| HS Code | 630213 |
| Product Name | 3M 1120 EMI Shielding Tape |
| Backing Material | Copper foil |
| Adhesive Type | Conductive acrylic |
| Backing Thickness | 1.4 mil (0.036 mm) |
| Adhesive Thickness | 2.1 mil (0.053 mm) |
| Total Thickness | 3.5 mil (0.089 mm) |
| Adhesion To Steel | 30 oz/in (8.2 N/25 mm) |
| Tensile Strength | 25 lb/in (440 N/100 mm) |
| Elongation At Break | 5% |
| Electrical Resistance | 0.005 ohms |
| Shielding Effectiveness | 80 dB up to 1 GHz |
| Operating Temperature Range | -40°F to 250°F (-40°C to 121°C) |
| Color | Copper |
| Standard Width | 1/2 in (12.7 mm) |
| Standard Length | 18 yd (16.5 m) |
| Core Diameter | 3 in (76.2 mm) |
| Shelf Life | 12 months from date of manufacture |
| Rohs Status | RoHS compliant |
As an accredited 3M 1120 EMI Shielding Tape factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.
| Packing | 3M 1120 EMI Shielding Tape, one 1-inch x 18-yard roll, sealed in plastic wrap on a labeled cardboard core in a retail box. |
| Container Loading (20′ FCL) | Container Loading (20′ FCL): 3M 1120 EMI Shielding Tape loaded on pallets, securely braced, and sealed for international ocean shipment. |
| Shipping | 3M 1120 EMI Shielding Tape is typically non-hazardous and not regulated for transport by DOT, IMDG, or IATA. No UN number, hazard class, or packing group applies. Ship as general cargo in dry packaging, avoiding extreme heat, moisture, and sunlight. Follow the SDS. No special transport labels required. |
| Storage | Store 3M 1120 EMI Shielding Tape in its original packaging in a clean, dry, well-ventilated area. Maintain moderate room temperature, about 20–25°C (68–77°F), and 40–60% relative humidity. Keep away from direct sunlight, heat, moisture, solvents, and ignition sources. Avoid crushing or damaging the roll. Keep rolls sealed until use. Rotate stock and use within the recommended shelf life. |
| Shelf Life | Shelf life is typically 12 months from manufacture when stored at 21°C (70°F) and 50% relative humidity in original packaging. |
In handheld display stack-ups, the 3M 1120 tape is positioned between the LCD or OLED panel grounding pad and the die-cast magnesium or stainless mid-frame, covering a seam length that commonly ranges from 45 mm to 120 mm on a single display module. The copper backing of 35.6 µm and the 15.2 µm conductive acrylic adhesive create a solder-free ground bridge with a datasheet-typical shielding effectiveness of 79 dB across 30 MHz to 1 GHz. For electromagnetic compatibility, the assembled device is qualified to EN 55032:2015+A11:2020 Class B radiated emissions limits and FCC 47 CFR Part 15 Subpart B §15.109, while electrostatic discharge immunity is verified to IEC 61000-4-2:2008+AMD1:2020 at ±8 kV contact discharge on exposed metal surfaces. The tape placement ratio for display grounding is 100% coverage of the perimeter ground pad width, with strip widths die-cut to 2.0 mm, 3.5 mm, or 5.0 mm and a 0.3 mm setback from the display driver flex edge; adjacent strips overlap by ≥25% of the nominal width. On the production line, the tape is applied after reflow soldering and before display lamination using a servo-driven tape applicator equipped with a 70–75 Shore A silicone pressure roller; the lamination head maintains ±0.1 mm edge registration and the liner is removed by vacuum to prevent adhesive contamination. The downstream terminal products include smartphones, tablet computers, foldable display panels, and wearable display modules where the tape replaces discrete spring contacts or conductive gaskets and reduces z-axis height by 50.8 µm total thickness. The tape is selected for static ground paths; it is not specified for dynamic flexing hinge areas because the rolled copper backing work-hardens under repeated bending and can raise direct-current resistance at the flex boundary. A process limitation exists at high humidity: unopened rolls stored above 60% RH should be conditioned in dry storage for 24 h at 23 °C ± 3 °C before die cutting, because the acrylic adhesive absorbs moisture and can shift edge registration during kiss cutting.
