| HS Code | 192964 |
| Manufacturer | 3M |
| Product Name | 3M 1170 EMI Shielding Tape |
| Product Type | EMI Shielding Tape |
| Backing Material | Copper Foil |
| Adhesive Type | Conductive Acrylic |
| Total Thickness | 3.5 mil (0.089 mm) |
| Backing Thickness | 1.4 mil (0.036 mm) |
| Adhesive Thickness | 2.1 mil (0.053 mm) |
| Standard Width | 0.5 in (12.7 mm) |
| Standard Length | 18 yd (16.5 m) |
| Color | Copper |
| Operating Temperature Range | -40°F to 221°F (-40°C to 105°C) |
| Electrical Resistance | 0.1 ohms |
| Shielding Effectiveness | 70 dB up to 1 GHz |
| Flame Retardant | Yes |
| Rohs Compliant | Yes |
| Shelf Life | 24 months |
| Liner Material | Silicone Coated Paper |
As an accredited 3M 1170 EMI Shielding Tape factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.
| Packing | 3M 1170 EMI Shielding Tape: one 1-inch by 18-yard roll per sealed bag, one roll per carton. |
| Container Loading (20′ FCL) | 3M 1170 EMI Shielding Tape in original packaging, palletized and secured in a clean, dry 20′ FCL container for transport. |
| Shipping | 3M 1170 EMI Shielding Tape is not classified as dangerous goods for transportation. It can generally be shipped as non-hazardous cargo under DOT, IATA, and IMDG regulations. No UN number, hazard class, packing group, or special shipping label is normally required. Keep dry and protect from damage. |
| Storage | Store 3M 1170 EMI Shielding Tape in a cool, dry, well-ventilated area away from direct sunlight, heat, moisture, and ignition sources. Keep sealed in original packaging, upright, at 15–27°C (60–80°F) and 40–60% relative humidity. Avoid acids, alkalis, oxidizers, and physical damage. Rotate stock and follow SDS for shelf life. |
| Shelf Life | Shelf life is 5 years from date of manufacture when stored in original packaging at 21°C (70°F) and 50% RH. |
Display module grounding in handheld devices uses 3M 1170 as a die-cut shielding layer on chip-on-film ground tails, antenna feed-line transitions, and touch digitizer ground tabs in flagship smartphones, tablet backlight units, and wearable charging bay flex assemblies. The product is a single-faced copper foil shielding tape with a total thickness of 0.071 mm, comprising a 0.035 mm copper carrier and a 0.036 mm conductive acrylic pressure-sensitive adhesive. For high-volume production, the tape-to-flex coverage ratio is maintained between 1.2:1 and 1.5:1 relative to the ground trace width; this ratio places the copper edge beyond the stiffener bend zone and reduces delamination initiation while retaining a four-wire Kelvin joint resistance below 0.05 Ω after 24 h dwell at 23 °C and 50% RH. Adhesive bond area on exposed copper pads is held above 85%, and kiss-cut strip widths range from 0.8 mm to 3.2 mm with a dimensional tolerance of ±0.1 mm. Compliance is evaluated under FCC Part 15 Subpart B Class B and CISPR 32:2015 Class B, using radiated emission scans from 30 MHz to 13 GHz in a 3 m semi-anechoic chamber with dual-antenna polarization per ANSI C63.4:2014. The production lamination process uses closed-cell silicone rubber rollers of 60–70 Shore A hardness, nip pressure of 0.25–0.40 MPa, and feed speed of 1.5–2.5 m/min; reel-change copper foil butt splices are rejected within 3 mm on each side because the splice creates an impedance discontinuity at gigahertz frequencies. Finished devices include display driver IC shields, touch panel grounding tails, and antenna feed wraps for mobile transceivers operating in the sub-6 gigahertz and millimeter-wave bands.
