| HS Code | 575195 |
| Product Name | 3D Systems VisiJet M3 X |
| Manufacturer | 3D Systems |
| Material Type | Rigid opaque photopolymer |
| Color | Black |
| Printing Technology | MultiJet Printing (MJP) |
| Printer Compatibility | ProJet 3500 series |
| Support Material | VisiJet S300 |
| Tensile Strength | 48 MPa |
| Tensile Modulus | 2000 MPa |
| Elongation At Break | 10% |
| Flexural Strength | 70 MPa |
| Flexural Modulus | 2200 MPa |
| Hardness | 85 Shore D |
| Izod Impact Strength | 25 J/m |
| Heat Deflection Temperature | 70 °C |
| Density | 1.15 g/cm³ |
| Water Absorption | 0.4% |
| Layer Thickness | 0.1016 mm (0.004 in) |
As an accredited 3D Systems VisiJet M3 X factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.
| Packing | |
| Shipping | |
| Storage |
VisiJet M3 X is an unfilled acrylate-based photopolymer supplied for 3D Systems MultiJet Printing equipment. It is dispensed at 32 µm layer thickness and cured by broadband UV energy inside the build chamber; the designated wax support is removed by thermal liquefaction after the build. Because the material is crosslinked rather than semicrystalline, its downstream response is controlled primarily by heat deflection temperature, residual monomer content, and layerwise anisotropy. Elevated-humidity conditioning, paint adhesion, silicone cure inhibition, and adhesive bonding all interact with the acrylate surface chemistry. The following application zones are separated by these boundaries; where published data for M3 X in a specific configuration is limited, the limitation is stated rather than interpolated from unrelated resins.
Snap-fit enclosures printed from M3 X require the outer fibre strain in the flexing beam to remain below the tensile elongation at break of the material. Published tensile data for this class of unfilled acrylate photopolymer place elongation at break below 10 %; the specific data sheet for the batch must be consulted for exact values. A tapered cantilever snap arm with a length-to-thickness ratio of 5:1 is therefore limited to an undercut depth of approximately 0.3 mm to 0.5 mm when the permissible strain is set at 50 % of the elongation at break. Parts are built with the snap arm in the x-y plane because z-axis tensile strength and elongation are lower than x-y values in the layerwise build process. After support wax removal, the components are conditioned at 23 °C and 50 % RH for 48 h in accordance with ISO 291 before flexural evaluation. Compliance is demonstrated with ASTM D638-14 Type IV tensile bars and ASTM D790-17 flexural bars printed in the same build orientation. Terminal parts include battery cover latches, handheld device bezels, and enclosure prototypes used for fit-and-function verification, not for production service.
For RTV silicone tooling, M3 X master patterns are used to fabricate negative RTV silicone tools for vacuum-cast polyurethane prototypes. The dominant process failure is cure inhibition at the pattern–silicone interface: residual acrylate constituents can poison platinum-catalysed addition-cure systems. The master pattern is therefore sealed with an acrylic lacquer or polyvinyl alcohol barrier and dried for 24 h at 25 °C before mould construction. If inhibition cannot be tolerated, a condensation-cure RTV mixed at 100:3 wt% catalyst may be substituted, although tool life and dimensional repeatability will differ. After sealing, the master is mounted in a frame, coated with release agent, and the degassed RTV is poured under vacuum at −1 bar for 10 min. Silicone Shore A hardness is selected between 20 Shore A and 40 Shore A for high draft geometries or between 50 Shore A and 60 Shore A for high-wear tool surfaces, tested by ASTM D2240-15. Terminal cast polyurethane parts are evaluated by ISO 604:2002 compression and Shore hardness methods. If medical or food-contact end uses arise, separate ISO 10993 or FDA 21 CFR compliance verification is required; the M3 X master itself is not certified for those regulated outputs.
Because elastic recovery after repeated probe contact is the limiting criterion, fixture bodies for coordinate-measuring machine qualification are printed directly as near-net geometries. M3 X fixtures are qualified on the specific CMM using ISO 10360-2 repeatability runs, with touch-probe force held at or below 5 N and contact tip diameter not less than 1 mm to avoid localised creep at the contact point. Published data for long-term drift in high-humidity metrology rooms is limited, so fixtures are conditioned and used in climate-controlled space at 20 °C and 50 % RH. Print process parameters follow the standard 32 µm layer thickness, and the fixture is post-processed by wax removal and solvent-free drying. Terminal uses include go/no-go gauges, assembly nests, and low-cycle pick-and-place jaws.