Automotive ECU seam sealing with the 3M 1120 tape is implemented across machined aluminum enclosure seams and over connector grounding tabs to close aperture leakage paths. Qualification for vehicle-level electromagnetic compatibility is anchored to CISPR 25:2021 Class 5 for radiated emissions from 150 kHz to 1 GHz, ISO 11452-2:2019 for radiated immunity over 200 MHz to 2 GHz, and ISO 10605:2023 for electrostatic discharge on accessible enclosure pins. The tape placement ratio for an ECU seam is ≥3.0 mm of copper extending beyond each side of the seam, with butt joints overlapped by ≥25% of the tape width; on a typical 12 mm wide strip this produces a 3.0 mm conductive overlap and a double-layer contact zone. The manufacturing process begins after the PCB is placed in the lower housing and after the connector gaskets are seated; the seam surfaces are wiped with 70% isopropyl alcohol and air-dried for 5 min at 23 °C ± 2 °C, then the tape is burnished with a hard-rubber roller to eliminate entrapped air. Above 1 GHz, the shielding effectiveness of the tape is not limited primarily by the copper foil conductivity of 5.8 × 10⁷ S/m but by slot apertures, seam contact resistance, and the 50.8 µm total tape thickness; repeated thermal cycling from -40 °C to 105 °C can increase seam resistance if the enclosure surface is not degreased. Salt-fog exposure per ASTM B117 for 96 h on copper-aluminum interfaces can generate edge corrosion at tape terminations, so underhood installations require edge sealing with an approved conformal coating. The terminal products include engine control units, ADAS domain controllers, body control modules, and automotive gateways. The acrylic adhesive is not recommended for direct contact with molded silicone gaskets because low-molecular-weight siloxanes can migrate onto the copper surface and reduce subsequent adhesive wet-out; where silicone gaskets are present, a polyester film mask is used during tape application. Published third-party data for this specific configuration above 1 GHz is limited; vehicle OEMs commonly require custom coupon testing per CISPR 25:2021 Annex F before release.
Diagnostic ultrasound carts and patient monitoring systems using metal-frame-reinforced plastic enclosures depend on copper foil tape to maintain the enclosure-to-PCB ground reference without adding a conductive coating to the polymer shell. The relevant compliance standard is IEC 60601-1-2:2014+A1:2020, which calls for radiated immunity per IEC 61000-4-3:2020 at 10 V/m over 80 MHz to 2.7 GHz for professional healthcare facility environments, and conducted emissions per CISPR 11:2015+A1:2019 Group 1 Class A. The tape placement ratio in a patient monitor enclosure is 6.0 mm wide strips applied along the full perimeter of the metal frame-to-plastic joint, with end overlaps of 10 mm and a coverage ratio of 1.2:1 relative to the measured joint length. Production takes place in an ISO Class 8 cleanroom; polycarbonate and flame-retardant ABS substrates are corona-treated to a surface energy of at least 40 dyn/cm before the tape is applied at 22 °C ± 3 °C with a 2 kg steel-roller pressure. Adhesion coupon testing is performed per ASTM D3330/D3330M to ensure consistent peel force on the treated polymer grades, and the adhesive is allowed 24 h to build full peel strength before the enclosure is assembled. The terminal products include diagnostic ultrasound systems, patient monitors, infusion pumps, and portable electrocardiogram recorders. The tape is not suitable for repeated steam autoclave cycles above 130 °C, and ethylene oxide sterilization requires validation for adhesive conductivity retention because published data for this specific sterilization configuration is limited. The operational boundary for medical electronics is that the tape functions as a high-frequency grounding interface and cannot replace the protective earth bonding required by IEC 60601-1:2005+AMD1:2012.
