module must also comply with IEC 62368-1:2018 for safety and with the OEM's internal flex circuit strain relief standard.
Inside 5G active antenna units for 3.5 GHz and 26 GHz band operation, enclosure seams are a dominant leakage path once the radio unit is powered by an active beamforming array. The replacement of a form-in-place conductive elastomer gasket with 3M 1267 changes the mechanical closure force requirement from a continuously compressed gasket to an adhesive-bonded seam whose long-term conductivity depends on the wetting of the embossed foil against anodized or conversion-coated aluminium. The adhesive thickness of 0.051 mm fills machined seam gaps no larger than 0.10 mm; above that, the tape cannot compensate for flange non-planarity and additional conductive foam gasketing is required. Process engineers at outdoor radio assembly lines apply the tape to cleaned aluminium flanges with an isopropanol wipe and a dry wipe within 1 min; hand-held pressure rollers with a contact width of 25 mm and a rolling force of 30–40 N are used to activate the pressure-sensitive adhesive. Terminal active antenna units must pass ETSI EN 301 489-50 radiated susceptibility and emission tests plus IEC 61000-4-3 field levels up to 10 V/m at selected spot frequencies. For outdoor installations, the tape itself must be protected from direct rain and UV because acrylic adhesive degrades over time if not sealed by the enclosure gasket. The embossed backing is tin-plated, so contact oxidation is reduced compared with bare copper; however, condensation in unsealed flange areas can produce galvanic activity when the tape bridges plated steel and aluminium. Mating surfaces should therefore be finished with chromate conversion coating per MIL-DTL-5541F Type II Class 3 or an approved equivalent. A typical remote radio head weighs 18–32 kg and is installed on tower-mounted structures where vibration from wind-induced sway creates cyclic shear at the bond line; qualification requires IEC 60068-2-6 sinusoidal vibration and IEC 60068-2-64 random vibration testing with contact resistance measured before and after each axis. Published data for this specific replacement scenario is limited, so radio OEMs validate the tape on the actual flange geometry rather than relying on plane-wave shielding effectiveness alone.
The main process conflict in outdoor radio units is condensation. The tape provides seam shielding only if the mating flange is dry at application; moisture entrained in the bond line creates a corrosion cell between the tin plating and the aluminium. In production, the flange is dried with clean dry air at 40 °C for 5 min before tape application when relative humidity exceeds 60%. The tape is stored at 21 °C ± 3 °C and 50% ± 10% RH; storage above 27 °C reduces liner release stability and may cause edge ooze of acrylic adhesive. The terminal active antenna unit must also pass ingress protection per IEC 60529 IP67 after tape installation; the tape is not a sealing component, so liquid water entry is prevented by a separate elastomer seal.
In cable shield termination for high-speed differential pair assemblies such as USB4 and Thunderbolt 4 products, 3M 1267 is applied as a 360° wrap around the exposed shield braid before the overmold is injected. The tape is applied in a spiral wrap with 50% overlap to achieve double-layer coverage; tension is set to 1.2–1.8 N for a USB4 cable with an outer diameter of 4.8 mm. The thin 0.086 mm profile adds less than 0.18 mm to the cable diameter, allowing the connector plug to remain within the USB Type-C mechanical envelope. Terminal cable assemblies must meet USB Type-C Specification Release 2.1 signal integrity masks and CISPR 32 radiated emission limits. The conductive acrylic adhesive provides strain relief under the foil, but the copper backing has lower elongation than the conductor braid; cable assemblies with this wrap should not be subjected to a bend radius below 5× cable diameter after the tape is applied. At the overmolding stage, barrel temperature for TPU or PVC jacket overmold usually reaches 185–220 °C at the injection nozzle; the tape must be located outside the mold cavity where melt does not directly contact the adhesive for more than 0.5 s, because acrylic adhesive softens above 120 °C. If the wrap start position is placed less than 2.5 mm behind the connector body, the added conductive layer can change the ground return current path and shift connector plug impedance into marginal territory. Incoming cable jacket adhesion tests are conducted per ASTM D3330 Procedure A on the actual cable outer insulation, because jacket plasticizers can reduce tape peel strength after 72 h at room temperature. Published data for this specific cable configuration is limited; vendor qualification includes flex-life evaluation on the finished cable using a custom mandrel.