In automotive interior trim development, instrument cluster bezels and seat switch covers are printed with M3 X only when ambient test conditions do not exceed 60 °C. The white surface accepts a two-component polyurethane primer and topcoat system after light sanding; paint adhesion is qualified by ISO 2409:2013 cross-cut testing on plaques printed at the same build angle as the part. Mounting bosses are designed with minimum wall thickness of 1.5 mm; where self-tapping screws are used, boss outer diameter is set at 2.5 to 3.0 times the screw nominal diameter to control hoop stress. Terminal parts are design verification and ergonomic evaluation units, not UV weathering-qualified components, because unfilled acrylate photopolymers yellow under extended UV exposure unless protected by a UV-blocking clearcoat. Published accelerated weathering data for M3 X in exterior automotive cycles is limited.
Pneumatic test manifolds printed from M3 X operate within the material’s published heat deflection temperature at 0.45 MPa, which is approximately 80 °C to 90 °C. Continuous wall temperature is nevertheless maintained below 60 °C because retained build stress and absorbed humidity from compressed air reduce creep resistance. Wall sections are specified at a minimum 2 mm, internal passage radii are no smaller than 3 mm, and bosses are reinforced to reduce crack initiation under low-cycle pressure pulses. Leak tests are performed at 0.5 bar to 1.5 bar gauge after a 24 h seasoning period at laboratory conditions. Chemical compatibility with lubricants and cleaning solvents is verified by immersion per ASTM D543-21. Terminal products are prototype air logic blocks, sensor mounting manifolds, and leakage test fixtures; no ASME BPVC or PED classification is conferred by the material alone.
When M3 X panels must be joined to polycarbonate or aluminium frames, structural acrylic adhesives with 10:1 catalyst proportion are used. Lap shear specimens are prepared and tested per ASTM D1002-10 for aluminium adherends and per ASTM D3163-01 for polymer adherends; observed joint strength is dominated by surface preparation. Abrasion with 240-grit aluminium oxide paper and wiping with 99 % isopropyl alcohol removes residual wax support and allows a stable bondline. Ultrasonic or heat-stake insertion of brass inserts is not recommended above 80 °C because local heating can exceed the HDT of the polymer; cold-press inserts or adhesive-bonded inserts are used instead. Minimum boss wall thickness for inserts is 2.0 mm, with insert spacing not less than 2.5 insert diameters to reduce stress concentration. Terminal components include bonded instrumentation enclosures and panel-mount control housings; peel or creep testing before production is mandatory because published adhesive durability data on this specific photopolymer is limited.
Competitive 3D Systems VisiJet M3 X prices that fit your budget—flexible terms and customized quotes for every order.
For samples, pricing, or more information, please contact us at +8618136850665 or mail to admin@ascent-chem.com.
We will respond to you as soon as possible.
Tel: +8618136850665
Email: admin@ascent-chem.com
Flexible payment, competitive price, premium service - Inquire now!
The 3D Systems VisiJet M3-X is a UV-curable acrylate photopolymer supplied for the ProJet MJP 3600 series multi-jet printing platforms. The material is dispensed from sealed linear cartridges and jetted through piezo-electric printheads with planar deposition of a wax-based support, designated VisiJet S300. Two layer-thickness modes are available: 16 µm ultra-high-definition and 32 µm high-definition, allowing a trade-off between vertical resolution and build speed. The cured polymer is opaque black, with typical mechanical values reported by 3D Systems of 49 MPa tensile strength, 2160 MPa tensile modulus, 20% elongation at break, 65 MPa flexural strength, 2160 MPa flexural modulus, and 50 J/m notched Izod impact. These values are produced under ASTM test methods and are relevant only for fully cured specimens conditioned in the X-Y plane; orientation-dependent properties in the Z direction require separate validation before use in load-bearing designs.
