| HS Code | 164760 |
| Product Name | 3D Systems VisiJet M3 Crystal |
| Manufacturer | 3D Systems |
| Material Type | Photopolymer Resin |
| Printing Technology | MultiJet Printing (MJP) |
| Compatible Printer Series | ProJet 3500 |
| Color | Clear/Translucent |
| Biocompatibility | USP Class VI |
| Curing Method | UV Light |
| Tensile Strength | 52 MPa |
| Elongation At Break | 6.5% |
| Flexural Modulus | 2200 MPa |
| Hardness | 80 Shore D |
| Density | 1.12 g/cm³ |
| Heat Deflection Temperature | 55°C |
| Water Absorption | 0.4% |
As an accredited 3D Systems VisiJet M3 Crystal factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.
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In microfluidic lab-on-chip development, the material is jetted at 32 µm layer pitch on a ProJet MJP 2500/3600-class MultiJet platform with 600 × 600 dpi native resolution. The feedstock is supplied as a 100 wt% solids acrylic photopolymer with 0 wt% reactive diluent; any external solvent addition is outside the manufacturer’s validated process window. For enclosed channel build jobs, model-to-support material volume fraction typically ranges from 1:0.8 to 1:1.5, depending on channel cross-sectional aspect ratio and ceiling architecture. Support removal uses a wax-removal oven at the material-specific melting setting, followed by an ultrasonic isopropyl alcohol bath at 35–40 kHz and forced-air drying at 25–30 °C. The terminal output is a transparent fluidic manifold, droplet generator, or mixer prototype for diagnostic instrument development. Compliance for chip prototypes intended for diagnostic instrument integration is limited to quality system controls under ISO 13485:2016 at the device manufacturer level; the cured polymer has not been validated to ISO 10993-1:2018 biological endpoints and shall not be used as a blood-contacting or tissue-contacting device surface. Chemical compatibility with organic solvents and strong alkalis should be verified through ASTM D543-20 immersion testing before deployment.
For optical light pipe and collimating lens pre-production geometries, the printed surface must be moved from an as-printed layer topography to a transparent facet finish before photometric evaluation. The cured material is machined through wet sanding with grit sequence 800 grit to 3000 grit, removing 0.10–0.25 mm per optical face; this removal depth exceeds the peak-to-valley layer texture and is the dominant control for total internal reflection loss at a 30°–60° entrance cone. Luminous transmittance and haze are measured according to ASTM D1003-21, with reference plaques conditioned under ISO 291:2008 at 23 °C and 50% RH. The formulation remains 100 wt% solids with 0 wt% added colorant; tinting for wavelength filtering is not part of the validated processing envelope. Downstream production places the printed optic into a low-temperature protective hard-coat cycle only if the coating supplier verifies that the bake schedule stays below the heat deflection threshold measured under ASTM D648-18. End-use forms include LED collimator test lenses, sensor windows, and light guide prototypes for illumination modules.
When a rigid transparent master is used for low-volume silicone tooling, the limiting variable is not the photopolymer’s dimensional stability but the surface roughness after support removal and the silicone’s tendency to replicate layer artifacts. Master preparation includes support-contact area sanding with 1200 grit, followed by a fill-coat application of a silicone-compatible sealant selected by the pattern maker. The feedstock is printed at 100 wt% solids with 0 wt% added filler; any filler loaded into an RTV tooling silicone is governed by the silicone vendor’s cured Shore A target measured under ISO 868, not by the master chemistry. A typical platinum-cure RTV addition ratio of 10:1 by mass Part A to Part B is used, with a degassing step at −0.08 MPa to −0.09 MPa gauge before pouring around the master. Dimensional inspection follows ISO 1101 geometric product specification; the tooling room’s owner typically operates the master-preparation workflow under ISO 9001:2015 process controls. The resulting mold then supports 40–60 polyurethane casting cycles before re-polishing is required, depending on part extraction angle and draft. Terminal products include transparent polyurethane demonstration lenses, low-volume rigid enclosures, and casting pattern families for downstream silicone production.
