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3D Systems Fused Deposition Modeling Material PC/ABS

    • Product Name: 3D Systems Fused Deposition Modeling Material PC/ABS
    • Factroy Site: Yudu County, Ganzhou, Jiangxi, China
    • Price Inquiry: admin@ascent-chem.com
    • Manufacturer: Ascent Petrochem Holdings Co., Limited
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    Specifications
    HS Code 105972
    Material PC/ABS
    Tensile Strength 34 MPa
    Tensile Modulus 2100 MPa
    Elongation At Break 5.5%
    Flexural Strength 60 MPa
    Flexural Modulus 2300 MPa
    Notched Izod Impact Strength 267 J/m
    Heat Deflection Temperature At 0 45 Mpa 110 °C
    Heat Deflection Temperature At 1 82 Mpa 96 °C
    Vicat Softening Temperature 113 °C
    Specific Gravity 1.10
    Density 1.10 g/cm³
    Rockwell Hardness R110
    Coefficient Of Thermal Expansion 8.0 × 10⁻⁵ in/in/°F
    Thermal Conductivity 0.17 W/m·K
    Flammability UL 94 HB

    As an accredited 3D Systems Fused Deposition Modeling Material PC/ABS factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.

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    Application of 3D Systems Fused Deposition Modeling Material PC/ABS

    For passenger cabin interior components, printed PC/ABS must satisfy flame spread and fogging requirements before any mechanical property assessment is considered. The blend exhibits a polycarbonate-continuous morphology; ABS domains are dispersed throughout the matrix and lower melt viscosity during filament extrusion and FDM deposition. The exact PC:ABS weight ratio is not disclosed in the supplier datasheet, but the ABS phase loading is sufficient to reduce melt viscosity relative to neat polycarbonate at identical shear rates. Filament compounding for this material class is typically performed on a twin-screw extruder with an L/D ratio between 40:1 and 48:1, followed by pelletizing and single-screw filament extrusion. Prior to printing, the filament is dried at 80 °C for a minimum of 4 h to a moisture content below 0.02 wt%; storage above 60 % RH leads to polycarbonate hydrolysis and microvoid formation. For instrument panel carrier brackets and HVAC duct adapters, the FDM system is set to an extruder temperature of 268–278 °C, bed temperature of 108 °C, chamber temperature of 85 °C, layer height of 0.18 mm, and rectilinear infill of 99 %. Flame spread is tested according to ISO 3795 or FMVSS No. 302; interior trim sections must not exceed a horizontal burn rate of 100 mm/min. Heat deflection temperature under a flexural stress of 0.45 MPa is evaluated by ISO 75-2:2013 method B; a threshold above 100 °C is required for most instrument panel carrier prototypes. Fogging and volatile organic compound release are screened by VDA 278 thermal desorption analysis. Post-annealing at 105 °C for 120 min reduces residual styrenic monomer and moisture, but chamber temperatures below 75 °C during printing produce interlayer delamination. Corner lifting exceeding 0.8 mm across a 150 mm span is a common failure mode when heated bed adhesion is insufficient. Terminal parts are low-volume instrument panel carrier brackets, gauge cluster retaining clips, and HVAC duct adapters.

    What Limits Transverse Layer Adhesion in Thin-Wall Electronics Enclosures Printed from PC/ABS?

    In thin-wall consumer electronics enclosure prototyping, layer adhesion is the controlling property before surface finish or dimensional output is evaluated. Thin-wall enclosures are printed at 0.16 mm layer height with extruder temperature between 262 °C and 272 °C. Wall thickness is constrained between 1.5 mm and 2.5 mm to allow snap-fit features and internal bosses to fill without short shots. The ABS domains interrupt crack propagation and improve toughness, while the polycarbonate continuous phase supplies heat resistance. Transverse tensile strength values for this specific filament are not fully published; generic PC/ABS FDM materials typically exhibit a Z-to-XY strength ratio in the range of 0.4–0.6. Compliance for information technology equipment enclosures is evaluated under IEC 62368-1; creepage and clearance distances depend on working voltage, pollution degree, and material group. Unfilled PC/ABS grades generally fail to achieve UL 94 V-0 unless a flame-retardant additive package is present, so the base 3D Systems PC/ABS material should not be specified for production enclosures without supplier documentation. RoHS compliance is supported by RoHS 2011/65/EU and REACH registration under REACH Regulation (EC) No 1907/2006. Solvent vapour smoothing with tetrahydrofuran or methyl ethyl ketone is not recommended because ketone and ester solvents attack the polycarbonate phase and induce environmental stress cracking. Mechanical post-processing with abrasive sanding and body filler is preferred for cosmetic surfaces. Terminal parts include laptop bottom covers, tablet test housings, and mobile device prototype frames.