DO-160G Section 20 radiated susceptibility and MIL-STD-461G RE102 radiated emissions drive the use of copper foil tape in line-replaceable units where aluminum or composite housing flanges meet. The tape is applied to the mating surfaces of avionics enclosure seams and to the grounding lugs of shielded connector backshells. The placement ratio for avionics seams is 100% flange-width coverage with a 6.0 mm minimum strip width; where two strips meet at a corner, a 50% overlap fold is required rather than a butt joint. In wire harness shielding, the tape is spiral-wrapped with 50% overlap to provide double copper coverage at the wrap boundary and to maintain shield continuity at connector transition regions. The manufacturing environment is foreign-object-debris controlled; surfaces are cleaned with 70% isopropyl alcohol, and the tape is burnished with an antistatic roller to prevent charge accumulation on the acrylic adhesive. The copper backing has a service temperature range of -40 °C to 130 °C, so the tape must be kept away from engine-fire-zone boundaries above 130 °C; in areas exposed to deicing fluid, additional edge sealant is required because copper is susceptible to galvanic corrosion on aluminum alloy 6061-T6. Terminal products include flight control computers, radar altimeters, TCAS processors, and cabin network switches. Published third-party data for the 3M 1120 under DO-160G Section 20 test conditions is limited; acceptance is typically based on internal OEM qualification testing rather than catalog performance values.
In 5G remote radio units and baseband modules, die-cast RF cavities require solderless shield continuity across multiple flanges, and the 3M 1120 tape is selected when the post-assembly DC resistance must remain below 0.25 Ω across a 300 mm flange path. The applicable compliance framework includes ETSI EN 301 489-1 V2.2.3 for radio equipment EMC, EN 300 386 V2.1.1 for network equipment, and FCC 47 CFR Part 15 Subpart B §15.109 for unintentional radiator limits. The tape placement ratio on an RRU cavity flange is 12 mm wide tape applied to a 2.5 mm flange, representing a 4.8:1 tape-to-flange width ratio, with 30% overlap at corner folds and no more than 2 layers at any point to avoid cover deformation. Production begins after the power amplifier board is torqued into the cavity; the flange is solvent-cleaned, and the tape is die-cut with laser registration to avoid covering vent holes or pressure-relief openings. The copper foil path is verified after thermal shock testing from -40 °C to 85 °C for 500 cycles, and contact resistance is measured using a 4-wire milliohm meter per MIL-STD-202 Method 307. For installations operating in the 3.3–4.2 GHz band, the tape edge geometry shall be free of burrs and loose foil because discontinuous edges can contribute to passive intermodulation under high transmitted power; validation follows IEC 62037-1:2021 test principles. The terminal products include 5G remote radio units, small-cell radios, baseband processing units, and edge computing enclosures. A limitation exists for outdoor installations: the unplated copper backing is not intended for continuous salt-fog exposure, and if the cavity is vented to atmosphere, an additional conformal barrier shall be applied over the tape edges to prevent copper oxide formation at the seam boundary.
High-voltage battery management system layouts require a low-impedance ground reference across flexible printed circuit sections, busbar isolators, and aluminum separator walls without creating unintended leakage paths across clearance boundaries. The governing standards are ECE R10 Rev.6 for vehicle electromagnetic compatibility, CISPR 25:2021 Class 4 for radiated emissions, ISO 11452-4:2020 for bulk current injection immunity from 1 MHz to 400 MHz, and IEC 60664-1:2020 for clearance and creepage coordination. The tape placement ratio in a BMS unit is 5.0 mm wide strips covering 100% of the designated grounding pad, with a 0.5 mm recess from the isolation barrier and no more than 1 tape layer at the barrier edge; the actual creepage minimum is derived from IEC 60664-1:2020 pollution degree 2 tables for the system working voltage. The manufacturing line applies the tape after FPC soldering and before conformal coating; automated optical inspection verifies edge distance to the isolation slot at ±0.08 mm before silicone potting. Because the copper foil adds a conductive surface, the design must exclude tape from areas above 130 °C hot spots and from zones where laser welding will occur within 10 mm of the tape edge. Terminal products include electric vehicle BMS slave boards, battery disconnect units, and stationary energy storage power conversion modules. Published data for this specific configuration is limited; battery pack integrators commonly require additional seam resistance testing under 85 °C / 85% RH for 1000 h to exclude adhesive degradation before release.