In diagnostic medical enclosures, 3M 1170 is used as an internal fixed seam closure on aluminum die-cast and nickel-plated magnesium frames; it is not used as a primary insulation barrier. The governing standard is IEC 60601-1-2:2014, with essential performance verified against the electromagnetic disturbance test levels applied at enclosure, patient-coupled, and signal input/output ports. On a cast aluminum patient monitor housing with a 0.2 mm seam gap, the tape is applied in 25 mm wide strips over the entire internal seam, yielding a 100% perimeter closure ratio. Corner intersections carry an overlap of 5 mm, and the adhesive-to-substrate contact fraction must exceed 95% after plasma treatment. The substrate is prepared by atmospheric plasma to a surface energy above 44 mN/m; silicone release residue is removed with a 70/30 isopropyl alcohol/water blend before tape application. Total tape area is limited to 10–15% of the internal enclosure surface to avoid parasitic capacitance shifts at high-impedance electrocardiogram front-end inputs. The production process uses automated tape placement followed by a pressure roller at 0.35 MPa and a 24 h dwell period at 23 ± 2 °C before immunity testing. Terminal equipment includes portable ultrasound systems, patient monitors, infusion pump controllers, and pulse oximeter docking stations. The table below summarizes the compliance matrix for the enclosure shield path.
| Electromagnetic port | Standard reference | Test level | Conductive tape seam criterion |
|---|---|---|---|
| Enclosure electrostatic discharge | IEC 61000-4-2:2008 | ±8 kV contact, ±15 kV air | Seam resistance <0.05 Ω; no processor upset |
| Radiated immunity | IEC 61000-4-3:2020 | 80 MHz–2.7 GHz, 10 V/m | No loss of essential performance; edge lift ≤1 mm |
| Conducted immunity | IEC 61000-4-6:2013 | 0.15–80 MHz, 6 V rms | Joint resistance shift ≤10 mΩ |
| Radiated emission | CISPR 32:2015 Class B | 30 MHz–6 GHz | Aperture leakage below limit; bond area ≥95% |
Within 77 GHz radar transceiver enclosures and battery management system controllers, 3M 1170 is converted into perimeter gasket-shaped parts on a rotary die with a kiss-cut tolerance of ±0.1 mm; a four-axis pick-and-place module removes the release liner and verifies adhesive transfer by vacuum sensor feedback. The edge shielding ratio is controlled by comparing tape width to flange width: for a 2.0 mm machined aluminum flange, the nominal tape width is 4.0 mm, giving a 2:1 width ratio and leaving 1.0 mm of bonded conductive adhesive on each flange face. This approach produces 100% seam coverage on enclosures required to pass CISPR 25:2021 Class 5 radiated and conducted emissions from 150 kHz to 2.5 GHz, and ISO 11452-4:2020 bulk current injection with a closed-loop levelling of 60 mA over 1 MHz–400 MHz. After die cutting, heat-assisted lamination at 40–45 °C for 10–15 s reduces copper foil elongation on concave radii below 4 mm; adhesion is verified by 180° peel on stainless steel panels after 72 h at 70 °C and 95% RH, with peel values not falling below 7.0 N/10 mm. Conformal coating is not applied directly over the copper foil edge unless the edge has been passivated with an organic solderability preservative. Terminal finished products include ADAS front radar sensors, lidar mounting brackets, battery management unit housings, electric power steering controllers, and telematics gateways; edge lift greater than 3 mm after 1000 thermal shock cycles from -40 °C to 85 °C triggers retaping and requalification.
On carbon-fiber-reinforced polymer avionics enclosures, 3M 1170 is laminated only after abrasive surface preparation removes mold release agent and raises surface energy above 46 mN/m. The copper tape is applied over shielding seams with an overlap of 6 mm, and the tape edges are subsequently overpainted with a nickel-filled conductive sealant to prevent galvanic coupling between copper foil and exposed graphite fibers. The lap-joining ratio for ground strap terminations is not less than 50% of the strap width embedded under the tape on each side, and the tape-to-substrate contact area must exceed 95%. For a fixed installation, MIL-STD-461G requires CE102 conducted emissions evaluation from 10 kHz to 10 MHz and RE102 radiated emissions evaluation from 10 kHz to 18 GHz; the taped seam shall not increase enclosure aperture leakage by more than 3 dB when measured before and after random vibration per MIL-STD-810H Method 514.8. Process panels are cut by laser plotter to avoid burr formation, then applied at 23 ± 2 °C with a hand roller at 0.4 MPa; vacuum-bag lamination is prohibited because copper foil deforms over countersunk fasteners and produces low-spot adhesive voiding. The terminal assemblies include flight control computers, radar warning receiver modules, tactical satellite communication modems, and UAV GPS-disciplined oscillator enclosures. For unshielded plastic connector backshells, the tape is used as a wrap over braided shield termination with a 50% helical overlap before heat-shrink jacketing. The verification matrix below records the shielding seam dispositions for the relevant aerospace electromagnetic compatibility requirements.