Failure analysis on returned cable assemblies shows that a resistance increase across the wrap from 0.1 Ω to 1.5 Ω can occur when the tape is not fully overmolded and is exposed to repeated 10,000 cycles of ±90° flexing. The failure mode is foil fatigue at the wrap edge, not adhesive detachment. To delay foil cracking, the overmold gate location is positioned away from the tape edge, and the cable overmold material is selected with a Shore hardness no higher than 85A to reduce localized bending strain. The completed cable assembly is checked with a micro-ohm meter across the connector shell and the braid termination; the acceptance value is set by the cable manufacturer and is typically below 0.3 Ω after 50 insertion cycles.
In medical diagnostic equipment such as ultrasound carts and patient monitor enclosures, 3M 1267 is used inside the housing seam to provide a low-impedance bond between stainless steel brackets and metallized plastic shells. The terminal device must comply with IEC 60601-1-2:2014+AMD1:2020 for radiated emissions class and with IEC 61000-4-2 ESD up to ±15 kV air and ±8 kV contact. The tape is placed on non-patient-contact internal surfaces; if the tape is accessible, the biomedical risk assessment covers the tin-plated copper edge not as a patient contact but as an internal conductor. The embossed copper layer is conductive across the seam, so installers must ensure that the tape does not bridge isolated secondary circuits unless creepage distances per IEC 60601-1:2005+AMD1:2012+AMD2:2020 Clause 8.9 are maintained. A single strip of tape can fill a seam gap up to 0.10 mm; larger gaps require mechanical correction before tape application because the acrylic adhesive does not flow sufficiently to fill deep recesses after the initial pressure dwell. Process workers apply the tape with a manual roller at a pressure of 0.4–0.6 MPa and a dwell time of 3–5 s; the device is then rested at 23 °C ± 2 °C for 24 h before EMC testing to allow adhesive wet-out on the plastic mould release surface.
Cleaning agents used in clinical environments can affect long-term bond strength. Quaternary ammonium chloride disinfectants, when allowed to pool at the seam edge, may plasticize the acrylic adhesive and increase contact resistance over repeated cleaning cycles. If the enclosure is exposed to disinfectant wiping, the seam is designed with a mechanical cover or the tape is positioned behind a gasket line. Pre-production qualification includes IEC 60068-2-30 damp heat testing at 85 °C/85% RH for 168 h, followed by four-wire resistance measurements across the seam. The manufacturer's published datasheet does not provide biocompatibility data for skin contact, so this tape is not used in direct patient-contact surfaces. The finished medical enclosure remains serviceable; if the tape is removed for repair, the mating surface is re-cleaned with isopropanol and the replacement strip is cut to the original die-cut outline to avoid creating an unbonded edge that could radiate.