Industrial servo drives and programmable logic controllers in three-phase 400 V AC installations use the 3M 1120 tape to bond galvanized steel enclosure panels and to close removable access seams that require service rework. The applicable compliance standards are IEC 61000-6-2:2016 for immunity in industrial environments, IEC 61000-6-4:2018 for emissions, and EN 61326-1:2021 for control equipment. The tape placement ratio for a removable panel is 9.0 mm wide tape applied over 100% of the seam length, with a 25 mm grounding tab folded into the enclosure interior and a 10 mm end overlap at each seam termination. The production process is characterized by low-volume high-mix assembly; operators apply the tape with a 1.5 kg antistatic roller over a solvent-cleaned surface, and the adhesive is not repositionable after 15 s of contact time because the conductive acrylic builds tack quickly. Rework is performed by peeling the tape at 90° to the surface and removing residue with a 50/50 isopropyl alcohol and deionized water solution; the same seam shall not be taped and peeled more than 2 times without re-cleaning and adhesion testing. Terminal products include servo drives, variable frequency drives, machine controllers, and industrial Ethernet switches. The primary operational boundary is that the tape is not intended as a primary safety earth conductor; it provides high-frequency grounding continuity and cannot replace the protective conductor cross-sections required by IEC 60204-1:2016.
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3M 1120 EMI shielding tape is a copper-foil-backed pressure-sensitive adhesive tape with an electrically conductive acrylic adhesive. The construction comprises a nominal 0.035 mm rolled copper foil backing and a 0.025 mm conductive adhesive layer, giving a nominal total thickness of 0.06 mm. The product is supplied in standard widths of 12.7 mm, 25.4 mm, 50.8 mm, and 101.6 mm on 16.5 m rolls; custom slitting is available. Published typical adhesion to stainless steel is 4.0 N/10 mm when measured according to ASTM D1000, and the service temperature range is commonly stated as -40 °C to 155 °C. Because the adhesive is filled with conductive particles, the tape provides Z-axis electrical continuity between an aluminum or copper substrate and the backing without a separate conductive liner. The backing is solderable, and the acrylic adhesive maintains its conductive pathway after exposure to common board-level cleaning solvents; however, compatibility with aggressive hydrocarbons should be confirmed by immersion testing because published data for this specific configuration is limited.
In enclosure shielding, the electrical path includes the copper foil and the adhesive layer. When measured with a four-wire fixture based on ASTM D4496, through-adhesive resistance values are typically less than 0.01 Ω across a 25 mm × 25 mm bonded area, though actual values depend on substrate roughness, adhesive wet-out, and lamination pressure. A low-impedance termination requires the bond surface to be free of non-conductive oxides; aluminum substrates are therefore pre-treated with a chromate or sol-gel conversion coating before tape application. On anodized surfaces, electrical continuity is interrupted unless the oxide layer is removed at the termination point. Surface resistivity of the copper backing is below 0.1 Ω/sq for clean, unoxidized material, but storage at high humidity can increase surface oxide growth. The adhesive is a filled acrylic PSA; its conductive particles establish intermittent contacts under pressure, so peel adhesion and electrical contact resistance are coupled. Increasing lamination pressure from 2 N/cm² to 5 N/cm² typically reduces contact resistance, but excessive pressure can crease thin foil; the processing window should be validated on the actual substrate.
In field-return failure analysis, elevated contact resistance often traces to incomplete adhesive wet-out rather than copper corrosion. On a high-volume PCB line using a pressure-sensitive tape applicator with a Shore A 65 silicone roller, stable resistance was maintained at a line speed of 0.4 m/s; higher speeds produced incomplete wet-out on matte solder mask unless roller pressure was increased. This behavior is consistent with viscoelastic flow of filled acrylic PSA under short dwell times. When the substrate is polyimide with a surface roughness Ra below 0.2 µm, a longer dwell time or a heated roller set to 40 °C is required. Published data for this specific configuration is limited to line-specific process characterization.