| Aerospace verification port | Standard / method | Frequency / level | Tape shielding seam disposition |
|---|---|---|---|
| Conducted emissions CE102 | MIL-STD-461G | 10 kHz–10 MHz | 6 mm overlap; joint resistance <0.05 Ω |
| Radiated emissions RE102 | MIL-STD-461G | 10 kHz–18 GHz | Aperture leakage increase ≤3 dB after Method 514.8 vibration |
| RF susceptibility | RTCA DO-160G Section 20 | 100 MHz–18 GHz | No control disturbance; edge seal intact |
| Environmental vibration | MIL-STD-810H Method 514.8 | Composite fixture random profile | No delamination >2 mm from edge |
Because 5G remote radio unit housings are subjected to repeated thermal expansion from -40 °C to 85 °C, 3M 1170 is installed with a 0.5 mm prestretch along its longitudinal axis before lamination to reduce buckling between the printed circuit board carrier and die-cast aluminum heat sink. The helical wrapping ratio for internal power and RF cable bundles is 50%, producing a double-thickness copper conductor at every circumferential point; flat seam closure uses 6 mm wide tape over a 2 mm gap, with an additional 3 mm bond margin on each side. Compliance testing follows GR-1089-CORE Issue 7 for telecommunications equipment and EN 300 386 V2.1.1 for electromagnetic compatibility; emissions are evaluated per CISPR 32:2015 Class A from 30 MHz to 6 GHz, and radiated immunity follows IEC 61000-4-3:2020. The production application uses a motorized tape wrapping head with tension control set to 2.5–4.0 N; tension outside this range produces copper foil necking and adhesive starvation. After application, the tape is burnished with a 3 mm radius polyethylene burnishing rod at 0.2 m/s to remove trapped air, then inspected by automated optical inspection at 0.1 mm/pixel to detect edge voids larger than 0.5 mm. Terminal products include 5G massive MIMO radio units, baseband unit line cards, optical transceiver cages, and indoor DAS remote nodes; all tape seams are electrically mapped with a four-wire Kelvin probe after enclosure closure to confirm that no seam resistance exceeds 0.05 Ω.
For industrial variable-frequency drive cabinets and servo drive enclosures, 3M 1170 is used to close fixed ventilation slot apertures and to bond mounting flanges before the parent metal surface receives powder coating. The slot closure ratio is calculated as the tape width divided by the aperture width: a 2.5 mm aperture requires a 5.0 mm tape strip, giving a 2:1 closure ratio, with 1.25 mm of edge overlap on each side pressed into a deburred steel substrate. The tape is not a substitute for bonded conductive gasket material on access doors; it is used only on fixed interior seams and cable shield breakouts. Compliance is assessed under EN 61800-3:2017 Category C3 for adjustable-speed electrical power drive systems and EN 61000-6-4:2018 for conducted emissions in industrial environments; radiated emissions are measured up to 1 GHz using CISPR 11:2015 Class A methods. Application on polyester powder-coated panels is permitted only after adhesion promotion with a silane-based primer or corona treatment, because the acrylic conductive adhesive does not reliably wet the cross-linked coating surface; the dyne level after treatment must exceed 42 mN/m. The tape is laminated with a 50 Shore A silicone rubber roller at 0.3 MPa and held at 20–25 °C for 72 h before the cabinet is shipped. Terminal products include vector-control frequency inverters, multi-axis servo drive racks, PLC-based motor control centers, and process analytical power panels; for unfiltered drives with long motor cables, tape-based seam shielding reduces slot leakage only if the motor cable armor is bonded to the same ground plane. Published comparative data for this specific configuration after +85 °C dry heat aging for 1000 h is limited.