Printer-side material handling is closed-loop; the ProJet MJP 3600 series reads cartridge RFID data to prevent mixing with other VisiJet grades. Printhead temperature, jetting voltage, and platen leveling are managed by the system firmware and are not adjusted through the operator interface. This closed-loop control reduces batch-to-batch variation in jetted drop volume, but it does not eliminate the need for periodic printer calibration and printed tensile-bar verification. The M3-X cartridge should be stored in sealed conditions away from ultraviolet light and within the manufacturer’s specified temperature range. Uncured resin left on machine surfaces should be cleaned with a lint-free wiper and the cleaning solution named in the current safety data sheet.
When the build is created at 16 µm ultra-high-definition, vertical sidewall stepping is reduced relative to the 32 µm high-definition mode, but the finer layer pitch increases the number of passes and may extend total exposure duration for the same part height. The 16 µm mode is therefore specified for small gear housings, connector latches, and optical alignment features where interlayer seams must be minimized. The 32 µm mode is specified for larger enclosures and preliminary fit-check parts where speed takes precedence over sidewall finish. Both modes use the same VisiJet S300 support interface; however, the finer mode can create thinner wax-filled gaps that require longer ultrasonic cleaning dwell if blind pockets are present.
Direct numerical comparison of VisiJet M3-X with the clear VisiJet M3 Crystal and the investment-casting VisiJet M3 CAST is limited in the public datasheet set. The M3-X is formulated as an opaque black, higher-impact engineering photopolymer. The presence of high elongation at break (20% per ASTM D638) distinguishes it from the stiff clear grade, which is selected for optical prototype enclosures and flow visualization. The cast-pattern grade is intended for burnout in investment casting shell systems and is not specified for functional load-bearing retention. Published Izod impact, flexural modulus, and heat deflection values for the M3-X are the primary engineering selection criteria, whereas the M3 CAST datasheet emphasizes ash content and burnout characteristics, and the M3 Crystal datasheet emphasizes light transmission and clarity. The M3-X is therefore specified when snap-fit assembly clips, housing bosses, and impact-loaded enclosures must survive repeated engagement without fracture; validation should nonetheless be conducted on printed specimens because process orientation and post-print conditioning affect final values.
During material substitution studies, the primary engineering distinction is not the printer platform but the support chemistry and the mechanical behavior of the cured network. M3-X uses a wax-based support that releases from the part by melting at approximately 60 °C; this is distinct from water-soluble supports used in filament deposition and from solvent-dissolved supports used in some LED photopolymer systems. The melt-away support enables nested assemblies and thin internal ribs without manual breakout forces, but the cleaning step can impose minimum channel access restrictions. Published maximum channel aspect ratios for M3-X are not specified; parts must be evaluated on a per-geometry basis.
Typical tensile values reported by 3D Systems are generated according to ASTM D638 using Type I specimens, flexural properties according to ASTM D790, notched Izod impact according to ASTM D256, Shore D hardness according to ASTM D2240, and heat deflection temperature according to ASTM D648. The values listed below are typical data, not design minimums. Batch-to-batch variation, build orientation, and ambient moisture uptake can shift the measured values, particularly in the Z direction. Users creating safety-critical or dimensionally loaded components should generate statistical design allowables from production-representative builds rather than relying on single-point datasheet values.
| Property | Test method | Typical value |
|---|---|---|
| Tensile strength | ASTM D638 | 49 MPa |
| Tensile modulus | ASTM D638 | 2160 MPa |
| Elongation at break | ASTM D638 | 20% |
| Flexural strength | ASTM D790 | 65 MPa |
| Flexural modulus | ASTM D790 | 2160 MPa |
| Notched Izod impact | ASTM D256 | 50 J/m |
| Shore D hardness | ASTM D2240 | 82 |
| Heat deflection temperature at 0.45 MPa | ASTM D648 | 88 °C |
| Heat deflection temperature at 1.82 MPa | ASTM D648 | 64 °C |
These values are published by 3D Systems for X-Y oriented specimens in the high-definition printing mode. The manufacturer’s datasheet does not currently provide separate Z-direction tensile or flexural values for the M3-X; therefore, published data for this specific configuration is limited. The acrylate photopolymer network does not exhibit semicrystalline melting or re-melting behavior; machined surfaces may generate powder rather than melting chips, and thermoplastic welding or heat staking is not directly interchangeable with ABS. The material must be qualified for any heat-stake or ultrasonic-welding operation using printed bosses, and published data for ultrasonic welding of M3-X is limited.