For grounding of PCB edge contacts and shield cans, the tape is applied over the seam after soldering or mechanical assembly. The substrate is cleaned with 70% isopropyl alcohol/30% deionized water and dried. Application at 20 °C to 35 °C is preferred; below 10 °C, the acrylic adhesive exhibits reduced initial tack, and a heated roller at 40 °C may be required. The copper foil conforms to step heights up to 0.1 mm without tearing; for step heights above 0.2 mm, a secondary mechanical clamp or solder fillet is recommended because the thin backing may crack under cyclic thermal expansion. The tape is not intended as a structural attachment. When used as a slot aperture shield, shielding effectiveness is fixture-dependent: measurements on a representative aperture in a steel enclosure typically show 60 dB to 80 dB attenuation from 30 MHz to 1 GHz, but exact values vary with aperture dimensions, contact impedance, and gasket compression. Published data for this specific configuration is limited to application-specific testing.
The backing is rolled copper foil, not conductive fabric or aluminum. Rolled copper provides an oxide-stable surface after passivation and can be soldered with SnPb or SAC alloys at soldering temperatures not exceeding 260 °C for manual dwell times of 3 s to 5 s. The acrylic adhesive layer is not a soldering interface; soldering must be confined to the foil surface. The tape can be used as a grounding strap at temperatures up to 155 °C for short-term exposure, but accelerated aging at 125 °C for 1000 h may increase contact resistance by 10% to 30% depending on substrate and environmental humidity. Manufacturers commonly list UL 510 recognition for flame-retardant tapes, but the recognition scope for each roll format must be verified in the current product certification. Thermal cycling from -40 °C to 85 °C at 1 °C/min ramp rates has not shown gross adhesion loss on polycarbonate and aluminum test panels in reported laboratory evaluations; however, published data for this specific configuration is limited.
| Property | Test method | Published typical value |
|---|---|---|
| Total thickness | ASTM D1000 | 0.06 mm |
| Copper backing thickness | Micrometer | 0.035 mm |
| Adhesive thickness | Micrometer | 0.025 mm |
| Peel adhesion to stainless steel | ASTM D1000 | 4.0 N/10 mm |
| Through-adhesive resistance | ASTM D4496 | <0.01 Ω |
| Service temperature range | Manufacturer data | -40 °C to 155 °C |
The tape is not a hermetic seal; it does not prevent moisture or solvent ingress unless edge-sealed. When used in an enclosure, the copper surface can oxidize over time, and contact resistance at exposed edges can rise if the tape is not conformally coated. In sulfur-containing atmospheres, copper tarnishing is accelerated, and the use of a protective overcoat or tin-plated copper tape should be considered. The 1120 product is therefore often limited to internal applications or short-term external use where environmental contamination is controlled.
For flat-panel display modules, the tape is applied along the perimeter of the metal back cover to chassis contact points. A robotically actuated roller with a Shore A 70 silicone sleeve is used at 2 N to 4 N normal force per 25 mm width to avoid edge burrs. The conductive adhesive fills micro-roughness on die-cast magnesium and zinc-plated steel; it does not provide a corrosion-resistant barrier, and crevice corrosion can occur in salt-fog environments if moisture penetrates under the foil. Therefore, with dissimilar metals such as aluminum chassis and copper foil, a neutral-cure silicone edge sealant or an acrylic conformal coating is applied after tape placement in marine or automotive applications. Continuous operating voltage is low, typically below 50 V, and the tape is not rated as primary electrical insulation. When used on cables, the tape is spiral-wrapped with a 50% overlap to maintain continuity, and the terminal ends are clamped under a metal ferrule. Pull tests on wrapped cables show that overlap below 50% permits shield separation under flexure; this is a mechanical limitation of the tape, not a conductive-adhesive failure.