    Compressive Cyclic Loading in Robotic End-of-Arm Tooling and Assembly Fixture Bodies

    Under cyclic compressive loads in robotic end-of-arm tooling, solid infill in load-bearing regions is mandatory. A production FDM system with a 0.4 mm hardened steel nozzle and a heated chamber at 80–90 °C produces acceptable interlayer welding when layer height is held at 0.20 mm and extruder temperature at 270–280 °C. Perimeter count is set to 4 and infill to 80 % at insert-bearing walls; threaded heat-set inserts fail by circumferential cracking when surrounding wall thickness is below 5 mm or when infill is below 60 %. Filament ovality above ±0.03 mm produces periodic under-extrusion bands in solid infill, a batch-to-batch variance observed on direct-drive FDM systems. The fixture body is evaluated for flexural modulus under ISO 178; typical PC/ABS FDM values fall between 2 000 MPa and 2 500 MPa, but published data for this specific configuration is limited. Dimensional stability during cycling is controlled by thermal expansion; PC/ABS exhibits a coefficient of linear thermal expansion between 70 µm/m·K and 90 µm/m·K, which must be compensated when locating features operate above 50 °C. Contact with amine-catalyzed epoxy adhesives should be avoided because amine species can degrade the ABS phase. Machining coolants based on aromatic hydrocarbons cause surface swelling and are not used after printing. Terminal parts include pick-and-place nests, alignment jigs, robotic gripper jaws, and ESD-safe assembly pallets; electrostatic discharge safety is achieved only with a conductive coating, not by the base resin.

    Application DomainGoverning Standard or Test MethodCritical ThresholdProcessing Boundary
    Automotive interior bracketISO 3795, FMVSS No. 302≤100 mm/min horizontal burnChamber ≥75 °C; anneal at 105 °C
    Electronics enclosureIEC 62368-1Creepage/clearance per working voltageWall 1.5–2.5 mm; no solvent vapour smoothing
    EOAT fixtureISO 1782 000–2 500 MPa flexural modulusWall ≥5 mm around inserts; infill ≥80 %
    Medical housingISO 10993-5Cytotoxicity limited published dataAvoid repeated 70 % IPA; corner radius ≥2 mm
    Prototype mold insertISO 2768-mGeneral tolerance classMelt ≤230 °C; injection pressure ≤60 MPa
    EVSE prototypeIEC 62196-2, UL 94Dielectric 3 500 V AC; V-0 not assumedInfill 90–100 %; avoid glycol-based coolants

    When Cold Sterilants and Alcohol Wipe Cycles Dictate Material Selection for Medical Device Housings

    Before a printed housing enters a medical device assembly line, cold sterilant exposure and alcohol wipe cycles must be evaluated. Medical device enclosures and laboratory instrument housings are printed with 0.20 mm layer height and 100 % solid fill to reduce internal porosity that can harbour cleaning residues. Extruder temperature is set to 268–275 °C; the build chamber is maintained at 85 °C to improve sidewall fusion. The printed parts are annealed at 105 °C for 2 h to reduce residual stress before exposure to disinfectants. The polycarbonate phase provides stiffness and heat resistance; the ABS phase contributes chemical resistance to weak acid solutions. Cold sterilants based on hydrogen peroxide or sodium hypochlorite at concentrations below 0.5 % are generally tolerated for short contact times, but repeated 70 % isopropyl alcohol wipe cycles may cause environmental stress cracking at sharp interior corners; radii below 2 mm should be avoided. Cytotoxicity testing per ISO 10993-5 and physicochemical evaluation per ISO 10993-18 are relevant only when the printed component is used in a patient-contacting medical device; published data for this specific 3D Systems PC/ABS filament under these standards is limited, and the material is not supplied with regulatory approval for prolonged skin contact or mucosal use. Compliance pathways must follow ISO 13485 quality management and, where applicable, EU MDR 2017/745 general safety requirements; the printed PC/ABS part is typically limited to external enclosure and non-patient-contacting hardware. Terminal parts include diagnostic instrument housings, laboratory pump brackets, and temporary tooling for medical tubing assembly.