| Application | Process-relevant standard | Critical measured parameter | Boundary condition |
|---|---|---|---|
| Microfluidic lab-on-chip prototypes | ISO 13485:2016; ASTM D543-20 | Channel wall thickness; model-to-support volume fraction | No ISO 10993-1:2018 biological endpoint validation |
| Optical light pipe prototypes | ASTM D1003-21; ASTM D648-18 | Polishing removal depth; haze | Thermal exposure above heat deflection threshold avoided during coating cure |
| Silicone tooling masters | ISO 868; ISO 1101 | Shore A after cure; surface roughness | Master re-polishing after 40–60 casting cycles |
Transparent electronics enclosure prototypes built from this material are evaluated for thermal cycling between 25 °C and 55 °C at 85% RH, with dwell times not exceeding 2 h per cycle, because the polymer’s heat deflection behavior under ASTM D648-18 and absorbed moisture may produce stress crazing near press-fit inserts. The material is not supplied as a formulation base; it is jetted as a 100 wt% solids system with 0 wt% flame-retardant filler, and UL 94 classification is therefore not assigned to the cured stock unless overmolded or coated by the downstream manufacturer. Downstream processing includes MJP support removal, hand polishing, and insertion of threaded brass heat-stake inserts with an ultrasonic welder; minimum wall thickness around the insert is maintained at 1.5 mm to 2.0 mm. Electronic enclosure standards under IEC 60068-2-14 provide the thermal shock test methodology. The transparency build is suited for light guide plates, switch activation test fixtures, and enclosures for short-run wearable electronics evaluation.
Surgical planning models and external anatomical visualization aids are printed from segmented CT or MRI DICOM data. The material is used as a 100 wt% solids photopolymer with 0 wt% reprocessed resin; closed-loop batch tracking is maintained because reuse of uncured residue from a previous build is not validated under the manufacturer’s workflow. The downstream process consists of DICOM segmentation, tessellated STL repair, MJP at 32 µm layer pitch, wax-support removal, and optional silicone rubber overpainting for soft-tissue contrast. The terminal output is a non-implantable anatomical reference model or training aid. Compliance for the finished model is limited to the hospital or device firm’s own ISO 13485:2016 design control file; the photopolymer itself carries no ISO 10993-1:2018 certification and must not be sterilized by autoclave or immersed in high-level disinfectants that exceed the material’s chemical compatibility envelope.
Packaging development groups use the material for bottle shoulder, cap, and closure thread prototypes when a transparent rigid part is needed for fit testing under retail spectral power distributions. The resin is processed as 100 wt% solids with 0 wt% recycled-content additive; any attempt to blend with regrind is outside the supplied material specification. Downstream production includes MJP support removal, flame or vapor polishing, and optional alcohol-based surface tinting for quick colorway reviews. Terminal products are transparent cosmetic closure prototypes, fragrance cap fit fixtures, and preprint bottle-neck thread masters. Compliance for skin-contact formulation compatibility is determined only by the brand owner’s packaging safety assessment under EC 1223/2009 or FDA 21 CFR packaging requirements; the cured photopolymer is not a primary food-contact material and should be considered an external fit-and-form prototype unless migration testing is performed.
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3D Systems VisiJet M3 Crystal is a UV-curable acrylic photopolymer qualified for the ProJet MJP 2500 and ProJet MJP 3600 MultiJet Printing platforms. The feedstock is supplied as a liquid resin in sealed cartridges, jetted through piezoelectric multi-nozzle arrays, and cured by in-line UV lamps as successive layers are deposited. Because the process uses photopolymerization rather than melt extrusion or powder sintering, tensile and flexural values are not directly comparable to extruded thermoplastics such as ABS or polycarbonate. Typical producer-published mechanical values include a tensile strength of 42 MPa tested to ASTM D638-14, flexural modulus of 1320 MPa tested to ASTM D790-17, and heat deflection temperature of 45°C at 0.45 MPa tested to ASTM D648.