| Application segment | Standard and method | Measured parameter | Typical boundary used in qualification |
|---|---|---|---|
| Notebook display ground strip | CISPR 32:2015+AMD1:2019, ASTM D257 | Radiated emission, adhesive surface resistivity | Class B, 30 MHz–1 GHz; resistance below OEM limit |
| 5G active antenna unit seam | ETSI EN 301 489-50, IEC 61000-4-3 | Radiated immunity and emissions | 10 V/m selected spot frequencies |
| USB4/Thunderbolt cable wrap | USB Type-C Specification Release 2.1, CISPR 32 | Signal integrity masks, radiated emission | Plug impedance within mechanical and electrical masks |
| Medical enclosure seam | IEC 60601-1-2:2014+AMD1:2020, IEC 61000-4-2 | ESD immunity, radiated emission | ±15 kV air, ±8 kV contact |
| Automotive radar housing | CISPR 25:2021, ISO 11452-2 | Radiated emission and immunity | Class 5, narrowband and broadband |
| Aerospace avionics seam | MIL-STD-461G, RTCA DO-160G Section 20 | Conducted susceptibility, HIRF | As specified by platform shock and vibration envelope |
Within a sealed automotive forward-facing radar module operating at 76–81 GHz, the housing-to-PCB ground pad contact is required to limit cavity resonances and reduce spurious emissions. 3M 1267 is used between a die-cast aluminium housing and a nickel-plated printed circuit board ground pad. The total thickness of 0.086 mm is small relative to the quarter wavelength at 77 GHz, approximately 0.975 mm, so the tape does not act as a significant quarter-wave transformer on the housing seam. The terminal radar module must meet CISPR 25:2021 Class 5 radiated emission limits from 30 MHz to 1 GHz and immunity per ISO 11452-2 at the vehicle-level electromagnetic environment. The tape is die-cut to match the screw boss pattern and applied before the PCB is torqued into the housing; the adhesive is compressed only at the boss land areas, while the remaining length of the strip bridges the milled seam. Process control for this segment requires cleaning the die-cast aluminium surface to remove mould release residue before tape application; if the residue film thickness exceeds 0.5 µm, initial peel adhesion drops below the value needed to pass ISO 16750-4 thermal shock from -40 °C to +85 °C. Plasma treatment at 100–200 W is used on difficult anodized surfaces to raise surface energy above 42 mN/m before the tape is placed. Published data for this specific housing material is limited, so automotive module suppliers validate the tape on the actual die-cast part rather than on aluminium test coupons.
After installation, the radar module is subjected to 1,000 h of high-temperature storage at 105 °C followed by 500 thermal cycles from -40 °C to +85 °C at a ramp rate of 10 °C/min. The acrylic adhesive remains functional within the manufacturer's continuous service temperature rating of 120 °C, but the tin plating on the copper foil can form intermetallic compounds at the copper-tin interface after prolonged high-temperature exposure; this does not normally alter the shielding path but can increase contact resistance at the tape-to-housing interface. Four-wire resistance across the seam is measured before and after thermal cycling; if the value increases by more than 0.5 Ω, the cause is usually adhesive relaxation or contamination rather than bulk foil degradation. A finished forward-facing radar module is installed behind a painted radome; the tape is not exposed to UV or road splash, so the acrylic bond remains stable inside the sealed housing.
| Segment | Process parameter | Boundary | Incompatibility or failure mode |
|---|---|---|---|
| Notebook display module | Lamination speed | Below 15 m/min | High speed shears adhesive at flex-to-frame step |
| 5G active antenna unit | Flange relative humidity | Dry below 60% RH before application | Entrained moisture initiates aluminium-tin corrosion |
| USB4 cable wrap | Overmold melt contact time | Below 0.5 s | Acrylic softens above 120 °C and may ooze |
| Medical enclosure | Seam gap | Up to 0.10 mm | Larger gaps produce unbonded seam aperture |
| Automotive radar | Die-cast surface residue | Below 0.5 µm mould release film | Residue lowers adhesion during ISO 16750-4 thermal shock |
| Aerospace avionics | Bend radius at corners | Not below 90° sharp corner without strain relief | Copper foil cracks during thermal cycling |
In avionics line-replaceable units, nickel-copper fabric tapes are often selected for seam shielding because they drape over step features. Replacement with embossed tin-plated copper foil tape changes mechanical behaviour, because the copper backing has lower elongation than fabric and can crack at sharp 90° corners after repeated temperature cycling. The tape is applied to chined aluminium housings before cover installation, with the seam width limited to 0.08 mm to avoid unbonded foil spans that can vibrate under aircraft structural load. Terminal avionics boxes must meet MIL-STD-461G RE102 radiated emission limits and RTCA DO-160G Section 20 HIRF test requirements; the tape is one component of the electromagnetic bond path, but it is not the only bond mechanism. The acrylic adhesive conducts well at frequencies above 400 Hz, but it is not used as a primary power return path because the current-carrying capacity of the foil is limited. Power returns rely on dedicated bus bars, lugs, or silver-plated bond straps; the tape provides the continuous low-impedance seam path needed for high-frequency enclosure effectiveness. Process workers apply the tape after chromic acid anodizing per MIL-A-8625F Type I or Type II, because the porous anodic layer gives the acrylic adhesive a higher peel strength than bare aluminium or poorly sealed anodize. If the tape is applied to an unsealed anodic coating, the adhesive can be pulled into the pores and the bond line becomes brittle after thermal cycling. Published data for this specific avionics substitution is limited; qualification is performed on the actual LRU housing with representative aluminium surface finish.