Orientation on the build platform affects measured mechanical response and support consumption. Parts built with large flat surfaces parallel to the platen accumulate support contact on the lower face; removing that support leaves a matte finish and can alter the local thickness by a few tens of micrometres. The published tensile and flexural values assume X-Y oriented coupons with minimal Z-direction interfaces. Build planning should place critical snap-fit beams in the X-Y plane rather than across Z-laminated cross sections. Published Z-direction impact and elongation data for M3-X is limited; users should not assume isotropic behavior.
For short-run assembly fixtures produced in a ProJet MJP 3600 with a build envelope of 298 mm × 183 mm × 203 mm, the M3-X material is used where dimensional accuracy must be maintained after repeated part insertion and removal. The heat deflection temperature of 88 °C at 0.45 MPa permits limited thermal exposure in paint-bake cycles up to that threshold, but the 64 °C value at 1.82 MPa indicates that load-bearing fixtures should not be exposed to higher temperatures without creep testing. The material is jetted with support wax rather than a liquid resin vat, so hollow internal channels and complex assemblies can be built without trapped liquid resin; however, wax removal from small-diameter internal passages requires validation with the final geometry.
In under-hood prototype environments where peak soak temperatures approach 80 °C but mechanical load remains below 0.45 MPa, the published heat deflection temperature of 88 °C provides only a first-order screening metric. The deflection temperature at 1.82 MPa is 64 °C, which means that any loaded bracket, clamp, or housing boss experiencing sustained flexural stress at or above that temperature is outside the published datasheet boundary. Creep, stress relaxation, and dimensional recovery under cyclic heating are not specified in the public datasheet, and published data for long-term thermal cycling of VisiJet M3-X is limited. For applications where the part is expected to sustain internal thread-forming screws or press-fit bushings, the notched Izod impact value of 50 J/m is less predictive than direct pull-out and thread-torque testing using the printed hole geometry. The material should not be used as a direct substitute for thermally aged glass-filled nylon or polycarbonate without comparative testing against the relevant automotive specification, such as a heat-soak acceptance test.
Support removal for M3-X parts begins with a heated wax-melt cycle in a ProJet Finisher or equivalent temperature-controlled oven operating near 60 °C. The VisiJet S300 support becomes mobile at this stage and drains from open surfaces and accessible cavities. The oven set point remains below the 64 °C deflection temperature at 1.82 MPa, but heavy unsupported overhangs may still sag under their own weight during the melt cycle. A second-stage ultrasonic cleaning bath using the manufacturer-recommended mineral oil or aqueous detergent removes residual wax from recessed features. Solvent-based support removal used for stereolithography is not required and may introduce surface pitting or uncontrolled polymer swelling. After cleaning, parts are air-dried and may be sanded, machined, or coated; any solvent wipe should be qualified on a non-functional surface because published chemical compatibility data under continuous immersion is limited. For blind cavities, no published minimum channel dimension is available for M3-X, and geometry-specific validation is required.
After support removal, machining operations such as drilling, tapping, and reaming are permitted on M3-X with standard carbide tooling at low spindle speeds to limit localized heating. The material is not a thermoplastic, so chips do not re-melt; they are generated as fine powder and should be controlled with local extraction. When thread-forming screws are inserted into printed holes, the engagement length should be increased by at least 1.5× compared with typical ABS molded inserts unless direct pull-out testing supports a shorter engagement. This approach reduces the risk of radial cracking at hole edges.
Moisture uptake data for M3-X under immersion or high-humidity storage is not included in the public datasheet; printed parts should be dried and measured after conditioning at 23 °C before precision metrology. For applications in humid environments, dimensional stability should be verified separately because photopolymer networks can exhibit slight water absorption that may influence thin-wall flatness.
Continuous immersion of M3-X in brake fluid, cutting oils, or strongly alkaline cleaning agents has not been fully characterized in the public datasheet. Published chemical compatibility data for these environments is limited. The material is supplied as an industrial photopolymer; uncured or partially cured surfaces should be handled with nitrile gloves and safety glasses as recommended in the manufacturer’s SDS. The cartridges are for machine use only and are not designed for manual dispensing. Compliance claims for REACH and RoHS should be verified against the current SDS and product bulletin before export or production deployment.