    For short-run prototype injection molding, printed PC/ABS mold inserts are constrained by the thermal and pressure limits of the blend. The inserts are printed in the Z direction at 0.15 mm layer height with 100 % rectilinear infill and then sealed with a low-viscosity epoxy infiltration resin to close surface porosity. Extruder temperature is set to 265–275 °C, bed to 110 °C, and chamber to 85 °C; the printed insert is annealed at 105 °C for 2 h. The ABS domains reduce brittleness during insert machining but also lower the softening point relative to neat polycarbonate. The mold insert operates only with low-pressure injection processes using polyolefins at melt temperatures below 230 °C; injection pressures above 60 MPa cause insert deformation and cracking along layer interfaces. Average tool life ranges from 50 to 200 shots depending on gate design and ejection forces. Core pin holes and ejector channels are machined after printing; hole diameters below 2 mm are not recommended because PC/ABS layer edges crumble during drilling. The mold inserts are not governed by a specific regulatory standard, but dimensional verification follows ISO 2768-m for general tolerances. Cooling channels are omitted in this material because thermal conductivity is low relative to aluminium. Terminal parts include prototype polypropylene living-hinge molds, low-volume polypropylene caps and plugs, and silicone rubber compression tooling inserts.

    Verifying Dielectric Withstand and Creepage in EVSE Prototype Housings

    When evaluating electric vehicle supply equipment prototypes, the dielectric and flame boundaries must be treated as pass-fail criteria rather than secondary considerations. Electric vehicle supply equipment prototypes printed from PC/ABS require thicker sections and post-annealing due to dielectric and flame requirements. The housing is printed with 0.20 mm layer height, 4 perimeters, and 90–100 % infill; extruder temperature is 268–276 °C and chamber temperature 85 °C. The polycarbonate phase provides electrical insulation stability; the ABS phase lowers viscosity for thin bosses and snap-fit walls. Dielectric withstand is tested at 3 500 V AC for 60 s on production EVSE housings under IEC 62196-2; printed prototypes should be evaluated only as preliminary fit and form references because porosity and layer interfaces reduce partial discharge inception voltage. The base PC/ABS grade has a comparative tracking index typical of unfilled polycarbonate blends; supplier CTI documentation is required before classification under IEC 60112. Flame retardancy is a critical boundary: the unfilled 3D Systems PC/ABS material is not known to meet UL 94 V-0 or IEC 60695-11-10 unless stated by the supplier, so production EVSE housings must use a flame-retardant PC/ABS compound. The printed prototype can be used for connector latching verification, cable strain relief fitment, and wall box form studies. Exposure to polyalkylene glycol-based cooling fluids is not recommended because glycols plasticize the ABS phase. Terminal parts include EV charging connector housing prototypes, wall box form studies, and cable strain relief brackets.