The material is transparent to translucent in thin sections and is used for flow-visualization components, light-pipe prototypes, transparent covers, and anatomical models. It is not a castable resin, nor is it classified as a biocompatible material for long-term body contact. Table 1 summarizes typical cured values reported by the producer; values are specimen-dependent and vary with part orientation, layer thickness, support-removal time, and lamp condition.
| Property | Test Method | Typical Producer-Published Value |
|---|---|---|
| Tensile strength | ASTM D638-14 | 42 MPa |
| Tensile modulus | ASTM D638-14 | 1460 MPa |
| Elongation at break | ASTM D638-14 | 6.5% |
| Flexural strength | ASTM D790-17 | 49 MPa |
| Flexural modulus | ASTM D790-17 | 1320 MPa |
| Heat deflection temperature | ASTM D648 at 0.45 MPa | 45°C |
| Notched Izod impact | ASTM D256 | 18 J/m |
| Hardness | ASTM D2240 | Shore D 84 |
On the ProJet MJP 2500 and ProJet MJP 3600 platforms, the resin is jetted in parallel with a wax-based support material. The build chamber is maintained at a closed-loop temperature that keeps the resin within its jetting viscosity range, and layer thickness is set through the printer’s job preparation software. Process trade-offs are immediate: finer layer heights reduce sidewall stair-step and improve channel clarity, but they increase build time and may shift bulk mechanical response because UV dose per layer is altered. When the layer height is reduced without a corresponding adjustment in exposure, the degree of conversion at the interlayer boundary can change, producing parts with different Z-direction tensile elongation than the XY-plane datasheet values.
Viscosity is held within the piezo head’s jetting range by the printer, not by external drying. The MJP process can produce multiple materials in one build through separate cartridges, but M3 Crystal is paired with a wax-based support that is melted away. If the support is removed at a temperature above the resin’s heat deflection threshold, thin cross-sections deform. This conflict defines the post-processing window: support wax melt point must be reached while keeping the part below its heat deflection threshold. The manufacturer’s default cycles are balanced for typical geometries; thick sections tolerate slightly longer times, but thin walls under 1 mm require reduced bath temperature or more frequent wax-drain intervals.
The controlling rheological parameter is dynamic viscosity, not melt index. The resin remains liquid in the cartridge and is crosslinked by free-radical photopolymerization after jetting. Aged UV lamps or partially clogged nozzles reduce delivered energy and can produce tacky surfaces due to oxygen inhibition. Operators should monitor lamp life and nozzle health according to the manufacturer’s maintenance schedule; production runs on machines with degraded lamps have shown increased post-build residual monomer at the surface, although batch-to-batch quantitative data for this specific configuration is limited.
Material lot viscosity is controlled by the supplier. In humid production environments, condensation on cold build plates can cause first-layer adhesion failures. The closed chamber reduces, but does not eliminate, ambient moisture effects. The published process window is not a free-standing parameter set; it is defined by the printer’s cartridge temperature controls and the jetted support material pairing. Unsupported manual adjustment of resin heating outside the machine’s service limits can cause jetting instability or premature thermal crosslinking in the cartridge.
Support removal is thermal, not solvent-based. Wax support material is melted from the part in a heated ultrasonic bath or oven using the printer manufacturer’s recommended cycle. Critical process boundaries are bath temperature and immersion duration: elevated temperature removes wax faster but can swell or warp thin acrylic sections. Parts with enclosed cavities and channels whose hydraulic diameter is below 2–3 mm may retain residual wax even after extended cycles because flow velocity in the bath is insufficient to extract higher-viscosity melt from blind recesses.
Solvent compatibility is narrow. Acetone and chlorinated solvents attack the cured acrylate network and produce crazing, edge loss, and a reduction in transparency. Isopropyl alcohol is suitable for brief surface cleaning, but prolonged immersion degrades surface polish and can cause microcracking around sharp corners. Amine-based solvents or hardeners should also be avoided because they can induce surface whitening and network degradation. Aqueous alkaline solutions above mild pH are not recommended unless the manufacturer has published compatibility data. No post-cure thermal cycle is required to reach the stated mechanical values, but some users apply a clearcoat to retard moisture uptake and UV yellowing; long-term accelerated weathering data for clear-coated M3 Crystal are not available in the producer’s standard datasheet.