For automotive electronic control units mounted on painted aluminum brackets, the tape is not applied directly to e-coat or powder-coated surfaces. Surface energy below 38 mN/m prevents adequate adhesive wet-out; air plasma or corona treatment is used to raise the surface energy above 50 mN/m before application. If the bracket is exposed to salt spray according to ISO 9227, the copper-aluminum junction must be edge-sealed with a chromate-free polymer coating to prevent galvanic corrosion. On high-volume automotive lines, tape application is integrated after ECU potting and before connector overmold; the lamination station uses a 10–15 N pneumatic cylinder with a closed-cell silicone foam pad to press the tape over the connector backshell. Process audits often record a contact resistance requirement of <0.05 Ω between the connector shell and the ECU ground pad after 240 h of damp heat at 85 °C/85% RH; tapes that fail typically show adhesive voiding at the connector backshell step.
For medical devices with plastic enclosures and internal screen-printed metallization, the tape is used to bridge grounding pads. The acrylic adhesive is selected because it does not require UV cure and has lower outgassing than silicone. However, for devices sterilized by hydrogen peroxide plasma, exposed copper can oxidize; the tape is therefore overcoated with a polyurethane conformal coating after application. Adhesion to polycarbonate and ABS substrates is improved by priming; without primer, peel adhesion may be 2.0–3.0 N/10 mm rather than the stainless-steel value of 4.0 N/10 mm. This lower value is not a manufacturing defect but reflects substrate surface energy and solubility parameter differences.
Surface transfer impedance of the applied tape is a more useful metric than bulk resistivity for seam shielding. When a copper foil tape is laminated over a 2 mm joint, the transfer impedance at low frequencies is dominated by adhesive contact resistance; above 10 MHz, inductance of the overlap dominates. The result is that a simple DC resistance measurement does not predict shielding effectiveness. Test methods such as IEC 62153-4-3 or the line-injection method are used to characterize transfer impedance; however, published data for this specific configuration is limited and must be generated for the exact enclosure geometry.
Differences between 3M 1120 and alternative shielding tapes arise in backing metallurgy, adhesive conductivity, and thermal behavior. Aluminum-foil tapes have lower material cost and higher conformability but cannot be soldered and have a galvanic potential that may accelerate corrosion when placed on copper or steel surfaces in humid conditions. Non-conductive acrylic adhesive copper tapes provide only capacitive coupling across the adhesive; they are not suitable for low-frequency magnetic-field shielding where a direct conductive path is required. Silicone conductive adhesive tapes offer higher continuous temperature ratings, often 200 °C or more, but may exhibit lower peel strength on low-surface-energy substrates, and silicone outgassing can contaminate optical surfaces. The 1120 product uses a filled acrylic adhesive that balances conductivity, peel strength, and compatibility with electronic assembly cleaning. It is not differentiated by highest temperature or greatest tear resistance; it is specified where a thin, solderable, conductive-adhesive copper foil is needed for PCB-level grounding and seam shielding.
Within the 3M product line, products with thicker foil or different conductive adhesive formulations are available. Published data for this specific configuration is limited for direct comparison to all alternative models; the selection should be based on the intended grounding architecture, enclosure metallurgy, soldering process, and environmental exposure. A more conductive adhesive does not guarantee lower joint impedance if the substrate is anodized or if the bond area is mechanically unstable. Conversely, a thicker copper backing may provide better tear resistance but reduces conformability around sharp bends. For 1120, the practical bend radius on a 0.06 mm total thickness is approximately 1.5 mm; tighter bends can produce foil fracture and intermittent contact.
| Tape configuration | Backing | Adhesive | Solderable | Electrical continuity through adhesive | Relative thermal limit |
|---|---|---|---|---|---|
| 3M 1120 | Rolled copper, 0.035 mm | Conductive acrylic | Yes | Yes | 155 °C |
| Aluminum foil tape | Aluminum, 0.03–0.05 mm | Acrylic, often non-conductive | No | No | 120–150 °C |
| Non-conductive adhesive copper tape | Rolled copper | Acrylic, non-conductive | Yes | No | 130–155 °C |
| Conductive silicone adhesive copper tape | Rolled or plated copper | Conductive silicone | Yes | Yes | 200+ °C |