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    Certification & Compliance
    More Introduction

    The 3D Systems Fused Deposition Modeling Material PC/ABS is a compounded polycarbonate/acrylonitrile butadiene styrene filament supplied for FDM-class additive manufacturing systems. Where specified under the original equipment manufacturer documentation, it is listed as a CubePro-series FDM consumable and is supplied in sealed desiccated packaging with a nominal spooled diameter listed in the machine-specific materials guide; compatible desktop FDM configurations typically use 1.75 mm filament. The material is positioned for functional prototypes, workholding fixtures, covers, and low-volume production components requiring higher heat tolerance than unfilled ABS but without the full nozzle-temperature requirements of unfilled polycarbonate. Representative density values for FDM-grade PC/ABS fall between 1.10 g/cm³ and 1.14 g/cm³ when measured under ASTM D792-20. Published vendor datasheets for this material class commonly report XY-orientation tensile strength values of 40–50 MPa under ASTM D638-14, flexural modulus values of 1.8–2.2 GPa under ASTM D790-17, and notched Izod impact values of 200–600 J/m under ASTM D256-10. Heat deflection temperature at 0.45 MPa is commonly reported in the 95–110°C range under ASTM D648-18. Z-direction tensile properties in fused deposition modeling are anisotropic and generally fall to 60–80% of the XY value because of limited polymer chain diffusion and residual intra-layer stress. The material is hygroscopic, and handling documentation for this product class specifies drying at 80–90°C for 4–8 h when ambient relative humidity exceeds 60%. Published data for this specific 3D Systems stock keeping unit are limited; numerical ranges stated here are drawn from the broader FDM-grade PC/ABS material class rather than a lot-specific certificate of analysis.

    What extrusion parameters prevent interlayer delamination in this material?

    The processing envelope is constrained at the lower temperature bound by ABS-phase viscosity and at the upper bound by polycarbonate thermal degradation. Direct-drive extruders with 0.4 mm brass or hardened steel nozzles typically require a setpoint of 260–280°C, with a heated bed maintained at 100–110°C. In systems fitted with a heated chamber, a chamber temperature of 45–60°C is recommended; in open-frame systems, edge lifting is suppressed by limiting part-cooling fan output to 0–30% after the first two layers. First-layer deposition is commonly specified at 0.2–0.3 mm layer thickness and 10–20 mm/s linear speed. Subsequent layers are deposited at 30–60 mm/s with layer heights of 0.1–0.3 mm. Retraction distances of 2–4 mm for direct-drive extruders and 4–6 mm for Bowden-style extruders reduce stringing; excessive retraction can draw air into the melt chamber and produce surface porosity. Melt flow rate is a useful incoming feedstock control. FDM-grade PC/ABS commonly exhibits an MVR of 8–20 cm³/10 min at 260°C and 5.0 kg load under ISO 1133-1:2022. Values above 20 cm³/10 min after drying indicate hydrolysis or excessive recycle content, while values below 5 cm³/10 min generate high extruder torque and inconsistent bead width. Spool-to-spool viscosity variation of ±10% can shift extruder current draw by 5–8% when no filament diameter compensation is active on production direct-drive equipment.

    Shear rate in a 0.4 mm nozzle at 40 mm/s and 0.2 mm layer height is on the order of 10²–10³ s⁻¹; PC/ABS under these conditions exhibits shear-thinning behavior, with apparent viscosity falling from roughly 10³ Pa·s at 1 s⁻¹ to 10² Pa·s at 100 s⁻¹ at 260°C. This shear-thinning response assists bead deposition but also makes melt pressure sensitive to grade-to-grade variations in the ABS phase. Extruder torque or melt pressure monitoring is recommended on production-line machines because a deviation of 0.05 mm in filament diameter can alter volumetric output by 6–8% when no closed-loop diameter compensation is present. A direct-drive extruder with a hardened steel drive gear and idler pressure set to 20–40 N is recommended; higher idler loads can deform softened filament during retraction cycles and create inconsistent feeding. Bowden systems, if used, require a larger retraction distance of 4–6 mm and a lower printing speed of 20–40 mm/s to reduce the lag between melt chamber pressure and drive gear motion.