The as-printed surface has measurable layer topography. Transparent optical appearance requires abrasive wet sanding with graded silicon carbide papers, followed by a fine acrylic polishing compound. Flame polishing is not recommended because localized thermal exposure above the heat deflection temperature causes distortion and surface pitting.
The resin is not a cast acrylic or polycarbonate. In its as-printed state, the part is translucent because surface layer lines scatter light. Polished parts approach the clarity of acrylic, with a refractive index near 1.49, suitable for flow-visualization and non-critical light-guide prototypes. Birefringence and internal stresses from differential cure remain higher than moulded acrylic sheet, so the grade is not a substitute for precision optical components. Parts printed in the Z direction can show index variations at interlayer boundaries; laminar light guides should be oriented so that light propagates within the XY plane where possible.
Continuous exposure to ultraviolet light causes a yellow shift over time, as with many acrylics, but the producer does not publish a formal UV-aging performance specification for this grade. Applications exposed to direct sunlight or high-intensity UV lamps should be validated independently using the end-use spectrum. Thin-walled sections below 1 mm are more susceptible to light-induced embrittlement because the entire cross-section is affected by surface oxidation.
VisiJet M3 Crystal occupies a specific position between the higher-heat opaque M3 X and the burnout-formulated M3 Cast. M3 X is selected for functional enclosures and snap-fit assemblies where higher heat deflection and greater elongation are required; M3 Crystal is selected where transparency and moderate strength dominate. M3 Cast is designed for investment casting patterns and burns out with lower residual ash; M3 Crystal should not be substituted into lost-wax workflows because its ash content can contaminate the ceramic mould shell and gas evolution during burnout can cause cracks.
In testing to ASTM D638-14, M3 Crystal shows a lower elongation at break than M3 X, which confirms that M3 Crystal is more rigid and less tolerant of snap-fit deflection. The heat deflection temperature under ASTM D648 at 0.45 MPa places M3 Crystal below the continuous service temperature of many hot-water or under-hood environments. For fluid-handling prototypes, use is limited to ambient or slightly elevated temperature loops; steam autoclave cycles are outside the operating envelope because the autoclave temperature exceeds the HDT by more than 70°C and will cause gross deformation.
Although tensile strength is comparable to some ABS grades, the heat deflection temperature of 45°C at 0.45 MPa is below typical ABS injection-moulding grades when compared under equivalent stress. Thus M3 Crystal is not a drop-in thermal replacement for ABS. Direct comparison requires the same applied stress; the producer datasheet lists a lower HDT value at 1.82 MPa, and this lower value is more relevant for load-bearing service.
| Requirement or Method | Scope | Typical Status for VisiJet M3 Crystal |
|---|---|---|
| ASTM D638-14 | Tensile properties | Producer datasheet method |
| ASTM D790-17 | Flexural properties | Producer datasheet method |
| ASTM D648 | Heat deflection temperature | 0.45 MPa and 1.82 MPa values |
| ASTM D256 | Notched Izod impact | Producer datasheet method |
| REACH (EC 1907/2006) | Chemical inventory | Supplier safety data sheet |
| RoHS 2011/65/EU | Restricted substances | Supplier regulatory statement |
| FDA 21 CFR 177 | Food contact | Not certified without additional validation |
| ISO 10993-1 | Biocompatibility | Not classified for long-term body contact |
Production-scale observation on MJP equipment indicates that the largest source of field scrap in clear M3 Crystal parts is wax residue in internal channels. The second most common failure mode is surface crazing after exposure to solvent-based lubricants used in assembly. Because the material is an acrylic network, assembly with ester-based grease or aggressive threadlockers can cause localized stress cracking; compatibility of assembly chemicals should be tested on sacrificial samples. For bonded assemblies, cyanoacrylate adhesives provide moderate adhesion, while some moisture-added formulations may fog the surface. In all cases, part validation should include dimensional inspection after support removal and after any polishing step, because polishing removes material and alters thin walls.