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3M 1170 EMI Shielding Tape is a single-sided pressure-sensitive conductive tape consisting of a 0.0356 mm tin-plated copper foil backing and a 0.0356 mm electrically conductive acrylic adhesive layer. The nominal total thickness is 0.071 mm, and the product is supplied in log rolls with widths from 6.35 mm to 609.6 mm. The tin-plated copper surface provides a solderable and oxidation-resistant outer layer, while the acrylic adhesive contains conductive particles to establish through-bond electrical continuity after application. Typical uses include grounding of flexible display circuits, shielding of seam gaps in sheet-metal enclosures, static drain connection on telecom line cards, and shield-can edge termination. Compliance documentation from the manufacturer lists the product under RoHS 2011/65/EU and provides REACH SVHC status according to the current candidate list.
| Property | Value | Method |
|---|---|---|
| Backing thickness | 0.0356 mm (0.0014 in) | ASTM D3652 |
| Adhesive thickness | 0.0356 mm (0.0014 in) | ASTM D3652 |
| Total thickness | 0.071 mm (0.0028 in) | ASTM D3652 |
| Peel adhesion to stainless steel | 4.9 N/10 mm (45 oz/in) | ASTM D3330/3330M |
| Tensile strength | 61 N/10 mm (35 lb/in) | ASTM D3759 |
| Elongation at break | 6% | ASTM D3759 |
| Maximum continuous operating temperature | 155 °C | Manufacturer data |
| Minimum application temperature | -40 °C | Manufacturer data |
| Through-adhesive resistance | <0.01 Ω per 1 in² overlap | Manufacturer method based on MIL-STD-202G Method 307 |
| Storage life | 24 months from ship date | Manufacturer data at 21 °C, 50% RH |
The values in the table are manufacturer-published typical properties, not batch specifications. Lot-to-lot variation in conductive adhesive particle loading can affect through-adhesive resistance, and qualification programmes should require certificate of analysis documentation when the tape is used on safety-critical or flight hardware.
Surface preparation involves a final wipe with isopropanol and full solvent evaporation before tape placement. Residual solvent can become trapped at the adhesive–substrate interface and create a high-impedance gap. The tape is applied with a roller or lamination nip because hand pressure alone may not generate sufficient contact force to collapse conductive particles into the substrate. Maximum peel adhesion develops after approximately 24 h at 23 °C as the acrylic flows into surface roughness. Automated placement on high-volume lines uses kiss-cut parts on a polyester liner; conversion with copper foil requires vacuum hold-down tooling to prevent folding of the 0.071 mm backing.
Through-adhesive resistance is governed by the percolation network of conductive filler particles in the acrylic matrix. During application, compression brings the particles into temporary contact with the substrate and the foil backing. Subsequent adhesive relaxation can reduce contact force and increase resistance if the substrate is rough or if the joint is subjected to thermal cycling. The manufacturer’s quoted value of <0.01 Ω across a 1 in² lap is a contact-resistance measurement, not a bulk material resistivity. Under 85 °C/85% RH ageing, the tin-plated copper backing resists oxide formation better than bare copper, but the acrylic network can absorb moisture. This may produce reversible swelling and a small increase in through-adhesive resistance. The practical upper operational boundary is 155 °C continuous; above this, oxidative chain scission in the acrylic permanently degrades both adhesion and conductive contact. The product is therefore not a replacement for solder or welded joints where continuous current exceeds the tape’s current-carrying capacity. Published current-rating data for this specific tape configuration is limited; the manufacturer does not specify a continuous current limit for the adhesive layer.