    PropertyTest methodRepresentative FDM-grade PC/ABS range
    DensityASTM D792-201.10–1.14 g/cm³
    Tensile strength, XY orientationASTM D638-1440–50 MPa
    Tensile modulus, XY orientationASTM D638-142.0–2.3 GPa
    Flexural strengthASTM D790-1760–75 MPa
    Flexural modulusASTM D790-171.8–2.2 GPa
    Notched Izod impactASTM D256-10200–600 J/m
    Heat deflection temperature at 0.45 MPaASTM D648-1895–110°C
    Vicat softening temperatureASTM D1525-17e1110–125°C
    Elongation at breakASTM D638-145–30%
    Melt volume-flow rateISO 1133-1:20228–20 cm³/10 min at 260°C/5.0 kg

    These ranges are not lot-specific values for the 3D Systems product; they are compiled from published technical literature for FDM-grade PC/ABS. Vendor certificates of analysis should be used for acceptance testing.

    In comparison with unfilled ABS filament, PC/ABS raises the heat deflection temperature at 0.45 MPa by approximately 15–25°C and increases notched Izod impact energy by roughly 1.5–2.5× in typical XY-printed coupons. The blend retains the styrene-phase resistance to mild aqueous acids and aliphatic hydrocarbons, but the polycarbonate fraction is susceptible to alkaline hydrolysis and stress cracking in chlorinated solvents, esters, and ketones. Against unfilled polycarbonate filament, PC/ABS lowers the nozzle setpoint from the 270–300°C range to 260–280°C and reduces room-temperature warping at equivalent chamber conditions; however, it gives up some upper-end heat resistance and transparency. Against PLA, PC/ABS cannot be processed on unheated-bed equipment and requires pre-drying, but it provides roughly 2–3× the notched Izod impact energy and permits short-term exposure to 90°C without gross deformation under low load. These differences are material-class comparators and should be verified against the specific 3D Systems datasheet lot.

    Material classTypical HDT at 0.45 MPaTypical notched IzodTypical nozzle setpointMoisture sensitivity
    PC/ABS FDM grade95–110°C200–600 J/m260–280°CHigh; pre-dry
    ABS FDM grade85–95°C150–250 J/m230–250°CLow to moderate
    Polycarbonate FDM grade105–120°C600–800 J/m270–300°CHigh; pre-dry
    PLA FDM grade50–60°C20–50 J/m195–215°CModerate

    Test methods: HDT under ASTM D648-18; notched Izod under ASTM D256-10. Values are material-class representative figures and do not constitute a product certificate.

    Because the XY plane exhibits higher tensile elongation than the Z plane, build orientation must be assigned according to the principal stress vector. In FDM-grade PC/ABS, Z-direction tensile strength is commonly 60–80% of XY strength, and Z-direction notched Izod impact can fall below 50% of the XY value. This anisotropy is governed by raster gap, layer height, chamber temperature, and nozzle diameter. Higher chamber temperatures and lower print speeds increase the weld-line diffusion time and raise Z-strength toward the upper end of that band. Conversely, excessive part-cooling fan speed and large layer heights produce void networks at the layer boundary that act as crack-initiating stress concentrators. For load-bearing fixtures, the raster angle should be aligned with the principal tensile direction, and vertical holes or press-fit bosses should be evaluated with a safety factor of at least 2.0 against the Z-direction ultimate tensile strength. Test coupons for process qualification should be printed in the same orientation and with the same slicing parameters as production parts, because coupon-to-part variation in FDM can reach 10–20% when chamber conditions are not controlled.

    Dimensional accuracy in PC/ABS FDM parts is influenced by polymer shrinkage during crystallization and relaxation of orientation stresses. Linear shrinkage in the XY plane is commonly reported in the range of 0.5–0.8%, while Z-axis shrinkage can be half that value because layer height is controlled by the motion system rather than by bulk contraction. Hole diameters and distances between opposing features should be evaluated with a coordinate measuring machine because the first-layer squish and thermal contraction interact; typical open-loop desktop systems exhibit dimensional error of ±0.5% on features above 50 mm. On twin-screw compounded feedstock, colorant and impact-modifier masterbatch loadings can shift the melt viscosity and alter die swell at the nozzle, so dimensional bias must be re-established whenever the supplier changes the additive package. The use of a heated chamber reduces dimensional variability by maintaining a stable cooling rate, but closed-loop thermal control on open-frame FDM machines often allows the upper part of a tall build to cool below the glass transition temperature during deposition, causing compressive residual stress and possible mid-build delamination.