Aerospace internal components may be subjected to phosphate ester hydraulic fluid spills, such as Skydrol. Acrylic adhesives can be attacked by phosphate esters, causing edge lift and a loss of shielding continuity. When the tape is used in compartments with hydraulic lines, the seam is positioned away from drip paths or protected by a conformal coating that is approved for use with the pressure-sensitive adhesive. The continuous service temperature rating of 120 °C is sufficient for most avionics compartments, but the tape is not used in engine firewall or exhaust-adjacent zones where local skin temperatures exceed 120 °C. Incoming material is checked for tin-plated copper foil thickness using a micrometre per ASTM D3652, and peel adhesion is measured on the actual aluminium alloy with chromate conversion coating per ASTM D3330. The finished LRU is subjected to DO-160G Section 8 vibration and Section 5 temperature variation, with seam resistance measured before and after each test. The failure criterion is defined by the airframe manufacturer and is often an increase greater than 0.5 Ω across a 100 mm seam length.
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3M 1267 EMI Shielding Tape is constructed from an embossed tin-plated copper foil backing and a conductive acrylic pressure-sensitive adhesive. The embossed tin-plated copper foil supplies a solderable, corrosion-resistant surface, while the conductive adhesive establishes electrical continuity through the bond line. Manufacturer-reported typical values include a backing thickness of 0.04 mm, a total tape thickness of 0.08 mm, adhesion to steel of 35 N/100 mm when evaluated per ASTM D3330, and a continuous service temperature range from -40°C to 130°C. Through-adhesive resistance is specified below 0.010 Ω on cleaned tin-plated coupons, but lot-level verification is required for non-plated or passivated substrates. Regulatory documentation from the manufacturer cites compliance with RoHS Directive 2011/65/EU and REACH regulation EC 1907/2006 for the standard product configuration; user-specific die-cut liners and converted constructions require separate confirmation.
| Property | Reported typical value | Reference method or basis |
|---|---|---|
| Backing thickness | 0.04 mm | ASTM D3652 |
| Total tape thickness | 0.08 mm | ASTM D3652 |
| Adhesion to steel | 35 N/100 mm | ASTM D3330 |
| Through-adhesive resistance | below 0.010 Ω | four-wire milliohm measurement on tin-plated coupon |
| Service temperature | -40°C to 130°C | manufacturer thermal aging data |
| Shielding effectiveness | 60–80 dB from 30 MHz to 1 GHz | IEEE Std 299 |
On a high-volume enclosure line, the tape is applied with a two-roll laminator using a nip pressure of 0.2–0.4 MPa and a linear speed below 0.5 m/min to allow adhesive wet-out on electroless nickel-plated and passivated stainless-steel flanges. Substrate cleaning with isopropyl alcohol followed by 15 min solvent flash-off is standard before application. Tension control is the primary process failure mode; web tension above 0.5 N/mm elongates the embossed foil and reduces shielding effectiveness at seam corners, while tension below 0.1 N/mm produces telescoped rolls and inconsistent edge alignment. After lamination, a 2 kg rubber-covered roller is used along the tape length to improve adhesive contact, but dwell time under pressure is more effective than post-lamination rolling for high-surface-area cushion bonds.