Compared with 3M 1181, which uses a bare copper foil backing, 3M 1170 substitutes a tin electrodeposit over the copper. The tin layer prevents rapid copper oxidation at the visible surface and permits direct solder wetting. In side-by-side comparison, a bare copper tape may show contact-resistance drift after 500 h at 85 °C/85% RH, whereas the tin-plated variant retains lower and more stable seam contact because tin oxide is thinner and disrupted more easily under mechanical wipe. However, tin plating is not galvanically compatible with aluminium in marine salt-spray environments. When attached to a 6061-T6 aluminium chassis, the copper-tin-aluminium couple can promote galvanic corrosion if the seam is not conformal coated. Designers should specify a non-conductive acrylic overcoat or polyurethane conformal coating after application in such environments. The manufacturer’s published salt-spray data for this specific geometry is limited; qualification under IEC 60068-2-52 or MIL-STD-810H Method 509.6 is therefore recommended before production release.
In automated assembly lines, die-cut 3M 1170 parts are placed by pick-and-place heads using vacuum cups. The 0.071 mm total thickness requires stiffener tabs or liners to prevent folding during transfer. Slitting blades must be sharp; a dull blade produces foil burrs that can bridge adjacent PCB traces. The roll is stored at 21 °C and 50% RH; exposure at 40 °C for more than 2 weeks can accelerate acrylic adhesive oxidation and reduce tack. For high-volume lines, the tape is kiss-cut onto a polyester liner and supplied as die-cut islands. Liner release force must be verified on downstream equipment because an excessively high release force can cause cohesive failure of the adhesive during liner removal.
Unlike embossed tapes such as 3M 1345 or 3M 1245, 3M 1170 uses a flat tin-plated copper backing. The flat foil minimises joint thickness, which is critical for slim-line enclosures and for maintaining a consistent ground plane under a shield can. Embossed tapes provide greater conformability over uneven surfaces and repeated peel stress, but they are thicker and may leave visible step heights. 3M 1170 is therefore selected when the substrate is flat or has gentle curvature, while embossed tapes are selected for complex die-cut shapes with bosses or irregular castings. The solder termination capability of 3M 1170 is limited by the acrylic adhesive below the foil. Soldering-iron tip temperatures of 315 °C to 370 °C can create local adhesive degradation after 2–3 s. Solder operations should use a temperature-controlled iron and a flux compatible with tin-plated copper. Reflow ovens with peak temperatures above 240 °C are incompatible with the tape unless the tape is added after reflow.
Thermal cycling from -40 °C to 85 °C can be applied after the tape has reached full adhesion. The acrylic adhesive has a low-temperature modulus increase below -40 °C, which reduces peel strength and can make initial application difficult without warming the substrate. The tape should not be applied to plasticised PVC cable jackets or surfaces coated with free silicone mould release. Plasticiser and silicone migration into the acrylic reduce peel adhesion and interfere with conductive-particle contact. Polyolefin, polyimide, and aluminium substrates are generally compatible. For seams that must be opened repeatedly, a conductive gasket with spring compression may provide more repeatable shielding; tape is preferred for permanent or low-cycle seams.
System-level shielding effectiveness of a seam treated with 3M 1170 is dominated by aperture geometry, seam length, and bonding impedance rather than by the intrinsic tape material. The tape reduces slot-antenna leakage when it bridges a seam. Planar shielding-effectiveness values for copper foil-backed tapes are reported in the range of 80 dB to 100 dB from 30 MHz to 1 GHz under ASTM D4935 planar material tests, but the installed value may be lower. Radiated-emission performance is not guaranteed by the tape alone; enclosure resonance and cable coupling dominate above 1 GHz. Compliance testing should be performed on the completed enclosure under the applicable standard, such as CISPR 32:2015 or MIL-STD-461G, because the tape cannot be characterised as a standalone EMI fix.
The product carries no independent UL electrical insulation rating. It is a conductive tape and must not be used where electrical isolation is required. The adhesive is not crosslinked and will creep under sustained peel load above 60 °C. Mechanical fasteners or clamps are required when the tape is used on load-bearing seams. The tape is compatible with conformal coating over-application after adhesion is fully developed, but coating solvents should be tested for compatibility with the acrylic adhesive before production use.