    Solvent stress cracking is a known failure mode in PC/ABS parts that see tightening torque or press-fit assembly. Contact with aliphatic hydrocarbons, dilute aqueous acids, and water-glycol mixtures is generally tolerated at room temperature, but the same part subjected to ketones, esters, aromatic hydrocarbons, or amines can fail at stress levels well below the short-term tensile strength. Service tests should reproduce both the chemical environment and the maximum assembly strain; a common acceptance criterion is no crazing or edge whitening after 24 h of immersion at the maximum service temperature. For components exposed to engine bay or industrial-cleaning agents, a chemical compatibility review against the Safety Data Sheet of the cleaner must be performed before deployment.

    When ambient relative humidity remains above 60% during storage

    Control of absorbed moisture is the largest single processing variable for FDM-grade PC/ABS. At 60% RH and 23°C, the filament can reach equilibrium moisture contents above 0.03 wt% within 24 h; above this threshold, polycarbonate hydrolysis during extrusion reduces molecular weight, increases MVR, and generates splay and interfacial voids. Drying at 80–90°C in a forced-air or desiccant dryer with a dew point below -40°C for 4–8 h is required before processing when ambient storage exceeds 60% RH. The dried spool should be transferred to the printer in a sealed dry box and exposed for no more than 1–2 h in an uncontrolled environment. Incoming moisture content can be measured by Karl Fischer titration or an infrared moisture balance; a moisture content above 0.04 wt% should trigger re-drying. On manufacturing lines, a rise in MVR from 8–10 cm³/10 min to 15–20 cm³/10 min under ISO 1133-1:2022 is a strong indication that hydrolytic degradation has already occurred. Do not use hot-air ovens with excessive temperature overshoot above 95°C, because prolonged exposure can soften the filament on the spool and cause interlayer adhesion failures. If the material must remain idle overnight in a humid environment, purge the melt chamber and store the spool in a desiccant-sealed container.

    Water absorbed by the PC phase does not behave as a simple surface contaminant; it participates in hydrolysis that reduces the number-average molecular weight of the polycarbonate repeat unit, increases the carbonyl index, and lowers the glass transition temperature of the hydrolyzed phase. At extrusion temperatures above 260°C, steam generation at the nozzle can produce a characteristic splay pattern that is often misdiagnosed as a retraction defect. If splay persists after drying at 80°C for 8 h, the filament lot should be evaluated for residual moisture by Karl Fischer titration and for MVR increase under ISO 1133-1:2022. An MVR above 20 cm³/10 min at 260°C/5.0 kg is not correctable by drying and indicates irreversible polycarbonate chain scission. Because hydrolysis damage cannot be reversed by moisture removal, spools exposed for extended periods may show reduced Z-direction tensile strength even after re-drying; published data on the degree of this loss in this specific configuration is limited. Inventory control should use first-in-first-out discipline, and sealed packaging with desiccant should not be opened until shortly before drying.

    Functional prototypes for automotive-style electrical enclosures, brackets, and exterior-adjacent covers are typical application spaces when the printed part is not subjected to sustained load at 90°C under continuous stress. The material has sufficient impact resistance for snap-fit tooling and low-volume assembly aids, but snap-fit deflection must be evaluated along the Z-axis, where layer-interface stress concentration can reduce strain-to-failure. Chemical compatibility should be checked for each service condition; prolonged contact with strong alkalis, aromatic hydrocarbons, esters, and chlorinated solvents is not recommended because the polycarbonate fraction can undergo stress cracking. The material is not validated for food-contact, medical, or long-term implant use under FDA or ISO 10993 pathways, and no flammability rating should be assumed for printed parts; typical FDM PC/ABS material-class plaques are rated UL 94 HB, while a V-0 listing requires a specific compounded feedstock and a certified part thickness. For tooling fixtures that contact production oils, compatibility tests should be conducted with the actual grease or cutting fluid, because additives in the fluid can migrate into the ABS phase and reduce ductility. Published data for this specific configuration in fluid-exposure conditions is limited.

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