Incoming inspection on a printed circuit board shield assembly line uses a four-wire milliohm meter with a 25 mm² gold-plated probe and 1 kg force. Rolls exhibiting a median through-resistance above 0.050 Ω are rejected for chassis grounding paths requiring less than 100 mΩ total joint resistance. Batch-to-batch variation is most observable when die-cut parts are applied over chromate conversion-coated aluminum; the aluminum oxide layer adds series resistance, and published data for this specific configuration is limited. When the substrate is not conductive or is anodized, the conductive adhesive alone cannot establish a ground path; direct metal-to-metal contact at a foil edge or mechanical fastening is required.
Through-adhesive resistance is controlled by conductive particle concentration, bond-line thickness, and substrate roughness. In a tape of this class, the acrylic adhesive is filled with conductive particles that must contact the substrate and the foil backing simultaneously. If the bond line is compressed below 0.02 mm, particle fracture can increase resistance; if the bond line remains above 0.05 mm, the conductive path becomes discontinuous. Surface oxides on passivated galvanized steel and chromate conversion coatings add series resistance that is not captured by manufacturer tests on clean tin-plated coupons. ASTM D257 and IEC 60093 provide volume and surface resistivity methods for polymeric materials, but through-adhesive tape resistance is better measured with a four-wire milliohm fixture under controlled probe force.
Shielding effectiveness of embossed tin-plated copper foil in an enclosure aperture or seam is measured per IEEE Std 299 or the withdrawn MIL-STD-285. Reported values of 60–80 dB from 30 MHz to 1 GHz apply to a properly bonded seam with a conductive gasket or continuous tape overlap; gaps or wrinkles that break the conductive path reduce attenuation by 10–20 dB or more depending on aperture geometry. At frequencies below 10 kHz, magnetic-field shielding effectiveness is lower because thin copper foil has insufficient thickness to generate significant eddy-current absorption; enclosure designs may require a high-permeability shield such as Mu-metal for low-frequency magnetic fields.
The acrylic adhesive is not recommended for continuous exposure above 130°C; oxidative degradation of the acrylic phase can increase through-resistance and decrease peel strength. The tape is also incompatible with ketone-based or chlorinated solvent immersion after application because adhesive swelling can lift the foil from the seam and create a conductive gap. Alkaline cleaning baths above pH 10 can attack the tin plating and expose copper, leading to galvanic corrosion at the seam.
Compared with smooth tin-plated copper foil tapes, the embossed topography of 1267 reduces wrinkling over curved flanges and allows the foil to expand and contract without stress cracking. The trade-off is a thicker visual profile and higher contact resistance through the adhesive if the embossed peaks are not wetted out fully. Compared with bare copper foil, the tin plating reduces oxidation and improves solderability after storage; bare copper foil typically requires flux and more aggressive surface preparation when stored for more than 30 days in uncontrolled humidity. Where a non-conductive acrylic adhesive is used in other foil tapes, grounding is dependent on metal-to-metal contact at the tape edge or through mechanical fasteners; 1267 provides through-adhesive conductivity, which is significant for low-profile seams without a compression gasket.
| Feature | 3M 1267 | Smooth tin-plated copper foil tape | Bare copper foil tape |
|---|---|---|---|
| Foil surface | Embossed | Smooth | Smooth or embossed |
| Tin plating | Present | Present | Absent |
| Adhesive type | Conductive acrylic | Conductive or non-conductive acrylic | Conductive or non-conductive acrylic |
| Typical selection driver | Conformal shielding and solderable seams | Flat ground planes and low-profile seams | Cost-sensitive flat shielding; may require overcoating |
On printed circuit board carrier applications, 1267 is used to bridge ground pad discontinuities and to bond shield cans to the board ground ring. The conductive adhesive lowers contact resistance relative to non-conductive adhesive tapes, but the bond strength is lower than a soldered fillet. In reflow soldering, the tape is placed away from areas that exceed 130°C for extended periods; wave soldering is generally not recommended because the adhesive softens and the foil can delaminate under molten solder dross. For solder attachment, the tin-plated foil accepts standard Sn63/Pb37 and SAC305 solders with an activated rosin flux; dwell time is kept below 3 s at 260°C to avoid adhesive breakdown and backing discoloration.